IX4426-IX4427-IX4428
1.5-Ampere Dual Low-Side
Ultrafast MOSFET Drivers
INTEGRATED CIRCUITS DIVISION
Features
•
•
•
•
•
•
•
Description
1.5A Peak Output Current
Wide Operating Voltage Range: 4.5V to 35V
-40°C to +125°C Operating Temperature Range
Latch-up Protected to 1.5A
TTL and CMOS Compatible Inputs
Fast Rise and Fall Times
Low Power Consumption
Applications
•
•
•
•
•
MOSFET Driver
Switching Power Supplies
Motor Controls
DC to DC Converters
Pulse Transformer Driver
The IX4426, IX4427, and IX4428 are dual high-speed,
low-side gate drivers. Each of the two outputs can
source and sink 1.5A of peak current with rise and fall
times of less than 10ns. The inputs of each driver are
TTL and CMOS compatible, and are virtually immune
to latch-up. Low propagation delay times and fast,
matched rise and fall times make the IX4426, IX4427,
and IX4428 ideal for high-frequency and high-power
applications.
The IX4426 is configured as a dual inverting driver;
the IX4427 is configured as a dual non-inverting
driver; and the IX4428 is configured with one inverting
driver and one non-inverting driver. All three devices
are available in a standard 8-pin SOIC package (N
suffix) and an 8-pin DFN package (M suffix).
Ordering Information
Logic Configuration
INA
INB
A
B
Part Number
Package Type
Packing Method
Quantity
IX4426N
8-Pin SOIC
Tube
100
IX4426NTR
8-Pin SOIC
Tape & Reel
2000
IX4426MTR
8-Pin DFN
Tape & Reel
2000
IX4427N
8-Pin SOIC
Tube
100
IX4427NTR
8-Pin SOIC
Tape & Reel
2000
IX4427MTR
8-Pin DFN
Tape & Reel
2000
IX4428N
8-Pin SOIC
Tube
100
IX4428NTR
8-Pin SOIC
Tape & Reel
2000
IX4428MTR
8-Pin DFN
Tape & Reel
2000
OUTA
OUTB
INA
A
OUTA
INB
B
OUTB
INA
A
OUTA
INB
B
OUTB
DS-IX4426-27-28_R06
www.ixysic.com
1
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3
3
3
3
3
4
5
6
2. IX4426-27-28 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 IX4426 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 IX4428 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 IX4427 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7
7
7
7
4. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
www.ixysic.com
11
11
11
11
11
12
R06
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
1 Specifications
1.1 Pin Configurations
1.2 Pin Definitions
IX4426
Pin Name
NC
1
INA
2
GND
3
INB
4
A
B
8
NC
7
OUTA
6
VCC
5
OUTB
IX4427
NC
1
INA
2
GND
3
INB
4
A
B
8
NC
7
OUTA
6
VCC
5
OUTB
Description
INA
Channel A Logic Input
INB
Channel B Logic Input
OUTA
OUTA
Channel A Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
OUTB
OUTB
Channel B Output - Sources or sinks current to
turn on or turn off a discrete MOSFET or IGBT
VCC
Supply Voltage - Provides power to the device
GND
Ground - Common ground reference for the
device
NC
No Connection
IX4428
NC
1
INA
2
GND
3
INB
4
A
B
8
NC
7
OUTA
6
VCC
5
OUTB
1.3 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
Supply Voltage
VCC
Input Voltage
VIN
-0.3
35
V
-5.0
VCC+0.3
Output Current
IOUT
V
-
±1.5
A
Junction Temperature
TJ
-55
+150
°C
Storage Temperature
TSTG
-65
+150
°C
Unless otherwise specified, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Symbol
Minimum
Maximum
Units
VCC
4.5
30
V
Operating Temperature Range
TA
-40
+125
°C
R06
www.ixysic.com
Supply Voltage
3
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
1.5 Electrical Characteristics: TA = 25°C
Test Conditions: 4.5V < VCC < 18V.
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Input Voltage, High
-
VIH
2.4
-
-
Input Voltage, Low
-
VIL
-
-
0.8
0V < VIN < VCC
IIN
-
-
±1
Output Voltage, High
-
VOH
VCC-0.025
-
-
Output Voltage, Low
-
VOL
-
-
0.025
Output Resistance, High State
VCC=18V, IOUT=-100mA
ROH
-
4
8
Output Resistance, Low State
Latch-Up Protection
Rise Time
VCC=18V, IOUT=100mA
ROL
-
2
4
With Reverse Current
VCC=18V, CLOAD=1000pF
I
>500
-
-
tR
-
10
20
Fall Time
VCC=18V, CLOAD=1000pF
tF
-
8
20
On-Time Propagation Delay
VCC=18V, CLOAD=1000pF
ton
-
35
60
Off-Time Propagation Delay
VCC=18V, CLOAD=1000pF
toff
-
35
60
-
2.5
4
-
0.6
0.8
Input Current
Power Supply Current
4
VINA=VINB=3V
VINA=VINB=0V
www.ixysic.com
ICC
Units
V
A
V
mA
ns
mA
R06
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
1.6 Electrical Characteristics: TA = - 40°C to +125°C
Test Conditions: 4.5V < VCC < 18V.
Parameter
Conditions
Symbol
Minimum
Maximum
Input Voltage, High
-
VIH
2.4
-
Input Voltage, Low
-
VIL
-
0.8
0V < VIN < VCC
IIN
-
±1
Output Voltage, High
-
VOH
VCC-0.025
-
Output Voltage, Low
-
VOL
-
0.025
Output Resistance, High State
VCC=18V, IOUT=-100mA
ROH
-
12
Output Resistance, Low State
Latch-Up Protection
Rise Time
VCC=18V, IOUT=100mA
ROL
-
8
With Reverse Current
VCC=18V, CLOAD=1000pF
I
>500
-
tR
-
30
Fall Time
VCC=18V, CLOAD=1000pF
tF
-
30
On-Time Propagation Delay
VCC=18V, CLOAD=1000pF
ton
-
70
Off-Time Propagation Delay
VCC=18V, CLOAD=1000pF
toff
-
70
VINA=VINB=3V
VINA=VINB=0V
ICC
-
6
-
1
Input Current
Power Supply Current
R06
www.ixysic.com
Units
V
A
V
mA
ns
mA
5
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
Units
8-Pin SOIC
Thermal Resistance, Junction-to-Ambient
JA
120
°C/W
8-Pin DFN
Thermal Resistance, Junction-to-Ambient
JA
68
°C/W
2 IX4426-27-28 Performance
2.1 Timing Diagrams
VIH
INx
VIH
INx
VIL
ton
VIL
toff
toff
ton
90%
OUTx
OUTx
10%
90%
10%
tF
tR
tR
tF
Non-Inverting Driver Waveforms
Inverting Driver Waveforms
2.2 Characteristics Test Diagram
VCC
+
0.1μF
10μF
VCC
-
INA
OUTA
INB
OUTB
GND
1000pF
Tektronix
Current Probe
6302
VIN
1000pF
6
www.ixysic.com
Tektronix
Current Probe
6302
R06
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
3 Block Diagrams & Truth Tables
3.1 IX4426
3.3 IX4427
VCC
VCC
OUTA
INA
GND
OUTA
INA
GND
VCC
VCC
OUTB
INB
OUTB
INB
INX
OUTX
INX
OUTX
0
1
0
0
1
0
1
1
3.2 IX4428
VCC
OUTA
INA
GND
VCC
OUTB
INB
R06
INA
OUTA
0
1
1
0
INB
OUTB
0
0
1
1
www.ixysic.com
7
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
4 Performance Data
100
90
80
70
60
50
40
30
20
10
0
CL=4.7nF
CL=1nF
CL=470pF
0
5
10
15
20
Supply Voltage (V)
25
30
Fall Time
CL=4.7nF
CL=1nF
CL=470pF
0
5
10
15
20
Supply Voltage (V)
2000
3000
4000
Load Capacitance (pF)
25
50
40
toff
30
ton
20
10
1000
80
70
60
50
40
toff
30
ton
20
10
15
20
Supply Voltage (V)
Input Threshold (V)
1.85
25
30
5
10
15
Input Voltage (V)
Input Threshold vs. Temperature
(CL=1nF, VCC=18V)
1.70
1.65
1.55
-50
5000
Propagation Delay vs. Temperature
(CL=1nF, VCC=18V)
35
toff
30
ton
25
20
20
-50
0
50
100
Temperature (ºC)
150
Min VIH
1.75
Max VIL
1.60
150
Input Threshold vs. Supply Voltage
(CL=1nF)
1.9
Min VIH
1.80
50
100
Temperature (ºC)
15
0
Input Threshold (V)
5
0
2000
3000
4000
Load Capacitance (pF)
10
0
8
0
5000
Propagation Delay vs. Input Voltage
(CL=1nF, VCC=18V)
90
Propagation Delay (ns)
60
7
-50
30
Propagation Delay (ns)
Propagation Delay vs. Supply Voltage
(CL=1nF, VIN=0V-5V, f=1kHz)
9
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
Fall Time (ns)
Rise Time (ns)
Propagation Delay (ns)
70
1000
Rise Time
10
Fall Time vs Load Capacitance
100
90
80
70
60
50
40
30
20
10
0
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
0
11
8
Rise Time vs. Load Capacitance
100
90
80
70
60
50
40
30
20
10
0
13
Rise Time & Fall Time vs. Temperature
(VIN=0V-5V, CL=1nF, VCC=18V)
12
Fall Time (ns)
Rise Time (ns)
100
90
80
70
60
50
40
30
20
10
0
Fall Time vs. Supply Voltage
(VIN=0V-5V, f=1kHz)
Time (ns)
Rise Time vs. Supply Voltage
(VIN=0V-5V, f=1kHz)
1.8
1.7
Max VIL
1.6
1.5
1.4
1.3
0
50
100
Temperature (ºC)
150
0
www.ixysic.com
5
10
15
20
Supply Voltage (V)
25
30
R06
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
Supply Current vs. Load Capacitance
A&B Outputs Active
(VCC=8V)
1000
Load Capacitance (pF)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
100
50
0
100
Supply Current vs. Frequency
A&B Outputs Active
(CL=1000pF)
80
70
3.0
VCC=30V
VCC=25V
VCC=18V
VCC=12V
VCC=8V
VCC=4.5V
60
50
40
30
Supply Current (mA)
Supply Current (mA)
1000
Load Capacitance (pF)
20
10
0
1
10
100
Frequency (kHz)
1000
40
20
350
1000
Load Capacitance (pF)
Supply Current vs. Load Capacitance
A&B Outputs Active
(VCC=30V)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
250
200
150
100
50
0
100
1000
Load Capacitance (pF)
Quiescent Supply Current
vs. Temperature
(VCC=18V)
1.65
2.0
1.5
1.0
VIN=0V
0.5
0.0
-50
0
50
100
Temperature (ºC)
150
1.60
1.55
1.50
1.45
1.40
-50
0
50
100
Temperature (ºC)
150
Output Sink Current
vs. Supply Voltage
(CL=47nF)
6
-1
10000
Dynamic Supply Current vs. Temperature
Both Outputs Active
(VCC=18V,VIN=0V-5V, f=1kHz, CL=1nF)
VIN=3V to 18V
2.5
10000
300
5
Sink Current (A)
Source Current (A)
60
10000
-2
-3
-4
-5
4
3
2
1
-6
0
0
R06
80
Output Source Current
vs. Supply Voltage
(CL=47nF)
0
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
100
0
100
Supply Current vs. Load Capacitance
A&B Outputs Active
(VCC=18V)
150
120
10000
Supply Current (mA)
Supply Current (mA)
200
140
Supply Current (mA)
Supply Current (mA)
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
Supply Current (mA)
100
90
80
70
60
50
40
30
20
10
0
100
Supply Current vs. Load Capacitance
A&B Outputs Active
(VCC=12V)
5
10
15
20
Supply Voltage (V)
25
30
0
www.ixysic.com
5
10
15
20
Supply Voltage (V)
25
30
9
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
Output Source Current
vs. Temperature
(CL=47nF, VCC=18V)
-2.3
3.4
Sink Current (A)
Source Current (A)
-2.4
-2.5
-2.6
-2.7
-2.8
-3.0
-50
0
50
100
Temperature (ºC)
3.0
2.8
2.4
-50
150
High-State Output Resistance
vs. Supply Voltage
(IOUT=-10mA)
6.5
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
0
50
100
Temperature (ºC)
150
Low-State Output Resistance
vs. Supply Voltage
(IOUT=+10mA)
4.0
6.0
Output Resistance (Ω)
Output Resistance (Ω)
3.2
2.6
-2.9
3.5
3.0
2.5
2.0
1.5
1.0
0
10
Output Sink Current
vs. Temperature
(CL=47nF, VCC=18V)
5
10
15
20
25
Supply Voltage (V)
30
35
0
www.ixysic.com
5
10
15
20
25
Supply Voltage (V)
30
35
R06
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.
We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Classification
IX4426 / IX4427 / IX4428 All Versions
MSL 1
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
5.3 Reflow Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device
Classification Temperature (TC)
Dwell Time (tp)
Max Reflow Cycles
IX4426 / IX4427 / IX4428 All Versions
260°C
30 seconds
3
5.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or
remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to
prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and
providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing
process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature
and duration necessary to remove the moisture trapped within the package is the responsibility of the user
(assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
R06
www.ixysic.com
11
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
5.5 Mechanical Dimensions
5.5.1 “N” Package (8-Pin SOIC)
0.31 / 0.51
(0.012 / 0.020)
8x
TOP VIEW
PCB Land Pattern
1.55
(0.061)
5
5.80 / 6.20
(0.228 / 0.244)
3.75
(0.148)
3.80 / 4.00
(0.150 / 0.157)
A
PIN #1
1.25 MIN
(0.049 MIN)
1.75 MAX
(0.069 MAX)
0.25
(0.010)
1.27
0.05
6x
A
GAUGE PLANE
SEATING PLANE
4
8°- 0°
4.80 / 5.00
(0.189 / 0.197)
0.10 / 0.25
(0.004 / 0.010)
0.60
(0.024)
0.40 / 1.27
(0.016 / 0.050)
Dimensions
MIN / MAX
0.10
(0.004)
0.10 / 0.25
(0.004 / 0.010)
Notes:
1. Controlling dimension: millimeters.
2. All dimensions are in mm (inches).
3. This package conforms to JEDEC Standard MS-012, variation AA, Rev. F.
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.
6. Lead thickness includes plating.
5.5.2 “N” Package Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
K0= 2.10
(0.083)
A0=6.50
(0.256)
P1=8.00
(0.315)
User Direction of Feed
Embossed Carrier
Embossment
12
W=12.00
(0.472)
B0=5.30
(0.209)
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
www.ixysic.com
R06
IX4426-27-28
INTEGRATED CIRCUITS DIVISION
5.5.3 “M” Package (8-Pin DFN)
3.00 BSC
(0.118 BSC)
Recommended PCB Land Pattern
0.85±0.05
(0.033±0.002)
0.203 REF
(0.008 REF)
0.65
(0.026)
3.00
(0.118)
Pin 1
3.00 BSC
(0.118 BSC)
2.05
(0.081)
0.35
(0.014)
1.70
(0.067)
0.80
(0.031)
MIN 0.00 / MAX 0.05
(MIN 0.000 / MAX 0.002)
1.65±0.05
(0.065±0.002)
MIN 0.2
(MIN 0.008)
Dimensions
mm
(inches)
2.00±0.05
(0.079±0.002)
0.30±0.05
(0.012±0.002)
0.65 BSC
(0.026 BSC)
Pin 1
C0.35 x 45º
(C0.014 x 45º)
NOTES:
1. The exposed metal pad on the back of the package should
be connected to GND. Pad is not suitable for carrying current.
2. Terminal width (0.30±0.05) is measured between
0.15mm and 0.30mm from the terminal tip.
3. Bilateral coplanarity zone applies to the exposed
heat sink slug as well as the terminals.
Pin 8
0.40±0.05
(0.016±0.002)
5.5.4 “M” Package Tape & Reel
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
∅1.55 ± 0.05
(0.061 ± 0.002)
4.00 Note #1
(0.157)
2.00 ± 0.05
(0.079 ± 0.002)
0.30 ± 0.05
(0.012 ± 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
5.50 ± 0.05
(0.217 ± 0.002)
Pin 1
B0=3.30
(0.130)
Embossed Carrier
12.00 ± 0.30
(0.472 ± 0.012)
K0=1.10
(0.043)
∅1.50 (MIN)
(∅0.059 MIN)
8.00
(0.315)
A0=3.30
(0.130)
Embossment
NOTES:
1. 10 sprocket hole pitch cumulative tolerance ±0.2
2. Camber not to exceed 1mm in 100mm
3. Material black Advantek Polystyrene
4. A0 and B0 measured on a plane 0.3mm above the bottom of the pocket
5. K0 measured from a plane on the inside bottom of the pocket to the top surface of the carrier
6. Pocket position relative to the sprocket hole measured as true position of pocket, not pocket hole
7. Cover tape width 9.3±0.1mm
User direction of feed
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IX4426-27-28_R06
©Copyright 2017, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/25/2017
R06
www.ixysic.com
13
