CPC1230N

CPC1230N 350V, 120mArms/mADC Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 350 120 30 Units VP mArms / mADC  Features • 0.4mm Distance Through Insulation (Supplementary Isolation Requirement of EN60950) • 1500Vrms Input/Output Isolation • Low Drive Power Requirements • High Reliability • No EMI/RFI Generation • Small 4-Pin SOP Package • Tape & Reel Version Available • Flammability Rating UL 94 V-0 Description The CPC1230N is a miniature normally-open (1-Form-A), single-pole solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient infrared LED. The device is compliant with supplementary isolation in accordance with EN/IEC 60950-1. The CPC1230N uses IXYS Integrated Circuits Division’s state of the art double molded vertical construction packaging to produce one of the world’s smallest 4-pin relays. It offers board space savings approaching 20% over the competitor’s larger 4-pin SOP relay. Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment Patient/Equipment Isolation • Security • Industrial Controls Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1172007 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC1230N CPC1230NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control – Control 1 4 3 2 Load Load Switching Characteristics of Normally-Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1230N-R12 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1230N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage (Peak) Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Capacitance, Input to Output Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 2 Ratings 350 5 50 1 70 400 1 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW pF Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / ºC Derate output power linearly 3.33 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - V t=10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 25 - 120 ±350 30 1 mArms / mADC mAP  µA IF=0mA, VL=50V, f=1MHz ton toff COUT - 9 2 1 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.3 0.9 - 0.8 0.7 1.36 - 2 1.5 10 IF=5mA, VL=10V ms pF mA mA V µA Load current derates linearly from 120mA @ 25oC to 80mA @ 85oC. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60°C) a minimum LED drive current of 4mA is recomended. www.ixysic.com R12 INTEGRATED CIRCUITS DIVISION CPC1230N PERFORMANCE DATA* Device Count (N) Device Count (N) 25 20 15 10 5 25 25 20 20 Device Count (N) 30 15 10 5 0 0 1.364 0.85 20 20 15 10 5 0.90 1.00 1.10 1.15 1.20 0.65 0.70 0.75 0.80 0.85 0.90 5 0.21 0.22 0.23 0.24 0.25 0.26 0.27 Turn-On Time (ms) Turn-Off Time (ms) Typical IF for Switch Dropout (N=50, IL=120mA) Typical On-Resistance Distribution (N=50, IF=2mA, IL=120mA) 35 30 15 10 5 25 20 15 10 5 0 0 10 1.25 Device Count (N) 25 Device Count (N) 25 15 0 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Typical IF for Switch Operation (N=50, IL=120mA) Device Count (N) Typical Turn-Off Time (N=50, IF=5mA, IL=120mA) Typical Turn-On Time (N=50, IF=5mA, IL=120mA) Typical LED Forward Voltage Drop (N=50, IF=5mA) 0 0.60 0.95 0.65 0.70 0.75 0.80 0.85 0.90 23.5 LED Current (mA) LED Current (mA) 24 24.5 25 25.5 26 26.5 On-Resistance (:) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 370 IF=10mA IF=5mA IF=2mA 1.4 1.3 1.2 1.1 1.0 -50 -25 0 25 50 Temperature (ºC) 75 100 400 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Typical Turn-Off Time vs. LED Forward Current (IL=120mA) 0.7 0.6 Turn-Off Time (ms) 1.7 Turn-On Time (ms) LED Forward Voltage Drop (V) 1.8 1.5 380 385 390 395 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=120mA) Typical LED Forward Voltage Drop vs. Temperature 1.6 375 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R12 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1230N PERFORMANCE DATA* 3.0 IF=10mA -20 0 20 40 60 80 100 30 20 10 IF=5mA -20 0 20 40 0 60 80 100 -40 0 20 40 60 Typical IF for Switch Operation vs. Temperature (IL=80mA) Typical IF for Switch Dropout vs. Temperature (IL=80mA) Typical Load Current vs. Load Voltage (IF=5mA) 3.0 150 2.5 LED Current (mA) 1.5 1.0 2.0 1.5 1.0 0.5 0 -20 0 20 40 60 80 100 Maximum Load Current vs. Temperature 100 50 0 -50 -20 0 20 40 60 Temperature (ºC) 80 100 -3 400 0.016 160 395 0.014 IF=10mA 80 IF=5mA 60 40 20 0 390 Leakage (PA) Blocking Voltage (VP) 180 100 0 20 40 60 80 100 120 385 380 375 -40 -20 0 20 40 60 Temperature (ºC) 2 3 Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=350V) 0.010 0.008 0.006 Load Current (A) 40 30 20 10 0 100 150 200 250 Load Voltage (V) 300 350 80 0 -40 100 -20 0 20 40 60 80 100 Temperature (ºC) Energy Rating Curve 50 Output Capacitance (pF) 1 0.002 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 50 0 0.004 370 Temperature (ºC) 0 -1 0.012 365 -20 -2 Load Voltage (V) Typical Blocking Voltage vs. Temperature 120 100 -150 -40 Temperature (ºC) 140 80 -100 0 -40 -20 Temperature (ºC) 0.5 Load Current (mA) 40 Temperature (ºC) 2.0 -40 50 Temperature (ºC) 2.5 LED Current (mA) IF=10mA Typical On-Resistance vs. Temperature (IF=10mA, IL=80mA) 60 On-Resistance (:) IF=5mA 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -40 Load Current (mA) 5.0 4.5 4.0 3.0 3.0 2.5 2.0 1.0 1.0 0.5 0 -40 Typical Turn-Off Time vs. Temperature (IL=80mA) Turn-Off Time (ms) Turn-On Time (ms) Typical Turn-On Time vs. Temperature (IL=80mA) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R12 INTEGRATED CIRCUITS DIVISION CPC1230N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1230N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC1230N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R12 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1230N MECHANICAL DIMENSIONS CPC1230N 4.089 ± 0.025 (0.161 ± 0.001) Recommended PCB Land Pattern 0.203 ± 0.025 (0.008 ± 0.001) 0.60 (0.024) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.025 (0.150 ± 0.001) 0.559 ± 0.127 (0.022 ± 0.005) 0.910 ± 0.025 (0.036 ± 0.001) Pin 1 2.54 Typ (0.100 Typ) 2.030± 0.025 (0.080± 0.001) 1.54 (0.061) 2.54 (0.10) Dimensions mm (inches) Package standoff: 0.051 ± 0.051 (0.0020 ± 0.0020) 0.481 (0.019) 0-0.1 (0-0.004) 3.85 (0.152) Note: 1. Lead dimensions do not include plating: 1000 microinches max. 2. Controlling dimension: mm 0.381 ± 0.025 (0.015 ± 0.001) CPC1230NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P1=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC1230N-R12 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 8/5/2021