CPC1302GSTR

CPC1302 Dual Optocoupler High-Voltage Darlington Output INTEGRATED CIRCUITS DIVISION Parameter Breakdown Voltage - BVCEO Current Transfer Ratio - CTR Rating 350 1000-8000 Description Units VP % The CPC1302 is a dual optocoupler with two identical, independent channels, each having a unidirectional input and a high-voltage Darlington output. Light output from the highly efficient infrared LED activates its associated, optically coupled silicon NPN photo-Darlington output transistor. The input LED and the output transistor are separated by a 3750Vrms isolation barrier. Features • • • • 350VP Breakdown Voltage 3750Vrms Input/Output Isolation Surface Mount Tape & Reel Version Available Flammability Rating UL 94 V-0 With a LED current of only 1mA, a current transfer ratio of 1000% to 8000% is guaranteed at the collector of the 350V Darlington output transistor. Applications • • • • • • • Telecom Switching Tip/Ring Circuits Hook Switch Modem Switching (Laptop, Notebook, Pocket Size) Loop Detect Ringing Detect Current Sensing The CPC1302's low input current capability with high current transfer ratios, output voltage capability, and isolation barrier rating make it ideal for many applications such as telecom, industrial, and power control. Approvals • UL 1577 Approved Component: File E76270 • EN 60950 Certified Component: Certificate available on our website Ordering Information Part Number CPC1302G CPC1302GS CPC1302GSTR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Pin Configuration A K A K DS-CPC1302-R07 www.ixysic.com 1 8 2 7 3 6 4 5 C E C E 1 INTEGRATED CIRCUITS DIVISION CPC1302 Absolute Maximum Ratings @ 25ºC Parameter Breakdown Voltage, BVCEO Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 (Each) Phototransistor Power Dissipation 2 (Each) Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 2 Ratings 350 5 50 1 150 150 3750 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / oC Derate linearly 1.5 mW / oC Electrical Characteristics @ 25ºC Parameters Output Characteristics Phototransistor Breakdown Voltage Emitter-Collector Breakdown Voltage Phototransistor Output (Dark) Current Saturation Voltage Current Transfer Ratio Output Capacitance Input Characteristics Input Control Current Input Voltage Drop Input Reverse Current Common Characteristics Input to Output Capacitance Conditions Symbol Min Typ Max Units ICEO=100µA IE=0.1mA VCEO=200V, IF=0mA IC=10mA, IF=1mA IC=100mA, IF=10mA IF=1mA, VCE=1V VCEO=50V, f=1MHz BVCEO BVECO ICEO CTR COUT 350 0.3 1000 - 5500 13 100 1 1.2 8000 - VP V nA V V % pF IC=10mA, VCE=1V IF=5mA VR=5V IF VF IR 0.9 - 0.07 1.2 - 1 1.5 10 mA V µA - CI/O - 3 - pF VCE(sat) Switching Characteristics @ 25ºC Characteristic Rise Time Fall Time Turn-On Time Storage Time Turn-Off Time Turn-On Time Storage Time Turn-Off Time Symbol tR tF ton tS toff ton tS toff Test Condition VCC=10V IF=10mA RL=100 VCC=10V IF=16mA RL=180 Typ 40 5 5 20 60 1 40 80 Units IF tF VCE s tR 90% 10% tS t on t off Switching Time Test Circuit VCC RL Pulse Width=5ms Duty Cycle=50% 2 www.ixysic.com IF VCE R07 INTEGRATED CIRCUITS DIVISION CPC1302 PERFORMANCE DATA* LED Current (IF) vs. LED Forward Voltage (VF) 30 20 10 10 1 0.1 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) CTR vs. LED Current (I F) Collector Current vs. LED Current (I F) 1000 VCE=1.5V VCE=1.0V 1000 100 10 0.1 VCE=1.5V 100 VCE=1.0V 10 Collector Current vs. Collector-Emitter Voltage IF = 5mA 140 120 100 80 IF = 2mA 60 IF = 1mA 40 IF = 0.5mA 20 0 0 Leakage Current (µA) 160 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Collector-Emitter Voltage V CE (V) IF=2mA -20 0 20 40 60 Temperature (ºC) 80 100 Collector Current vs. Temperature (VCE = 1.2V) IF=10mA IF=5mA IF=1mA IF=0.5mA 300 225 150 75 -40 1.5 1.0 0.5 -20 0 20 40 60 80 0 20 40 60 80 100 Breakdown Voltage vs. Temperature 2.0 -40 -20 Temperature (ºC) 2.5 0 IF=5mA 1.1 Leakage vs. Temperature (VCEO=350V) 3.0 IF = 10mA IF=10mA 1.2 100 0.1 1 10 LED Forward Current (mA) Breakdown Voltage BVCEO (VP) 180 IF=20mA 1.3 0 0.01 100 IF=50mA 1.4 375 1 1 10 LED Current (mA) 1.5 1.0 -40 Collector Current IC (mA) 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) 10000 Collector Current IC (mA) LED Forward Voltage vs. Temperature 1.6 LED Forward Voltage (V) LED Current (mA) 40 100000 CTR (%) 100 Collector Current IC (mA) LED Current (mA) 50 LED Current (IF) vs. LED Forward Voltage (VF) 100 120 Temperature (ºC) 450 440 430 420 410 400 390 380 370 -40 -15 10 35 Temperature (ºC) 60 85 Switching Time vs. Load Resistance 1000 Switching Time (Ps) toff , IF=16mA 100 toff , IF=1.6mA 10 ton , IF=1.6mA 1 ton , IF=16mA 0.1 10 100 1K 10K Load Resistance (:) 100K *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. For guaranteed parameters not indicated in the written specifications, please contact our application department. R07 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1302 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1302G / CPC1302GS MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1302G CPC1302GS 250ºC 250ºC 30 seconds 30 seconds 1 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 4 www.ixysic.com R07 INTEGRATED CIRCUITS DIVISION CPC1302 MECHANICAL DIMENSIONS CPC1302G 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) CPC1302GS 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) PCB Land Pattern 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) R07 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1302 MECHANICAL DIMENSIONS CPC1302GSTR Tape & Reel 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment W=16.00 (0.63) Bo=10.30 (0.406) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1302-R07 ©Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/18/2018