CPC1006N

CPC1006N 60V, 75mArms/mADC Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to operate Rating 60 75 10 0.5 Units VP mArms / mADC  mA Features • Designed for EN50130-4 Compliant Security Systems • 1500Vrms Input/Output Isolation • Only 0.5mA of LED Current Required to Operate • Small 4-Pin SOP Package • High Reliability • No EMI/RFI Generation • Immune to Radiated EM Fields • Tape & Reel Version Available • Flammability Rating UL 94 V-0 Description The CPC1006N is a miniature single-pole, normally-open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The relay outputs are constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. Using IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging to produce one of the world’s smallest relays, the CPC1006N offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. Approvals Applications • Security • Passive Infrared Detectors (PIR) • Data Signalling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Industrial Controls • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC1006N CPC1006NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 3 2 Load Load Switching Characteristics of Normally-Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1006N-R06 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1006N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage Input to Output ESD Rating, Human Body Model Operational Temperature, Ambient Storage Temperature 1 2 Ratings 60 5 50 1 70 400 1500 4 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms kV ºC ºC Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 3.33 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous Peak On-Resistance 1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 60 - - V IF=0.5mA t=10ms IF=0.5mA, IL=75mA IF=0mA, VL=60VP IL ILPK RON ILEAK - 7 - 75 ±350 10 1 mArms / mADC mAP  IF=0mA, VL=50V, f=1MHz ton toff COUT - 5 10 10 - ms ms pF IL=75mA IF=5mA VR=5V IF IF VF IR 0.05 0.9 - 0.1 1.2 - 0.5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 1 - pF IF=2mA, VL=10V A Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60ºC) a minimum LED drive current of 2mA is recommended. www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1006N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 25 Device Count (N) Device Count (N) 25 20 15 10 5 0 20 15 10 5 5 Device Count (N) 15 10 5 0 0.08 0.09 0.10 0.11 LED Forward Current (mA) 6.7 0.12 Typical Turn-Off Time (N=50, IF=2mA, IL=75mA) 25 20 25 20 15 10 5 0.400 0.415 0.430 0.445 0.460 0.475 0.490 Turn-Off Time (ms) Typical LED Forward Voltage Drop vs. Temperature Typical IF for Switch Operation vs. Temperature (IL=50mA) 0.18 IF=50mA IF=20mA IF=10mA 1.5 0.14 1.3 1.2 1.1 1.0 -40 0.08 -20 0 20 40 60 Temperature (ºC) 80 0.06 -40 100 Typical Turn-On Time vs. LED Forward Current (IL=50mA) 300 0.12 0.10 IF=5mA IF=2mA IF=1mA -20 0 20 40 60 Temperature (ºC) 80 100 Turn-Off Time (Ps) 150 100 50 447 446 445 10 20 30 40 LED Forward Current (mA) 50 84 85 86 87 88 89 Blocking Voltage (VP) 90 91 Typical Load Current vs. Load Voltage (IF=0.5mA) 50 0 -50 -0.4 -0.2 0.0 0.2 Load Voltage (V) 0.4 0.6 Typical On-Resistance vs. Temperature (IF=1mA, IL=50mA) 10 9 8 7 6 443 0 5 11 444 0 10 12 448 200 7.3 15 -100 -0.6 Typical Turn-Off Time vs. LED Forward Current (IL=50mA) 449 250 7.2 20 100 0.16 IF (mA) 1.4 6.9 7.0 7.1 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, IF=0mA) 83 Load Current (mA) 1.6 6.8 0 0 0.099 0.108 0.117 0.126 0.135 0.144 0.153 Turn-On Time (ms) On-Resistance (:) Device Count (N) 10 Device Count (N) 25 LED Forward Voltage (V) 15 0 0.07 Typical Turn-On Time (N=50, IF=2mA, IL=75mA) Typical On-Resistance Distribution (N=50, IF=0.5mA, IL=75mA) 20 0 1.235 1.240 1.245 1.250 1.255 1.260 1.265 LED Forward Voltage (V) Turn-On Time (Ps) 25 Device Count (N) 30 Typical IF for Switch Operation (N=50, IL=75mA) 0 10 20 30 40 LED Forward Current (mA) 50 5 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1006N PERFORMANCE DATA* 700 Turn-Off Time (Ps) Turn-On Time (Ps) 500 IF=1mA IF=2mA IF=5mA 400 300 200 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 500 400 10 Leakage Current (nA) Blocking Voltage (VP) 94 90 88 86 84 -40 -20 0 20 40 60 Temperature (ºC) 80 0 20 40 60 Temperature (ºC) 80 65 60 55 50 -40 100 Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=60V) 14 6 4 2 800 70 45 -20 8 0 -40 100 IF=5mA IF=2mA IF=1mA 300 Typical Blocking Voltage vs. Temperature 92 75 600 200 -40 Maximum Load Current vs. Temperature (IF=1mA) 80 Output Capacitance (pF) 600 Typical Turn-Off Time vs. Temperature (IL=50mA) Load Current (mA) Typical Turn-On Time vs. Temperature (IL=50mA) -20 0 20 40 60 Temperature (ºC) 80 100 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 12 10 8 6 4 -20 0 20 40 60 Temperature (ºC) 80 100 10s 100s 0 10 20 30 40 Load Voltage (V) 50 60 Energy Rating Curve (IF=0.5mA) Load Current (mA) 700 600 500 400 300 200 100 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC1006N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1006N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1006N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1006N MECHANICAL DIMENSIONS CPC1006N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 3.85 (0.152) 1.54 (0.061) 2.030± 0.025 (0.080± 0.001) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.051 ± 0.051 (0.0020 ± 0.0020) Note: 1. Lead dimensions do not include plating: 1000 microinches max. 2. Controlling dimension: mm 0.381 ± 0.025 (0.015 ± 0.001) CPC1006NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) A0=6.50 (0.256) P1=8.00 (0.315) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC1006N-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/9/2021