CPC1018N

CPC1018N 60V Normally-Open Single-Pole 4-Pin SOP OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to operate Rating 60 600 0.8 1 Units VP mArms / mADC  mA Features • Designed for Use in Security Systems Complying with EN50130-4 • Only 1mA of LED Current Required to Operate • 1500Vrms Input/Output Isolation • Small 4-Pin SOP Package • High Reliability • Arc-Free With No Snubbing Circuits • No EMI/RFI Generation • Immune to Radiated EM Fields • Tape & Reel Version Available • Flammability Rating UL 94 V-0 Applications • Security • Passive Infrared Detectors (PIR) • Data Signalling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Aerospace • Industrial Controls Description The CPC1018N is a miniature single-pole, normally-open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The super efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits Division’s patented OptoMOS architecture while the optically coupled output is controlled by a highly efficient infrared LED. IXYS Integrated Circuits Division’s state of the art double-molded vertical construction packaging enables the CPC1018N to be one of the world’s smallest relays. It offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Ordering Information Part # CPC1018N CPC1018NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 Load 3 2 Load Switching Characteristics of Normally-Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1018N-R13 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1018N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 60 5 50 1 70 400 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate linearly 3.33 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IF=2mA t =10ms IL=100mA VL=60VP IL ILPK RON ILEAK - 0.58 - 600 ±1 0.8 1 mArms / mADC AP  IF=0mA, VL=50V, f=1MHz ton toff COUT - 0.47 0.22 25 3 2 - IL=600mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.2 0.2 1.2 - 1 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 1 - pF IF=5mA, VL=10V µA ms pF Load current derates linearly from 600mA @ 25oC to 480mA @80oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended. www.ixysic.com R13 INTEGRATED CIRCUITS DIVISION CPC1018N PERFORMANCE DATA* 15 10 5 0 25 30 20 25 15 10 5 20 15 10 5 0 1.250 1.255 1.260 1.265 1.270 LED Forward Voltage (V) 0 1.275 0.35 0.40 0.45 0.50 0.55 0.60 Turn-On Time (ms) 0.65 0.55 Typical IF for Switch Dropout (N=50, IL=600mA) Typical IF for Switch Operation (N=50, IL=600mA) 25 20 20 20 10 5 Device Count (N) 25 15 15 10 5 0 0 0.16 0.18 0.20 0.22 0.24 LED Current (mA) 0.26 0.65 0.75 0.85 0.95 Turn-Off Time (ms) 1.05 Typical On-Resistance Distribution (N=50, IF=1mA, IL=0.6A) 25 Device Count (N) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) Device Count (N) 20 Device Count (N) Device Count (N) 25 Typical Turn-On Time (N=50, IF=5mA, IL=100mA) Typical LED Forward Voltage Drop (N=50, IF=5mA) 15 10 5 0 0.16 0.28 0.18 0.20 0.22 0.24 LED Current (mA) 0.26 0.505 0.510 0.515 0.520 0.525 0.530 0.535 On-Resistance (:) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 63.5 LED Forward Voltage vs. Current 20 10 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage(V) 66.5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=80mA) 0.7 0.6 Turn-Off Time (ms) Turn-On Time (ms) LED Forward Current (mA) 30 64.5 65.0 65.5 66.0 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=80mA) 50 40 64.0 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R13 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1018N PERFORMANCE DATA* 1.4 1.3 1.2 IF=5mA IF=2mA IF=1mA 1.0 Load Current (mA) 600 0 20 40 60 Temperature (ºC) 80 Typical IF for Switch Operation vs. Temperature (IL=480mA) -20 0 20 40 60 Temperature (ºC) 80 100 400 0 -200 -400 -600 -0.3 0.016 20 40 60 80 100 -0.2 -0.1 0 0.1 Load Voltage (V) 0.2 0.010 0.008 0.006 0.004 0.002 -20 0 20 40 60 Temperature (ºC) 80 100 20 40 60 80 100 Typical On-Resistance vs. Temperature (IL=480mA) 0.9 IF=5mA 0.8 IF=10mA 0.7 Steady State 0.6 0.5 0.4 0.3 -20 0 20 40 60 Temperature (ºC) 80 -40 100 -20 0 20 40 60 80 100 Temperature (ºC) Typical Blocking Voltage vs. Temperature 72 70 0.70 0.65 0.60 0.55 IF=10mA 0.50 0.45 IF=5mA 68 66 64 62 60 58 -40 -20 0 20 40 60 80 100 -40 120 -20 0 20 40 60 Temperature (ºC) Temperature (ºC) Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) Energy Rating Curve (IF=1mA) 200 0.012 0 Typical IF for Switch Dropout vs. Temperature (IL=480mA) 0.75 Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=60V) IF=10mA -20 Temperature (ºC) 0.80 0.3 IF=5mA Temperature (ºC) 0.35 Output Capacitance (pF) Leakage (µA) 0 0.40 0.014 0 -40 0.36 0.34 0.32 0.30 0.28 0.26 0.24 0.22 0.20 0.18 0.16 -40 -20 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 -40 Typical Maximum Load Current vs. Temperature Typical Load Current vs. Load Voltage (IF=1mA) 200 IF=10mA -40 100 Load Current (A) LED Current (mA) 0.36 0.34 0.32 0.30 0.28 0.26 0.24 0.22 0.20 0.18 0.16 -40 -20 LED Current (mA) -40 IF=5mA Load Current (A) 1.1 Turn-Off Time (ms) 1.5 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Blocking Voltage (VP) IF=50mA IF=20mA IF=10mA Turn-On Time (ms) LED Forward Voltage (V) 1.6 Typical Turn-Off Time vs. Temperature (IL=80mA) Typical Turn-On Time vs. Temperature (IL=80mA) On-Resistance (:) Typical LED Forward Voltage Drop vs. Temperature 150 100 50 0 0 10 20 30 Load Voltage (V) 40 50 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 10μs 100μs 1ms 10ms 100ms 1s 80 100 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R13 INTEGRATED CIRCUITS DIVISION CPC1018N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1018N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1018N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R13 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1018N MECHANICAL DIMENSIONS CPC1018N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 Typ (0.008 Typ) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.55 (0.022) 0.559 ± 0.127 (0.022 ± 0.005) 5.50 (0.217) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.45 (0.057) 2.030± 0.025 (0.080± 0.001) 0.481 (0.019) 0-0.1 (0-0.004) 2.54 (0.10) Package standoff: 0.064 ± 0.040 (0.0025 ± 0.0015) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1018NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P1=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC1018N-R13 ©Copyright 2018, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/30/2018 6