IXDD609CI

厂商：
HAMLIN(力特)
封装：
TO220-5
描述：
IXDD609CI

数据手册：

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详情介绍
数据手册
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IXDD609CI 数据手册

IXD_609 9-Ampere Low-Side Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features Description • 9A Peak Source/Sink Drive Current • Wide Operating Voltage Range: 4.5V to 35V • -40°C to +125°C Extended Operating Temperature Range • Logic Input Withstands Negative Swing of up to 5V • Matched Rise and Fall Times • Low Propagation Delay Time • Low, 10A Supply Current • Low Output Impedance The IXDD609/IXDI609/IXDN609 high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. The IXD_609 high-current output can source and sink 9A of peak current while producing voltage rise and fall times of less than 25ns. The input is CMOS compatible, and is virtually immune to latch up. Proprietary circuitry eliminates cross-conduction and current “shoot-through.” Low propagation delay and fast, matched rise and fall times make the IXD_609 family ideal for high-frequency and high-power applications. Applications • • • • • • Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver The IXDD609 is configured as a non-inverting driver with an enable, the IXDN609 is configured as a non-inverting driver, and the IXDI609 is configured as an inverting driver. The IXD_609 family is available in a standard 8-pin DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC with an exposed metal back (SI); an 8-pin DFN (D2); a 5-pin TO-263 (YI); and a 5-pin TO-220 (CI). Ordering Information Part Number IXDD609D2TR IXDD609SI IXDD609SITR IXDD609SIA IXDD609SIATR IXDD609PI IXDD609CI IXDD609YI IXDI609SI IXDI609SITR IXDI609SIA IXDI609SIATR IXDI609PI IXDI609CI IXDI609YI IXDN609SI IXDN609SITR IXDN609SIA IXDN609SIATR IXDN609PI IXDN609CI IXDN609YI DS-IXD_609-R09 Logic Configuration IN OUT EN IN OUT IN OUT Package Type Packing Method Quantity 8-Pin DFN 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 5-Pin TO-220 5-Pin TO-263 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 5-Pin TO-220 5-Pin TO-263 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 5-Pin TO-220 5-Pin TO-263 Tape & Reel Tube Tape & Reel Tube Tape & Reel Tube Tube Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tube 2000 100 2000 100 2000 50 50 50 100 2000 100 2000 50 50 50 100 2000 100 2000 50 50 50 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION IXD_609 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 4 5 2. IXD_609 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 IXDD609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 IXDI609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 IXDN609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 6 6 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 10 10 10 10 10 11 R09 IXD_609 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IXDD609 D2 / PI / SI / SIA IXDD609 CI / YI Pin Name VCC 1 8 VCC IN 2 7 OUT EN 3 6 OUT GND 4 5 GND VCC 1 OUT 2 GND 3 IN 4 EN 5 IXDI609 PI / SI / SIA VCC 1 8 VCC IN 2 7 OUT NC GND 3 6 OUT 4 5 GND IN NC GND 1 2 8 7 VCC OUT 3 6 OUT 4 5 GND IN Logic Input EN Output Enable - Drive pin low to disable output, and force output to a high impedance state OUT Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUT Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDI609 CI / YI VCC 1 OUT 2 GND 3 IN 4 NC 5 IXDN609 PI / SI / SIA VCC Description NC IXDN609 CI / YI VCC 1 OUT 2 GND 3 IN 4 NC 5 Not connected 1.3 Absolute Maximum Ratings Parameter Supply Voltage Input Voltage Output Current Junction Temperature Storage Temperature Symbol Minimum Maximum Units VCC -0.3 40 V VIN, VEN -5 VCC+0.3 V IOUT TJ TSTG - ±9 -55 +150 A °C -65 +150 °C Unless stated otherwise, absolute maximum electrical ratings are at 25°C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range R09 Symbol Range Units VCC TA 4.5 to 35 V -40 to +125 °C www.ixysic.com 3 IXD_609 INTEGRATED CIRCUITS DIVISION 1.5 Electrical Characteristics: TA = 25°C Test Conditions: 4.5V < VCC < 35V (unless otherwise noted). Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 0V < VIN < VCC IIN ±10 A IXDD609 only VENH 2/3VCC - EN Input Voltage, High - EN Input Voltage, Low IXDD609 only VENL - V Output Voltage, High - VOH VCC-0.025 1/3VCC - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-100mA ROH - 0.6 1 Output Resistance, Low State ROL - 0.4 0.8 IDC - - ±2 Rise Time VCC=18V, IOUT=100mA Limited by package power dissipation VCC=18V, CLOAD=10nF tr - 22 35 Fall Time VCC=18V, CLOAD=10nF tf - 15 25 On-Time Propagation Delay VCC=18V, CLOAD=10nF tondly - 40 60 Off-Time Propagation Delay Enable to Output-High Delay Time (IXDD609 Only) Disable to High Impedance State Delay Time (IXDD609 Only) Enable Pull-Up Resistor VCC=18V, CLOAD=10nF toffdly - 42 60 tENOH - 25 60 tDOLD - 35 60 REN - 200 1

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IXDD609CI

物料型号：IXD_609系列，包括IXDD609、IXDI609、IXDN609，有不同的配置和封装类型。

器件简介：IXD_609系列是高速栅极驱动器，专为驱动IXYS MOSFETs和IGBTs设计，提供高达9A的峰值源/汇驱动电流，并具有小于25ns的电压升降时间。

引脚分配：文档中详细列出了不同封装类型的引脚配置和定义。

参数特性： - 宽工作电压范围：4.5V至35V - 扩展工作温度范围：-40°C至+125°C - 逻辑输入可承受高达5V的负电压 - 匹配的上升和下降时间 - 低传播延迟时间 - 低供电电流：10μA - 低输出阻抗

功能详解：IXD_609系列具有防交叉传导和电流“shoot-through”的专有电路，适用于高频和高功率应用。

应用信息：适合于高效功率MOSFET和IGBT开关、开关电源、电机控制、DC-DC转换器、Class-D开关放大器、脉冲变压器驱动等应用。

封装信息：提供多种封装选项，包括8引脚DIP、8引脚SOIC、8引脚Power SOIC（带暴露金属背板）、8引脚DFN、5引脚TO-263和5引脚TO-220。

订购信息：列出了不同逻辑配置、封装类型、包装方法和数量的部件编号。

电气特性：在25°C下，提供了输入电压、输入电流、输出电压、输出电阻、连续输出电流、上升时间、下降时间、传播延迟等参数的最小、典型和最大值。

热特性：提供了不同封装类型的热阻抗，包括结到环境和结到外壳的热阻抗。