IXDN604SIA

IXD_604 4-Ampere Dual Low-Side Ultrafast MOSFET Drivers INTEGRATED CIRCUITS DIVISION Features Description • 4A Source/Sink Drive Current • Wide Operating Voltage Range: 4.5V to 35V • -40°C to +125°C Extended Operating Temperature Range • Logic Input Withstands Negative Swing of up to 5V • Outputs May be Connected in Parallel for Higher Drive Current • Matched Rise and Fall Times • Low Propagation Delay Time • Low, 10A Supply Current • Low Output Impedance The IXDD604/IXDF604/IXDI604/IXDN604 dual high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. Each of the two outputs can source and sink 4A of current while producing voltage rise and fall times of less than 10ns. The input of each driver is virtually immune to latch up, and proprietary circuitry eliminates cross conduction and current “shoot-through.” Low propagation delay and fast, matched rise and fall times make the IXD_604 family ideal for high-frequency and high-power applications. Applications • • • • • • Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver The IXDD604 is a dual non-inverting driver with an enable. The IXDN604 is a dual non-inverting driver, the IXDI604 is a dual inverting driver, and the IXDF604 has one inverting driver and one non-inverting driver. The IXD_604 family is available in a standard 8-pin DIP (PI), 8-pin SOIC (SIA), 8-pin Power SOIC with an exposed metal back (SI), and an 8-pin DFN (D2) package. Ordering Information Part Number IXDD604D2TR IXDD604PI IXDD604SI IXDD604SITR IXDD604SIA IXDD604SIATR IXDF604PI IXDF604SI IXDF604SITR IXDF604SIA IXDF604SIATR IXDI604PI IXDI604SI IXDI604SITR IXDI604SIA IXDI604SIATR IXDN604PI IXDN604SI IXDN604SITR IXDN604SIA IXDN604SIATR DS-IXD_604-R09 Logic Configuration ENA A OUTA B OUTB INA A OUTA INB B OUTB INA A OUTA INB B OUTB INA A OUTA INB B OUTB INA ENB INB Package Type Packing Method Quantity 8-Pin DFN 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel 2000 50 100 2000 100 2000 50 100 2000 100 2000 50 100 2000 100 2000 50 100 2000 100 2000 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION IXD_604 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: -40°C < TA < +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 3 4 4 5 2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 IXDD604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 IXDI604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 IXDF604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 IXDN604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 6 6 6 4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 www.ixysic.com 10 10 10 10 10 11 R09 IXD_604 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IXDD604PI/SI/SIA ENA 1 INA 2 GND 3 INB 4 A B IXDD604D2 8 ENB ENA 1 7 OUTA INA 2 6 VCC INB 3 5 OUTB ENB 4 IXDI604PI/SI/SIA NC 1 INA 2 GND 3 INB 4 A B Pin Name Description 8 OUTA A 7 GND INA Channel A Logic Input B 6 VCC INB Channel B Logic Input 5 OUTB ENA Channel A Enable Input Drive pin low to disable Channel A and force Channel A Output to a high impedance state ENB Channel B Enable Input Drive pin low to disable Channel A and force Channel A Output to a high impedance state OUTA OUTA Channel A Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUTB OUTB Channel B Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDF604PI/SI/SIA 8 NC NC 1 7 OUTA INA 2 6 VCC GND 3 5 OUTB INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB IXDN604PI/SI/SIA NC 1 INA 2 GND 3 INB 4 A B 8 NC 7 OUTA 6 VCC 5 OUTB 1.3 Absolute Maximum Ratings Parameter Symbol Minimum Maximum Units VCC -0.3 40 V VINx , VENx -5 VCC+0.3 V IOUT - ±4 A Iout_pulsed - ±5 A Junction Temperature TJ -55 +150 °C Storage Temperature TSTG -65 +150 °C Supply Voltage Input Voltage Output Current Output Pulsed Current (0.5s) Absolute maximum electrical ratings are at 25°C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 1.4 Recommended Operating Conditions Parameter Symbol Range Units VCC 4.5 to 35 V Operating Temperature Range TA -40 to +125 °C R09 www.ixysic.com Supply Voltage 3 IXD_604 INTEGRATED CIRCUITS DIVISION 1.5 Electrical Characteristics: TA = 25°C Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted). Conditions Symbol Minimum Input Voltage, High Parameter 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 0V < VIN < VCC IIN ±10 A IXDD604 only VENH 2/3VCC - High EN Input Voltage - Low EN Input Voltage IXDD604 only VENL - V Output Voltage, High - VOH VCC-0.025 1/3VCC - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - 1.3 2.5 Output Resistance, Low State ROL - 1.1 2 IDC - - ±1 Rise Time VCC=18V, IOUT=10mA Limited by package power dissipation VCC=18V, CLOAD=1000pF tr - 9 16 Fall Time VCC=18V, CLOAD=1000pF tf - 8 14 On-Time Propagation Delay VCC=18V, CLOAD=1000pF tondly - 29 50 Off-Time Propagation Delay VCC=18V, CLOAD=1000pF toffdly - 35 50 Enable to Output-High Delay Time IXDD604 only, VCC=18V tENOH - 35 55 Disable to High Impedance State Delay Time IXDD604 only, VCC=18V tDOLD - 40 55 VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC REN - 200 1