CPC2030NTR

CPC2030N 350V, 120mA Dual Single-Pole Normally Open Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to operate Rating 350 120 30 2 Units VP mArms / mADC  mA The CPC2030N is a miniature device with two independent normally-open (1-Form-A) solid state relays in an 8-pin SOIC package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. Optically coupled outputs using the patented OptoMOS architecture are controlled by a highly efficient infrared LED. Features • • • • • • Description 1500Vrms Input/Output Isolation No EMI/RFI Generation Immune to Radiated EM Fields Tape & Reel Version Available Small 8-Pin SOIC Package Flammability Rating UL 94 V-0 The CPC2030N uses IXYS Integrated Circuits' state of the art, double-molded vertical construction packaging to produce one of the world’s smallest relays. The CPC2030N offers substantial board space savings over the competitor’s larger 8-pin SOIC relay. Applications • Telecommunications • Security • Passive Infrared Detectors (PIR) • Data Signaling • Sensor Circuitry • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Medical Equipment—Patient/Equipment Isolation • Industrial Controls Approvals • UL Recognized Component: File E76270 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Part # CPC2030N CPC2030NTR Description 8-Pin SOIC (50/tube) 8-Pin SOIC (2000/reel) Pin Configuration 1 8 + Control Load 7 2 – Control Load 3 6 + Control Load 4 5 – Control Load Switching Characteristics of Normally-Open (Form A) Devices Form-A IF 90% 10% ILOAD ton DS-CPC2030N-R06 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC2030N Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation Total Power Dissipation 1 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Ratings 350 5 50 1 70 600 1500 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 5mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Blocking Voltage Load Current Continuous 1 Peak On-Resistance 2 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Capacitance, Input to Output Input Characteristics Input Control Current to Activate 3 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current 1 2 3 2 Conditions Symbol Min Typ Max Units IL=1A VDRM 350 - - V IF=2mA t =10ms IL=120mA VL=350VP IL ILPK RON ILEAK - 19.5 - 120 ±350 30 1 mArms / mADC mAP  IF=0mA, VL=50V, f=1MHz VIO=0V, f=1MHz ton toff COUT CIO - 0.76 0.36 9 1 2 1 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.1 0.9 - 1.36 - 2 1.5 10 IF=5mA, VL=10V µA ms pF pF mA mA V µA Load current derates linearly from 120mA @ 25oC to 60mA @85oC, and must be derated for both poles operating simultaneously. Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 4mA is recommended. www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC2030N PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=50, IF=5mA) 30 Typical IF for Switch Operation (N=50, IL=120mA) 15 25 15 10 Device Count (N) Device Count (N) Device Count (N) 25 20 10 5 5 0.3 Typical Turn-On Time (N=50, IF=5mA, IL=60mA) 15 10 5 0.60 0.8 0.65 0.70 0.75 0.80 0.85 Turn-On Time (ms) 10 5 0.35 0.36 0.37 0.38 0.39 Turn-Off Time (ms) 10 Typical IF for Switch Operation (IL=60mA) 0.65 0.60 0.55 0.50 0.45 IF=10mA IF=5mA IF=2mA 1.5 1.4 1.3 1.2 75 100 80 0.00 -0.05 100 -3 Typical Turn-On Time vs. LED Forward Current (IL=60mA) -2 -1 0 1 Load Voltage (V) 2 3 Typical Turn-Off Time vs. LED Forward Current (IL=60mA) 370 360 1000 0 0 25 50 Temperature (ºC) 20 40 60 Temperature (ºC) 1500 500 -25 0 2000 1.0 -50 -20 2500 1.1 Typical Load Current vs. Load Voltage (IF=2mA) 0.05 Turn-Off Time (Ps) Turn-On Time (Ps) 1.6 431 -0.15 Typical LED Forward Voltage Drop vs. Temperature 3000 419 422 425 428 Blocking Voltage (VP) -0.10 -40 3500 5 0.10 0.70 1.7 10 0.15 0.75 1.8 15 416 0.40 0 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 LED Forward Voltage (V) 20 0.40 Load Current (A) LED Current (mA) 20 Typical Blocking Voltage Distribution (N=50, IF=0mA) 0 0.34 0.80 30 5 25 15 0.85 40 10 18.75 19.00 19.25 19.50 19.75 20.00 20.25 On-Resistance (:) 20 0.90 50 15 0.9 Typical Turn-Off Time (N=50, IF=5mA, IL=60mA) LED Forward Voltage vs. LED Forward Current LED Forward Current (mA) 0.5 0.6 0.7 LED Current (mA) 0 0 LED Forward Voltage Drop (V) 0.4 25 Device Count (N) 20 Device Count (N) 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Device Count (N) 1.364 20 0 0 0 Typical On-Resistance Distribution (N=50, IF=2mA, IL=120mA) 350 340 330 320 310 300 0 10 20 30 LED Current (mA) 40 50 0 10 20 30 LED Current (mA) 40 50 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R06 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC2030N PERFORMANCE DATA* 32 Typical Turn-On Time vs. Temperature (IL=60mA) 2500 Turn-On Time (Ps) On-Resistance (:) 30 28 26 24 22 500 2000 1500 IF=5mA 1000 20 450 400 350 300 IF=5mA 250 IF=2mA 200 18 150 500 -20 0 20 40 60 Temperature (ºC) 80 100 Maximum Load Current vs. Temperature (IF=4mA) 120 100 80 60 -20 0 20 40 60 Temperature (ºC) 80 30 450 440 430 420 410 400 390 0 20 40 60 Temperature (ºC) Output Capacitance (pF) 50 80 100 -40 -20 0 20 40 60 Temperature (ºC) Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 80 100 -20 0 20 40 60 Temperature (ºC) 80 100 Typical Leakage vs. Temperature Measured Across Pins 5 & 6, 7 & 8 (IF=0mA, VL=350V) 25 20 15 10 5 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve 0.9 0.8 40 Load Current (A) -20 -40 100 Typical Blocking Voltage vs. Temperature (IF=0mA) 460 Blocking Voltage (VP) 140 40 -40 -40 Leakage Current (nA) -40 Load Current (mA) Typical Turn-Off Time vs. Temperature (IL=60mA) 550 IF=2mA Turn-Off Time (Ps) Typical On-Resistance vs. Temperature (IF=4mA, IL=60mA) 30 20 10 0.7 0.6 0.5 0.4 0.3 0.2 0 0 50 100 150 200 250 Load Voltage (V) 300 350 0.1 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R06 INTEGRATED CIRCUITS DIVISION CPC2030N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC2030N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum dwell time the body temperature of these surface mount devices may be (TC - 5)°C or greater. The Classification Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles CPC2030N 260ºC 30 seconds 3 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R06 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC2030N MECHANICAL DIMENSIONS CPC2030N 1.016 ± 0.025 (0.040 ± 0.001) 9.347 ± 0.203 (0.368 ± 0.008) Pin 1 2.184 MAX (0.086 MAX) 0.432 ± 0.127 (0.017 ± 0.005) Pin to Package Standoff MIN 0.0254 (0.001) (MAX 0.102 (0.004) 0.838 ± 0.102 (0.033 ± 0.004) PCB Land Pattern 5.60 (0.22) 1.30 (0.051) 6.096 ± 0.102 (0.240 ± 0.004) 3.810 ± 0.051 (0.150 ± 0.002) 2.540 TYP (0.100 TYP) 0.203 ± 0.025 (0.008 ± 0.001) 2.54 (0.100) 0.55 (0.022) Dimensions mm (inches) 0.381 ± 0.051 (0.015 ± 0.002) Note: 1. Lead dimensions do not include plating: 1000 microinches max. CPC2030NTR Tape & Reel 1.75 ± 0.10 330.2 DIA. (13.00 DIA.) 4.00 ± 0.10 P1=8.00 ± 0.10 2.00 ± 0.10 Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 1.20 7.50 ± 0.10 Ø1.50 +0.1, -0 6.50 9.65 ± 0.10 16.00 ± 0.30 Embossed Carrier Direction of feed 3.50 Embossment 2.35 ± 0.10 NOTES: 1. All dimensions in millimeters 2. 10 sprocket hole pitch cumulative tolerance ± 0.20. 3. Carrier camber is within 1mm in 250mm. Ø1.50 MIN 6.55 ± 0.10 2.85 ± 0.10 4. Tape material : Black Conductive Polystyrene Alloy. 5. All dimensions meet EIA-481-C requirements. 6. Thickness : 0.30 ± 0.05mm. For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 6 Specification: DS-CPC2030N-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 9/7/2021