CPC1117NTR

CPC1117N 60V Normally-Closed Single-Pole 4-Pin SOP OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to Operate Rating 60 150 16 1 Units VP mArms / mADC  mA Features • Designed for use in security systems complying with EN50130-4 • Only 1mA of LED current required to operate • 1500Vrms Input/Output Isolation • Small 4-Pin SOP Package • High Reliability • Arc-Free With No Snubbing Circuits • No EMI/RFI Generation • Immune to radiated EM fields • Tape & Reel Version Available • Flammability Rating UL 94 V-0 Applications • Security • Passive Infrared Detectors (PIR) • Data Signalling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Aerospace • Industrial Controls Description The CPC1117N is a miniature normally-closed single-pole (1-Form-B) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input/ output isolation. The efficient MOSFET switches and photovoltaic die use IXYS Integrated Circuits' patented OptoMOS architecture. The optically coupled output is controlled by the input's highly efficient infrared LED. IXYS Integrated Circuits' state of the art doublemolded vertical construction packaging makes the CPC1117N one of the world’s smallest relays. It offers board space savings of at least 20% over the competitor’s larger 4-pin SOP relay. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • EN/IEC 60950-1 Certified Component: Certificate available on our website Ordering Information Part # CPC1117N CPC1117NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 2 3 Load Load Switching Characteristics of Normally-Closed Devices Form-B IF ILOAD 10% toff DS-CPC1117N-R10 www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION CPC1117N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Disipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 3.33 mW / ºC Ratings 60 5 50 1 70 400 1500 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate (Output Open) 3 Input Control Current to Deactivate (Output Closed) Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 3 2 Conditions Symbol Min Typ Max Units IF=0mA t=10ms IF=0mA, IL=120mA IF=1mA, VL=60VP IL ILPK RON ILEAK - 5 - 150 ±350 16 1 mArms / mADC mAP  IF=0.5mA, VL=50V, f=1MHz ton toff COUT - 0.316 1.55 10 10 10 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 0.16 0.14 1.2 - 1 1.5 10 mA mA V µA VIO=0V, f=1MHz CIO - 1 - pF IF=2mA, VL=10V µA ms pF Load current derates linearly from 150mA @ 25oC to 100mA @85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 3mA is recommended. www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION CPC1117N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 20 35 Typical On-Resistance Distribution (N=50, IL=150mA) Typical IF for Switch Operation (N=50, IL=150mA) 35 30 25 20 15 10 15 Device Count (N) Device Count (N) Device Count (N) 30 10 5 25 20 15 10 5 5 0 0 1.17 0.21 5.0 0.23 5.1 5.2 5.3 5.4 5.5 5.6 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, IF=1mA) 35 10 5 15 Device Count (N) 15 10 5 25 20 15 10 5 0 0.28 0.30 0.32 0.34 0.36 Turn-On Time (ms) 0 0.38 1.15 1.6 LED Current (mA) 1.5 1.4 1.3 1.2 IF=5mA IF=2mA IF=1mA -20 0.20 0.15 0 20 40 60 Temperature (ºC) 80 100 100 50 0 -50 0 20 40 60 Temperature (ºC) 80 100 20 30 LED Current (mA) 40 50 -150 -1.00 -0.66 -0.33 0 0.33 0.66 1.00 Load Voltage (V) Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 3.0 Turn-Off Time (ms) -20 8 Typical On-Resistance vs. Temperature (IF=0mA, IL=150mA) 7 2.5 2.0 1.5 1.0 6 5 4 3 2 0.0 10 115 Typical Load Current vs. Load Voltage 0.5 0 95 100 105 110 Blocking Voltage (VP) 150 0.25 0.10 -40 Typical Turn-On Time vs. LED Forward Current (IL=100mA) 0.35 0.34 0.33 0.32 0.31 0.30 0.29 0.28 0.27 0.26 0.25 90 -100 1.0 -40 85 2.05 On-Resistance (:) 1.1 1.45 1.60 1.75 1.90 Turn-Off Time (ms) Load Current (mA) 0.30 IF=50mA IF=20mA IF=10mA 1.30 Typical IF for Switch Operation vs. Temperature (IL=100mA) Typical LED Forward Voltage Drop vs. Temperature LED Forward Voltage (V) 0.15 0.17 0.19 LED Current (mA) 30 20 0 Turn-On Time (ms) 0.13 Typical Turn-Off Time (N=50, IF=2mA, IL=100mA) 20 Device Count (N) Device Count (N) 0.11 Typical Turn-On Time (N=50, IF=2mA, IL=100mA) 25 0 1.19 1.21 1.23 1.25 LED Forward Voltage Drop (V) 0 10 20 30 LED Current (mA) 40 50 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R10 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1117N PERFORMANCE DATA* 5 0.40 Turn-Off Time (ms) Turn-On Time (ms) 0.45 IF=10mA IF=5mA IF=2mA IF=1mA 0.35 0.30 Typical Turn-Off Time vs. Temperature (IL=100mA) 0.25 4 Maximum Load Current vs. Temperature (IF=0mA) 225 IF=1mA IF=2mA IF=5mA IF=10mA 200 Load Current (mA) Typical Turn-On Time vs. Temperature (IL=100mA) 3 2 1 175 150 125 100 75 50 25 0.20 -40 -20 0 20 40 60 Temperature (ºC) 80 100 -40 Typical Blocking Voltage vs. Temperature (IF=2mA) 125 0.40 -20 0 20 40 60 Temperature (ºC) 80 110 105 100 Typical Leakage vs. Temperature Measured Across Pins 3&4 (IF=2mA, VL=60V) 40 0.30 0.25 0.20 0.15 0.10 95 0.05 90 -40 -20 0 20 40 60 Temperature (ºC) 80 0 -40 100 -20 0 20 40 60 80 100 120 Temperature (ºC) Output Capacitance (pF) 115 -40 100 0.35 120 Leakage (µA) Blocking Voltage (VP) 0 0 Output Capacitance vs. Load Voltage (IF=0.5mA) 35 30 25 20 15 10 5 -20 0 20 40 60 80 100 Temperature (ºC) 0 10 20 30 40 Load Voltage (V) 50 60 Load Current (A) Energy Rating Curve 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10μs 100μs 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R10 INTEGRATED CIRCUITS DIVISION CPC1117N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1117N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1117N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R10 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1117N Mechanical Dimensions CPC1117N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.064 ± 0.040 (0.0025 ± 0.0015) 0.381 ± 0.025 (0.015 ± 0.001) 3.85 (0.152) 1.54 (0.061) 2.030± 0.025 (0.080± 0.001) 0.481 (0.019) 0-0.1 (0-0.004) 0.60 (0.024) Note: 1. Lead dimensions do not include plating: 1000 microinches max. CPC1117NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P1=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1117N-R10 ©Copyright 2018, IXYS Integrated Circuits OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 6/1/2018