LBA716

LBA716 60V, 1A Dual Single-Pole Relays: 1-Form-A (NO) & 1-Form-B (NC) INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 60 1 0.4 Units V Arms / ADC  Description LBA716 is a 60V, 1A, 0.4 dual Solid State Relay integrating independent normally open (1-Form-A) and normally closed (1-Form-B) relays into a single package. It features a superior combination of low on-resistance and enhanced peak load current (5A max.) handling capability. Features • • • • • • • 3750Vrms Input/Output Isolation Low Drive Power Requirements No EMI/RFI Generation Small 8-Pin Package Flammability Rating UL 94 V-0 Surface Mount Version Tape & Reel available Approvals • UL Recognized Component: File # E76270 • CSA Certified Component: Certificate # 1175739 • TUV EN 62368-1: Certificate # B 082667 0008 Ordering Information Applications • • • • • • • • • • Telecommunications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Utility Meters (gas, oil, electric and water) Medical Equipment-Patient/Equipment Isolation Security Industrial Controls Part # LBA716 LBA716S LBA716STR Description 8-Pin DIP (50/Tube) 8-Pin Surface Mount (50/Tube) 8-Pin Surface Mount (1000/Reel) Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton Pin Configuration + Control - Normally Closed – Control - Normally Closed + Control - Normally Open – Control - Normally Open Switching Characteristics of Normally Closed Devices 1 8 2 7 3 6 4 5 Normally Closed Form-B IF Normally Open ILOAD 10% toff DS-LBA716-R05 toff www.ixysic.com 90% ton 1 INTEGRATED CIRCUITS DIVISION LBA716 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage, Input to Output Operational Temperature, Ambient Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate output power linearly 6.67 mW / ºC Ratings 60 5 50 1 Units VP V mA A 150 800 3750 -40 to +85 -40 to +125 mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ 25ºC Parameter Conditions Characteristics: Form-A (Normally Open) Blocking Voltage IL=1A Load Current Continuous Peak t < 10ms On-Resistance IL=1A Off-State Leakage Current VL=60V Output Capacitance IF=0mA, V=50V, f=1MHz Switching Speeds Turn-On IF=5mA, VL=10V Turn-Off Input Control Current to Activate IL=1A Input Control Current to Deactivate Characteristics: Form-B (Normally Closed) Load Current Continuous Peak t < 10ms On-Resistance IL=0.5A Off-State Leakage Current VL=60V, IF=5mA Output Capacitance IF=2mA, V=50V, f=1MHz Switching Speeds Turn-On IF=5mA, VL=10V Turn-Off Input Control Current to Activate Input Control Current to Deactivate IL=0.5A Common Characteristics: Form-A and Form-B Input Voltage Drop IF=5mA Reverse Input Current VR=5V Capacitance, Input to Output VIO=0V, f=1MHz Symbol Min Typ Max Units VDRM 60 - - VP IL - - 1 Arms / ADC ILPK RON ILEAK COUT - 0.21 105 ±5 0.4 1 - AP  A pF ton toff IF IF 0.1 0.7 0.09 - 5 5 2 - mA mA ms IL - - 0.5 Arms / ADC ILPK RON ILEAK COUT - 1.63 280 ±1.2 2 1 - AP  A pF ton toff IF IF 0.1 0.58 0.76 - 5 5 2 - mA mA VF IR CIO 0.9 - 1.36 3 1.5 10 - V A pF ms *NOTE: If both poles operate simultaneously, then load current must be derated so as not to exceed the package power dissipation value. 2 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LBA716 Form-A RELAY PERFORMANCE DATA* 25 15 10 5 15 10 5 0.69 0.73 0.77 0.81 LED Forward Current (mA) 0.95 10 5 Form-A Typical Turn-On Time vs. LED Forward Current (IL=100mA) 0 20 40 60 Temperature (ºC) 80 600 400 Turn-Off Time (Ps) 2.0 1.5 1.0 0.5 -40 IF=5mA -20 0 20 40 60 Temperature (ºC) 90 100 77.4 77.3 50 0 Form-A Typical Turn-Off Time vs. Temperature (IL=100mA) 80 IF=5mA 75 70 IF=2mA 65 60 55 80 77.5 77.1 10 20 30 40 LED Forward Current (mA) 85 IF=2mA 77.6 77.2 0 Form-A Typical Turn-On Time vs. Temperature (IL=100mA) 68.0 77.7 800 100 66.0 66.5 67.0 67.5 Blocking Voltage (VP) Form-A Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 77.8 0 -20 5 65.5 200 0.70 -40 10 0.211 Turn-Off Time (Ps) Turn-On Time (Ps) 0.75 15 0 0.207 0.208 0.209 0.210 On-Resistance (:) 1000 0.80 0.102 20 15 1200 0.85 0.082 0.087 0.092 0.097 Turn-Off Time (ms) Form-A Typical Blocking Voltage (N=50) 20 0.206 0.90 5 0.077 Form-A Typical On-Resistance (N=50, IF=5mA, IL=1A) 0.85 Form-A Typical IF for Switch Operation vs. Temperature (IL=200mA) 10 0.77 0 0.65 15 0 0.61 0.65 0.69 0.73 Turn-On Time (ms) 25 Device Count (N) Device Count (N) 5 0.57 0 LED Current (mA) 10 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Form-A Typical IF for Switch Operation (N=50, IL=200mA) 20 Turn-On Time (ms) 15 Device Count (N) 1.364 2.5 20 0 0 Form-A Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 20 Device Count (N) Device Count (N) Device Count (N) 25 20 Form-A Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 50 -40 -20 0 20 40 60 Temperature (ºC) 0.26 AC On-Resistance (:) 30 Typical LED Forward Voltage Drop (N=50, IF=5mA) 80 100 10 20 30 40 LED Forward Current (mA) 50 Form-A Typical On-Resistance (AC) vs. Temperature (IL=500mA, IF=5mA) 0.24 0.22 0.20 0.18 0.16 0.14 0.12 -40 -20 0 20 40 60 Temperature (ºC) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LBA716 Form-A RELAY PERFORMANCE DATA* 1.0 Form-A Maximum Load Current vs. Temperature (IF=5mA) Form-A Typical Load Current vs. Load Voltage (IF=5mA) 70 1.2 Load Current (A) Current (A) 0.0 -0.5 Blocking Voltage (VP) 1.0 0.5 0.8 0.6 0.4 0.2 -1.0 -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 Voltage (V) 0 20 40 60 Temperature (ºC) Form-A Typical Leakage vs. Temperature Measured Across Pins 5 & 6 (VL=60V) 80 68 67 66 65 64 63 100 -20 0 20 40 60 Temperature (ºC) 80 100 Form-A Energy Rating Curve 6 5 15 Load Current (A) Leakage Current (nA) 20 -20 69 62 -40 0.0 -40 Form-A Typical Blocking Voltage vs. Temperature 10 5 4 3 2 1 0 -40 -20 0 20 40 60 Temperature (ºC) 80 100 0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s Form-B RELAY PERFORMANCE DATA* 30 Typical LED Forward Voltage Drop (N=50, IF=5mA) Form-B Typical Turn-On Time (N=50, IF=5mA, IL=100mA) 20 25 15 10 Device Count (N) Device Count (N) Device Count (N) 25 20 15 10 5 5 0.507 Form-B Typical IF for Switch Operation (N=50, IL=200mA) 20 15 10 5 0.530 0.553 0.576 0.599 Turn-On Time (ms) 0.16 0.17 0.18 0.19 0.20 LED Forward Current (mA) 0.21 10 5 0.63 15 10 5 0.67 0.71 0.75 0.79 Turn-Off Time (ms) 0.83 Form-B Typical Blocking Voltage (N=50, IF=5mA) 20 0 0 15 0.622 Form-B Typical On-Resistance (N=50, IF=0mA, IL=5mA) 20 Device Count (N) Device Count (N) 25 1.366 1.368 1.370 1.372 LED Forward Voltage Drop (V) Device Count (N) 1.364 20 0 0 0 Form-B Typical Turn-Off Time (N=50, IF=5mA, IL=100mA) 15 10 5 0 1.49 1.53 1.57 1.61 1.65 On-Resistance (:) 1.69 75 76 77 78 79 Blocking Voltage (VP) 80 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LBA716 Form-B RELAY PERFORMANCE DATA* Form-B Typical IF for Switch Operation vs. Temperature (IL=100mA) 0.40 423 0.25 0.20 0.15 420 419 0 20 40 60 Temperature (ºC) 80 100 1.5 1.0 0.5 0 0 Form-B Typical Turn-On Time vs. Temperature (IL=100mA) 10 20 30 40 LED Forward Current (mA) 0 50 Form-B Typical Turn-Off Time vs. Temperature (IL=100mA) 4.5 1.8 4.0 600 500 400 IF=2mA 300 IF=5mA 200 3.5 IF=2mA 3.0 2.5 2.0 1.5 IF=5mA 1.0 20 40 60 Temperature (ºC) 80 -40 100 Form-B Typical Load Voltage vs. Load Current (IF=0mA) -20 0 20 40 60 Temperature (ºC) 80 100 Load Current (A) 0.0 -0.2 -0.4 0.4 0.3 0.2 0.1 -0.6 -1.0 -0.8 -0.5 -0.3 0.0 0.3 Voltage (V) 0.8 1.0 -40 -20 0 20 40 60 Temperature (ºC) Form-B Typical Leakage vs.Temperature Measured Across Pins 7&8 (IF=5mA, VL=60V) 1.1 -40 -20 80 100 0 20 40 60 Temperature (ºC) 80 100 Form-B Typical Blocking Voltage vs. Temperature (IF=5mA) 92 90 88 86 84 82 80 -40 -20 0 20 40 60 Temperature (ºC) 80 100 1.5 300 1.3 250 200 150 100 1.1 0.9 0.7 0.5 50 0 -40 1.3 Form-B Energy Rating Curve Load Current (A) Leakage Current (nA) 350 0.0 0.5 1.4 94 0.5 0.2 1.5 Form-B Maximum Load Current vs. Temperature (IF=0mA) 0.6 0.4 Form-B Typical On-Resistance vs. Temperature (IF=0mA, IL=100mA) 1.6 Blocking Voltage (VP) 0 50 1.2 0.5 -20 10 20 30 40 LED Forward Current (ma) 1.7 On-Resistance (:) Turn-Off Time (ms) 700 100 -40 2.0 417 -20 800 Turn-On Time (Ps) 421 418 0.10 -40 Current (A) Turn-Off Time (ms) 0.30 Form-B Typical Turn-Off Time vs. LED Forward Current (IL=100mA) 2.5 422 Turn-On Time (Ps) LED Current (mA) 0.35 0.6 Form-B Typical Turn-On Time vs. LED Forward Current (IL=100mA) -20 0 20 40 60 Temperature (ºC) 80 100 0.3 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LBA716 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification LBA716S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the IPC/JEDEC J-STD-020 Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. Device Classification Temperature (Tc) Dwell Time (tP) Max Reflow Cycles LBA716S 250ºC 30 seconds 3 For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. Device LBA716 Maximum Pin Temperature 260ºC Maximum Body Temperature 250ºC Maximum Dwell Time 10 seconds* Wave Cycles 1 *Total cumulative duration of all waves. Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 6 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION LBA716 Mechanical Dimensions LBA716 2.540 ± 0.127 (0.100 ± 0.005) 9.652 ± 0.381 (0.380 ± 0.015) 8-0.762 DIA. (8-0.030 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 3.302 ± 0.051 (0.130 ± 0.002) 7.620 ± 0.127 (0.300 ± 0.005) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 ± 0.0127 (0.010 ± 0.0005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) LBA716S PCB Land Pattern 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 9.525 ± 0.254 (0.375 ± 0.010) 0.457 ± 0.076 (0.018 ± 0.003) 2.54 (0.10) 8.90 (0.3503) 1.65 (0.0649) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 0.65 (0.0255) 4.445 ± 0.127 (0.175 ± 0.005) Dimensions mm (inches) 0.813 ± 0.102 (0.032 ± 0.004) R05 www.ixysic.com 7 INTEGRATED CIRCUITS DIVISION LBA716 LBA716STR Tape & Reel 2.0 (0.08) 4.0 (0.16) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 7.5 (0.30) Bo=10.30 (0.406) K0 =4.90 (0.193) K1 =4.20 (0.165) Embossed Carrier Embossment 16.0±0.3 (0.63±0.012) Ao=10.30 (0.406) P1=12.00 (0.472) User Direction of Feed Dimensions mm (inches) NOTES: 1. Dimensions carry tolerances of EIA Standard 481-2 2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 3. Controlling dimension: mm For additional information please visit our website at: https://www.ixysic.com Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics. 8 Specification: DS-LBA716-R05 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved. Printed in USA. 10/27/2021