Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
MAC08BT1, MAC08MT1
Pb
Description
Designed for high volume, low cost, industrial and
consumer applications such as motor control; process
control; temperature, light and speed control.
Features
• Sensitive Gate Trigger
Current in Four Trigger
Modes
• Blocking Voltage to 600
Volts
• Glass Passivated Surface
for Reliability and
Uniformity
• Surface Mount Package
• Pb−Free Packages are
Available
Functional Diagram
Pin Out
4
MT 1
MT 2
G
1
2
3
Additional Information
Datasheet
Resources
Samples
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Maximum Ratings (TJ = 25°C unless otherwise noted)
Rating
Peak Repetitive Off-State Voltage (Note 1)
(Gate Open, Sine Wave 50 to 60 Hz, TJ = -40° to 110°C)
Symbol
Value
Unit
VDRM,
VRRM
200
600
V
IT
0.8
A
8.0
A
A²sec
MAC08BT1
MAC08MT1
On-State RMS Current (Full Cycle Sine Wave, 60 Hz, TC = 80°C)
(RMS)
Peak Non-Repetitive Surge Current
(One Full Cycle Sine Wave, 60 Hz, TC= 25°C)
ITSM
Circuit Fusing Consideration (t = 8.3 msec)
I2t
0.4
Peak Gate Power (Pulse Width ≤ 10 µsec, TC= 80°C)
PGM
5.0
W
Average Gate Power (t = 8.3 msec, TC= 80°C)
PG(AV)
0.1
W
Operating Junction Temperature Range
TJ
-40 to +110
°C
Storage Temperature Range
Tstg
-40 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended
exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential
on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
Thermal Characteristics
Rating
Symbol
Value
Unit
Thermal Resistance, Junction−to−Ambient PCB Mounted per Figure 1
R8JA
156
°C/W
2. These ratings are applicable when surface mounted on the minimum pad sizes recommended.
3. 1/8" from case for 10 seconds.
Electrical Characteristics - OFF (TC = 25°C unless otherwise noted)
Characteristic
TJ = 25°C
TJ = 110°C
†Peak Repetitive Blocking Current
(VAK = VDRM = VRRM; Gate Open)
Symbol
Min
Typ
Max
IDRM,
IRRM
-
-
10
Unit
µA
-
-
200
mA
Electrical Characteristics - ON (TC = 25°C unless otherwise noted; Electricals apply in both directions)
Characteristic
Symbol
Min
Typ
Max
Peak On−State Voltage (Note 2) (ITM = ±1.1 A)
VTM
−
−
1.9
V
Gate Trigger Current (Continuous dc)
IGT
–
–
10
mA
IH
−
−
5.0
mA
VGT
–
–
2.0
V
(VD = 12 V, RL = 100 Ω)
Holding Current (VD = 12 V, Gate Open, Initiating Current = ±20 mA))
Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100 Ω)
Unit
2. Pulse Test: Pulse Width ≤ 2.0 ms, Duty Cycle ≤ 2%.
Dynamic Characteristics
Characteristic
Critical Rate of Rise of Commutation Voltage
(f = 250 Hz, ITM = 1.0 A, Commutating di/dt = 1.5 A/mS
On−State Current Duration = 2.0 mS, VDRM = 200 V,
Gate Unenergized, TC = 110°C,
Gate Source Resistance = 150 Ω, See Figure 10)
Critical Rate of Rise of Off-State Voltage
(VD = 0.67 x VDRM, Exponential Waveform, Gate Open, TJ = 110°C)
Symbol
Min
Typ
Max
Unit
(dI/dt)c
1.5
−
−
A/ms
dV/dt
10
−
−
V/µs
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Voltage Current Characteristic of SCR
Symbol
Parameter
VDRM
Peak Repetitive Forward Off State Voltage
IDRM
Peak Forward Blocking Current
VRRM
Peak Repetitive Reverse Off State Voltage
IRRM
Peak Reverse Blocking Current
VTM
Maximum On State Voltage
IH
+Current
Quadrant 1
Main Terminal 2+
VTM
On State
IH
IRRM at VRRM
Holding Current
Quadrant 3
Main Terminal 2-
+Voltage
Off State
IH
IDRM at VDRM
VTM
Figure 1. PCB for Thermal Impedance and Power Testing
of SOT-223
Quadrant Definitions for a Triac
0.15
3.8
MT2 Positive
0.079
2.0
(Positive Half Cycle)
+
(+) MT 2
0.091
2.3
(+) MT 2
0.091
2.3
0.244
6.2
0.079
2.0
Quadrant II
(-) IGT
Gate
(-) IGT
Gate
MT 1
Quadrant I
MT 1
REF
REF
(-) MT 2
(-) MT 2
IGT
Quadrant III
+
(-) IGT
Gate
(-) IGT
Gate
MT 1
REF
0.059
1.5
0.984
25.0
0.059
1.5
0.059
1.5
inches
mm
IGT
0.096
2.44
Quadrant IV
MT 1
REF
MT2 Negative
(Negative Half Cycle)
0.096
2.44
0.096
2.44
0.059
1.5
0.059
1.5
0.472
12.0
BOARD MOUNTED VERTICALLY IN CINCH 8840 EDGE CONNECTOR.
BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL.
MATERIAL: G10 FIBERGLASS BASE EPOXY
All Polarities are referenced to MT1.
With in-phase signals (using standard AC lines) quadrants I and III are used
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Figure 3. Junction to Ambient Thermal Resistance vs.
Copper Tab Area
IT, INSTANTANEOUS ON-STATE CURRENT (AMPS)
Figure 2. On-State Characteristics
10
1.0
0.1
TYPICAL AT TJ = 110°C
MAX AT TJ = 110°C
MAX AT TJ = 25°C
0.01
0
1.0
2.0
3.0
4.0
vT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)
5.0
T A, MAXIMUM ALLOWABLEAMBIENT TEMPERATURE (° C)
Figure 4. Current Derating, Minimum Pad Size Reference:
Ambient Temperature
Figure 5. Current Derating, 1.0 cm Square Pad Reference:
Ambient Temperature
110
α
100
30°
90
α
60°
90°
80
α = CONDUCTION
ANGLE
dc
70
α = 180°
60
120°
50
MINIMUM FOOTPRINT
50 OR 60 Hz
40
30
20
0
0.4
0.1
0.2
0.3
IT(RMS), RMS ON-STATE CURRENT (AMPS)
0.5
Figure 6. Current Derating, 2.0 cm Square Pad Reference:
Ambient Temperature
Figure 7. Current Derating Reference: MT2 Tab
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Figure 9. Thermal Response, Device Mounted on Figure 1
Printed Circuit Board
Figure 8. Power Dissipation
Figure 10. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Current (di/dt)
Figure 11. Typical Commutating dv/dt versus Current Crossing
Rate and Junction Temperature
Figure 12. Typical Commutating dv/dt versus Junction
Temperature at 0.8 Amps RMS
10
10
60 Hz
60°
80°
180 Hz
COMMUTATING dv/dt
dv/dtc , (V/µ S)
COMMUTATING dv/dt
dv/dtc , (V/µ S)
400 Hz
110°
ITM
100°
tw
f=
1.0
1.01
VDRM
1
2 tw
(di dt)c
TM
1000
di/dtc, RATE OF CHANGE OF COMMUTATING CURRENT (A/mS)
0
1.0
60
300 Hz
VDRM = 200V
70
80
90
100
TJ, JUNCTION TEMPERATURE (°C)
110
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
60
600 V pk
TJ = 110°C
STATIC dv/dt (V/µ s)
50
MAIN TERMINAL #2
POSITIVE
40
Figure 14. Typical Gate Trigger Current Variation
10
I GT , GATE TRIGGER CURRENT (mA)
Figure 13. Exponential Static dv/dt versus Gate −
Main Terminal 1 Resistance
MAIN TERMINAL #1
POSITIVE
20
10
100
10,000
1000
0.1
RG
Figure 15. Typical Holding Current Variation
IGT4
IGT1
40
60
80
0
TJ, JUNCTION TEMPER ATURE (°C)
Figure 16. Gate Trigger Voltage Variation
6.0
1.1
VGT , GATE TRIGGER VOLTAGE (VOLTS)
IH, HOLDING CURRENT (mA)
IGT2
1.0
30
5.0
4.0
MAIN TERMINAL #2
POSITIVE
3.0
2.0
MAIN TERMINAL #1
POSITIVE
1.0
0
IGT3
02
01
40
60
TJ, JUNCTION TEMPERATURE (°C)
80
00
0.3
VGT3
VGT4
VGT2
VGT1
02
01
40
60
80
00
TJ, JUNCTION TEMPERATURE (°C)
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
Thyristors
Surface Mount – 200V - 600V > MAC08BT1, MAC08MT1
Dimensions
Part Marking System
D
b1
4
SOT-223
Case 318E
Style 11
4
HE
12
E
3
AC08X
x
Y
M
A
XX
G
e
C
A
Dim
A1
L1
Inches
Millimeters
=Device Code
=D, M, or N
=Year
=Month
=Assembly Site
=Lot Serial Code
=Pb-Free Package
Soldering Footprint
Min
Nom
Max
Min
Nom
Max
---
---
0.071
---
---
1.80
A1
0.001
0.003
0.005
0.02
0.07
0.13
b
0.026
0.030
0.033
0.66
0.75
0.84
b1
0.114
0.118
0.122
2.90
3.00
3.10
A
3
2
1
b
e1
0.08 (0003)
AC08x
YMAXX
c
0.009
0.011
0.014
0.23
0.29
0.35
D
0.260
0.260
0.264
6.60
6.60
6.71
E
0.130
0.138
0.146
3.30
3.50
3.70
e
---
0.091
---
---
2.30
---
e1
0.030
0.037
0.045
0.75
0.95
1.15
L1
0.059
0.069
0.079
1.50
1.75
2.00
HE
0.268
0.276
0.283
6.80
7.00
7.20
ø
0°
---
10°
0°
---
10°
3. 8
0.15
2. 0
0.079
2. 3
0.091
6. 3
0.24 8
2. 3
0.091
2. 0
0.079
1. 5
0.059
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
SCALE 6:
1
mm
in ch es
Ordering Information
Device
Pin Assignment
1
Main Terminal 1
Package Type
Shipping
MAC08BT1
SOT−223
1000 / Tape & Reel
SOT−223
(Pb−Free)
1000 / Tape & Reel
2
Main Terminal 2
MAC08BT1G
3
Gate
MAC08MT1
SOT−223
1000 / Tape & Reel
4
Main Terminal 2
MAC08MT1G
SOT−223
(Pb−Free)
1000 / Tape & Reel
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete
Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 07/25/19
