CPC1016NTR

CPC1016N 100V, 100mArms/mADC Single-Pole, Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 100 100 16 Units VP mArms / mADC  Features • • • • • • 1500Vrms Input/Output Isolation 100% Solid State Low Drive Power Requirements No EMI/RFI Generation Tape & Reel Version Available Flammability Rating UL 94 V-0 CPC1016N is a miniature, low-voltage, low on-resistance, normally open (1-Form-A) solid state relay in a 4-lead SOP package. The relay uses optically coupled MOSFET technology to provide 1500Vrms of input/output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division’s patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. The CPC1016N uses IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging to produce a very compact solid state relay that is ideal for replacing larger, less-reliable reed and electromechanical relays. Applications • • • • • • • • • • Description Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment—Patient/Equipment Isolation Security Systems Industrial Controls Reed Relay Replacement Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC1016N CPC1016NTR Description 4-Lead SOP (100/tube) 4-Lead SOP (2000/reel) Pin Configuration 1 4 + Control - Control Load 3 2 Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1016N-R11 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1016N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 100 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms ºC ºC Typical values are characteristic of the device at the specified temperatures and are the result of engineering evaluations. They are provided for information purposes only and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 3.33 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 100 - - V t=10ms IL=100mA IL ILPK RON - - 100 ±350 16 mArms / mADC mAP  VL=100VP ILEAK - - 1 A IF=0mA, VL=50V, f=1MHz ton toff COUT - 25 2 1 - ms ms pF IL=100mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.5 0.4 1.36 - 2 1.5 10 mA mA V A VIO=0, f=1MHz CIO - 1 - pF IF=5mA, VL=10V Load current derates linearly from 100mA @ 25ºC to 80mA @ 85ºC. Measurement taken within 1 second of on-time. www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION CPC1016N PERFORMANCE DATA* Typical IF for Switch Operation (N=50, IL=100mA) 30 Device Count (N) Device Count (N) 25 20 15 10 5 25 25 20 20 15 10 5 0 0 1.364 0.25 35 25 25 20 15 10 5 0.30 0.35 0.40 0.45 0.50 6.8 6.9 7.0 7.1 7.2 7.3 5 0.25 0.30 0.35 0.40 0.45 0.50 0.55 LED Current (mA) LED Current (mA) Typical Turn-On Time (N=50, IF=5mA, IL=100mA) Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 25 20 15 10 5 20 15 10 5 0 0 0 10 0.55 Device Count (N) Device Count (N) 30 15 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical On-Resistance Distribution (N=50, IL=100mA) Device Count (N) Typical IF for Switch Dropout (N=50, IL=100mA) Device Count (N) Typical LED Forward Voltage Drop (N=50, IF=5mA) 7.4 0.25 0.30 0.35 0.40 0.45 0.50 0.21 0.55 0.22 0.23 0.24 0.25 0.26 0.27 Turn-Off Time (ms) Turn-On Time (ms) On-Resistance (:) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 106 IF=10mA IF=5mA IF=2mA 1.4 1.3 1.2 124 1.8 1.8 1.5 1.5 LED Current (mA) 1.7 LED Current (mA) LED Forward Voltage Drop (V) 1.8 1.5 112 115 118 121 Blocking Voltage (VP) Typical IF for Switch Operation vs. Temperature (IL=80mA) Typical LED Forward Voltage Drop vs. Temperature 1.6 109 1.2 0.9 0.6 1.0 0 -50 -25 0 25 50 Temperature (ºC) 75 100 -40 1.2 0.9 0.6 0.3 0.3 1.1 Typical IF for Switch Dropout vs. Temperature (IL=80mA) -20 0 60 20 40 Temperature (ºC) 80 100 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R11 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1016N PERFORMANCE DATA* 50 0 -50 -100 -150 -1.5 -1.0 -0.5 0 0.5 1.0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Instantaneous IF=5mA 6 4 2 -40 -20 0 20 40 60 80 45 IF=5mA 0.2 0 IF=10mA -40 100 5 Turn-Off Time (ms) Steady State 8 Turn-On Time (ms) IF=10mA 0.3 0 Typical Turn-On Time vs. Temperature (IL=80mA) 10 0.4 50 Typical On-Resistance vs. Temperature (IL=Max Rated @ Temperature) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0.5 0.1 Load Voltage (V) 12 -20 0 Temperature (ºC) Maximum Load Current vs. Temperature 20 40 60 Temperature (ºC) 80 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.016 121 0.014 120 0.012 95 90 IF=10mA IF=5mA 85 80 75 Leakage (PA) 122 100 119 118 117 -20 0 20 40 60 80 Temperature (ºC) 100 120 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=100VP) 0.010 0.008 0.006 0.004 116 0.002 115 -40 50 45 IF=5mA -40 115 105 10 15 20 25 30 35 40 LED Forward Current (mA) IF=10mA 120 110 5 Typical Turn-Off Time vs. Temperature (IL=80mA) Typical Blocking Voltage vs. Temperature Blocking Voltage (VP) Load Current (mA) 0.7 10 15 20 25 30 35 40 LED Forward Current (mA) IF=5mA Typical Turn-Off Time vs. LED Forward Current (IL=80mA) 0.6 0 1.5 14 On-Resistance (:) Typical Turn-On Time vs. LED Forward Current (IL=80mA) Turn-Off Time (ms) 100 Turn-On Time (ms) Load Current (mA) 150 Typical Load Current vs. Load Voltage (IF=5mA) -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R11 INTEGRATED CIRCUITS DIVISION CPC1016N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1016N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1016N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R11 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1016N MECHANICAL DIMENSIONS CPC1016N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 3.85 (0.152) 1.54 (0.061) 2.030± 0.025 (0.080± 0.001) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.051 ± 0.051 (0.0020 ± 0.0020) Note: 1. Lead dimensions do not include plating: 1000 microinches max. 2. Controlling dimension: mm 0.381 ± 0.025 (0.015 ± 0.001) CPC1016NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) A0=6.50 (0.256) P1=8.00 (0.315) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC1016N-R11 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/5/2021