Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
MCR716, MCR718
Pb
Description
Designed for high volume, low cost, industrial and
consumer applications such as motor control; process
control; temperature, light and speed control.
Features
• Small Size
• Passivated Die for Reliability and Uniformity
• Low Level Triggering and Holding Characteristics
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B > 8000 V
Machine Model, C > 400 V
• Pb−Free Packages are Available
Pin Out
Functional Diagram
4
4
1 2
3
G
A
1
2
3
K
Additional Information
Datasheet
Resources
Samples
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
Maximum Ratings (TJ = 25°C unless otherwise noted)
Rating
Symbol
Peak Repetitive Off−State Voltage (Note 1)
(TJ =− 40 to 125°C, Sine Wave, 50 to 60 Hz, Gate Open)
VDRM,
VRRM
MCR716
Unit
400
V
600
MCR718
On-State RMS Current (All Conduction Angles; TC = 90°C)
Value
IT
4.0
A
IT(AV)
2.6
A
ITSM
25
A
I 2t
2.6
A²sec
PGM
0.5
W
Forward Average Gate Power (t = 8.3 msec, TC = 90°C)
PGM (AV)
0.1
W
Forward Peak Gate Current (Pulse Width ≤ 1.0 µsec, TC= 90°C)
IGM
0.2
A
Operating Junction Temperature Range
TJ
-40 to +110
°C
Storage Temperature Range
Tstg
-40 to +150
°C
Average On−State Current (180° Conduction Angles; TC = 90°C)
Peak Non-Repetitive Surge Current
(1/2 Cycle, Sine Wave 60 Hz, TJ = 110°C)
(RMS)
Circuit Fusing Consideration (t = 8.3 ms)
Forward Peak Gate Power (Pulse Width ≤ 10. µsec,TC = 90°C)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is
not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent
with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
Thermal Characteristics
Rating
Symbol
Value
Thermal Resistance, Junction−to−Case
R8JC
3.0
Thermal Resistance, Junction−to−Ambient (Note 2)
R8JA
80
TL
260
Maximum Lead Temperature for Soldering Purposes 1/8" from Case for
10 Seconds
Unit
°C/W
°C
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
Electrical Characteristics - OFF (TJ = 25°C unless otherwise noted)
Characteristic
Peak Repetitive Forward or Reverse Blocking Current
(Note 3) (VAK = Rated VDRM or VRRM, RGK = 1.0 kΩ
Symbol
Min
Typ
Max
TJ = 25°C
IDRM,
-
-
10
TJ = 110°C
IRRM
-
-
200
Unit
µA
Electrical Characteristics - ON (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Peak Reverse Gate Blocking Voltage (IGR = 10 µA)
VGRM
10
12.5
18
V
Peak Reverse Gate Blocking Current (VGR = 10 V)
IRGM
−
−
1.2
µA
−
1.3
1.5
−
1.5
2.2
1.0
25
75
_
_
300
0.3
0.55
0.8
−
−
1.0
0.2
−
−
0.4
1.0
5.0
−
−
10
−
−
5.0
−
−
10
2.0
5.0
(ITM = 5.0 A Peak)
Peak Forward On−State Voltage (Note 4)
(ITM = 8.2 A Peak)
(TJ = 25°C)
Gate Trigger Current (Continuous dc) (Note 5)
(VAK = 12 Vdc, RL = 30 Ω)
(TJ = −40°C)
V
VTM
IGT
µA
( TJ = 25°C)
Gate Trigger Voltage (Continuous dc)
(VD = 12 VDC, RL = 30 Ω) (Note 5)
(TJ = −40°C)
VGT
(TJ = 110°C)
Holding Current
( TJ = 25°C)
(VD = 12 V, Initiating Current = 200 mA, RGK = 1 kΩ)
(TJ = −40°C)
Latching Current
IH
(VD = 12 VDC, IG = 2.0 mA,TC = 25°C)
IL
(VD = 12 VDC, IG = 2.0 mA,TC = -40°C)
Total Turn−On Time
(Source Voltage = 12 V, RS = 6.0 kΩ, IT = 8 A(pk), RGK = 1.0 kΩ)
(VD = Rated VDRM, Rise Time = 20 ns, Pulse Width = 10 µs)
tgt
_
V
mA
mA
µs
Dynamic Characteristics
Characteristic
Symbol
Min
Typ
Max
Unit
Critical Rate of Rise of Off−State Voltage
(VD = 0.67 X Rated VDRM, Exponential Waveform, RGK = 1.0 kQ, TJ = 110°C)
dv/dt
5.0
10
−
V/µs
Critical Rate of Rise of On−State Current
(IPK = 50 A, Pw = 40 sec, diG/dt = 1 A/sec, Igt = 50 mA
di/dt
−
−
100
Aµs
2. Case 369C, when surface mounted on minimum recommended pad size.
3. Ratings apply for negative gate voltage or RGK = 1.0 kQ. Devices shall not have a positive gate voltage concurrently with a negative voltage on the anode. Devices
should not be tested with a constant current source for forward and reverse blocking capability such that the voltage applied exceeds the rated blocking voltage.
4. Pulse Test; Pulse Width ≤ 2.0 msec, Duty Cycle ≤ 2%.
5. RGK current not included in measurements.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
Voltage Current Characteristic of SCR
Symbol
Parameter
VDRM
Peak Repetitive Forward Off State Voltage
IDRM
Peak Forward Blocking Current
Anode +
VTM
VRRM
Peak Repetitive Reverse Off State Voltage
IRRM
Peak Reverse Blocking Current
VTM
Maximum On State Voltage
IH
+C urrent
Holding Current
on state
IRRM at VRRM
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode
IH
+V oltage
IDRM at VDRM
Forward Blocking Region
(off state)
Figure 1. RMS Current Derating
Figure 2. On−State Power Dissipation
Figure 3. On−State Characteristics
Figure 4. Transient Thermal Response
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
Figure 5. Typical Gate Trigger Current vs Junction Temperature
Figure 6. Typical Gate Trigger Voltage vs Junction Temperature
1.0
VGT, GATE TRIGGER VOLTAGE (VOLTS)
IGT, GATE TRIGGER CURRENT ( A)
35
30
25
20
15
-40
-20
0
20
40
60
80
0.5
0
100 110
-40
-20
TJ, JUNCTION TEMPERATURE °( C)
Figure 7. Typical Holding Current vs Junction Temperature
40
60
80
100 110
2.0
IL , LATCHING CURRENT (mA)
IH , HOLDING CURRENT (mA)
0
Figure 8. Typical Latching Current vs Junction Temperature
2.0
1.5
1.0
0.5
0
-40
02
TJ, JUNCTION TEMPERATURE °( C)
-200
20
40
60
TJ, JUNCTION TEMPERATURE °( C)
80
100 110
1.5
1.0
0.5
0
-40
-200
20
40
60
80
100 110
TJ, JUNCTION TEMPERATURE °( C)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
Thyristors
Surface Mount – 400V - 600V > MCR716, MCR718
Dimensions
Soldering Footprint
6.20
0.244
SEATING
PLANE
C
B
V
2.58
0.101
E
R
4
12
5.80
0.228
Z
A
S
3
3.0
0.118
1.6
0.063
6.172
0.243
U
K
SCALE 3:1
F
J
L
H
D
2 PL
M
0.13(0.005)T
G
Dim
Inches
Part Marking System
Millimeters
Min
Max
Min
Max
A
0.235
0.245
5.97
6.22
B
0.250
0.265
6.35
6.73
C
0.086
0.094
2.19
2.38
D
0.027
0.035
0.69
0.88
E
0.018
0.023
0.46
0.58
F
0.037
0.045
0.94
1.14
G
0.180 BSC
4.58 BSC
H
0.034
0.040
0.87
1.01
J
0.018
0.023
0.46
0.58
K
0.102
0.114
2.60
2.89
L
mm
inches
0.090 BSC
2.29 BSC
R
0.180
0.215
4.57
5.45
S
0.025
0.040
0.63
1.01
U
0.020
−−−
0.51
−−−
V
0.035
0.050
0.89
1.27
Z
0.155
−−−
3.93
−−−
4
1 2
DPAK
CASE 369C
STYLE 4
3
Y=
WW
MCR71x
G=
Y ear
= Work Week
= Device Code
x= 6 or 8
Pb Free Package
Pin Assignment
1
Cathode
2
Anode
3
Gate
4
Anode
Ordering Information
Device
Package
MCR716T4
DPAK
MCR716T4G
DPAK
(Pb−Free)
MCR718T4
DPAK
MCR718T4G
DPAK
(Pb−Free)
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
YWW
MCR
71xG
Shipping
2500 /
Tape & Reel
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete
Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 08/30/17
