MG1225H-XBN2MM

MG1225H-XBN2MM

  • 厂商:

    HAMLIN

  • 封装:

    Module

  • 描述:

    IGBT MOD 1200V 25A PKG H CRCT:XB

  • 数据手册
  • 价格&库存
MG1225H-XBN2MM 数据手册
Power Module 1200V 25A IGBT Module MG1225H-XBN2MM RoHS Features • High  level of integration—only one power semiconductor module required for the whole drive • Low  saturation voltage and positive temperature coefficient • Fast  switching and short tail current • F  ree wheeling diodes with fast and soft reverse recovery • Industry standard package with insulated copper base plateand soldering pins for PCB mounting • Temperature sense included Applications • AC motor control • M  otion/servo control • Inverter and power supplies Module Characteristics (TJ = 25°C, unless otherwise specified) Symbol Parameters TJ max Max. Junction Temperature TJ op Operating Temperature Tstg Storage Temperature Visol Insulation Test Voltage CTI Comparative Tracking Index Md Mounting Torque Test Conditions Min Typ -40 -40 AC, t=1min Max Unit 150 °C 125 °C 125 °C 3000 V 250 Recommended (M5) Weight 2.5 5 N·m 180 g Inverter Sector Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified) Symbol Parameters Test Conditions Values Unit VCES Collector - Emitter Voltage TJ=25°C 1200 V VGES Gate - Emitter Voltage IGBT IC DC Collector Current ICM Repetitive Peak Collector Current Ptot Power Dissipation Per IGBT ±20 V TC=25°C 40 A TC=80°C 25 A tp=1ms 50 A 147 W TJ=25°C 1200 V TC=25°C 35 A TC=80°C 25 A tp=1ms 50 A TJ =125°C, t=10ms, VR=0V 200 A 2s Diode VRRM Repetitive Reverse Voltage IF(AV) Average Forward Current IFRM Repetitive Peak Forward Current It 2 MG1225H-XBN2MM 1 208 ©2016 Littelfuse, Inc Specifications are subject to change without notice. Revised:10/05/16 Power Module 1200V 25A IGBT Module Electrical and Thermal Specifications (TJ = 25°C, unless otherwise specified) Symbol Parameters Test Conditions Min Typ Max Unit Gate - Emitter Threshold Voltage VCE=VGE, IC=1mA 5.0 5.8 6.5 V Collector - Emitter IC=25A, VGE=15V, TJ=25°C 1.7 V Saturation Voltage IC=25A, VGE=15V, TJ=125°C 1.9 V IGBT VGE(th) VCE(sat) IICES Collector Leakage Current IGES Gate Leakage Current RGint Integrated Gate Resistor Qge Gate Charge Cies Input Capacitance Cres Reverse Transfer Capacitance td(on) Turn - on Delay Time tr Rise Time td(off) Turn - off Delay Time VCE=1200V, VGE=0V, TJ=25°C 0.1 mA VCE=1200V, VGE=0V, TJ=125°C 1 mA 400 nA VCE=0V, VGE=±15V, TJ=125°C VCE=600V, IC=25A , VGE=±15V VCE=25V, VGE=0V, f =1MHz VCC=600V IC=25A RG =36Ω tf Fall Time Eon Turn - on Energy VGE=±15V Inductive Load Eoff Turn - off Energy ISC Short Circuit Current RthJC -400 8.0 Ω 0.24 μC 1.81 nF 0.08 nF TJ=25°C 90 ns TJ=125°C 90 ns TJ=25°C 30 ns TJ=125°C 50 ns TJ=25°C 420 ns TJ=125°C 520 ns TJ=25°C 70 ns TJ=125°C 90 ns TJ=25°C 2.4 mJ TJ=125°C 3.5 mJ TJ=25°C 1.8 mJ TJ=125°C 2.1 mJ tpsc≤10μS , VGE=15V; TJ=125°C , VCC=900V 100 Junction-to-Case Thermal Resistance (Per IGBT) A 0.85 K/W Diode VF Forward Voltage tRR Reverse Recovery Time IRRM Max. Reverse Recovery Current Erec Reverse Recovery Energy RthJCD MG1225H-XBN2MM IF=25A, VGE=0V, TJ =25°C 1.55 V IF=25A, VGE=0V, TJ =125°C 1.54 V IF=25A, VR=600V diF/dt=-400A/µs TJ=125°C 200 ns Junction-to-Case Thermal Resistance (Per Diode) 2 209 20 A 1.5 mJ 1.4 K/W ©2016 Littelfuse, Inc Specifications are subject to change without notice. Revised:10/05/16 Power Module 1200V 25A IGBT Module Diode-Rectifier Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified) Symbol Parameters Test Conditions Values Unit VRRM Repetitive Reverse Voltage TJ=25°C 1600 V IF(RMS) R.M.S. Forward Current Per Diode TC=80°C 25 A Non-Repetitive Surge Forward Current TJ =45°C, t=10ms, 50Hz 250 A TJ =45°C, t=8.3ms, 60Hz 300 A TJ =45°C, t=10ms, 50Hz 312 A 2s TJ =45°C, t=8.3ms, 60Hz 450 A 2s IFSM I 2t Diode-Rectifier Electrical and Thermal Specifications (TJ = 25°C, unless otherwise specified) Symbol Parameters VF Forward Voltage IR Reverse Leakage Current RthJCD Test Conditions Min Typ IF=25A, VGE=0V, TJ =25°C 1.1 IF=25A, VGE=0V, TJ =125°C 1.0 Max Unit V V VR=1600V, TJ=25°C 50 μA VR=1600V, TJ=125°C 1 mA 1.35 K/W Junction-to-Case Thermal Resistance (Per Diode) Brake-Chopper Absolute Maximum Ratings (TJ = 25°C, unless otherwise specified) Symbol Parameters Test Conditions Values Unit VCES Collector - Emitter Voltage TJ=25°C 1200 V VGES Gate - Emitter Voltage IGBT IC DC Collector Current ICM Repetitive Peak Collector Current Ptot Power Dissipation Per IGBT ±20 V 25 A TC=80°C 15 A tp=1ms 30 A 105 W TJ=25°C 1200 V TC=25°C 25 A TC=80°C 15 A TC=25°C Diode VRRM Repetitive Reverse Voltage IF(AV) Average Forward Current IFRM Repetitive Peak Forward Current I2t MG1225H-XBN2MM tp=1ms 30 A TJ =125°C, t=10ms, VR=0V 60 A 2s 3 210 ©2016 Littelfuse, Inc Specifications are subject to change without notice. Revised:10/05/16 Power Module 1200V 25A IGBT Module Brake-Chopper Electrical and Thermal Specifications (TJ = 25°C, unless otherwise specified) Symbol Parameters Test Conditions Min Typ Max Unit Gate - Emitter Threshold Voltage VCE=VGE, IC=0.6mA 5.0 5.8 6.5 V Collector - Emitter IC=15A, VGE=15V, TJ=25°C 1.7 Saturation Voltage IC=15A, VGE=15V, TJ=125°C 1.9 IGBT VGE(th) VCE(sat) IICES Collector Leakage Current IGES Gate Leakage Current RGint Integrated Gate Resistor Qge Gate Charge Cies Input Capacitance Cres Reverse Transfer Capacitance td(on) Turn - on Delay Time tr Rise Time td(off) Turn - off Delay Time 50 μA VCE=1200V, VGE=0V, TJ=125°C 1 mA 400 nA VCE=0V, VGE=±15V, TJ=125°C Eon Turn - on Energy VCE=25V, VGE=0V, f =1MHz IC=15A VGE=±15V Inductive Load Eoff Turn - off Energy ISC Short Circuit Current RthJC -400 VCE=600V, IC=15A , VGE=±15V RG =62Ω Fall Time V VCE=1200V, VGE=0V, TJ=25°C VCC=600V tf V 0 Ω 0.15 μC 1.1 nF 0.05 nF TJ=25°C 90 ns TJ=125°C 90 ns TJ=25°C 25 ns TJ=125°C 30 ns TJ=25°C 420 ns TJ=125°C 520 ns TJ=25°C 90 ns TJ=125°C 120 ns TJ=25°C 1.4 mJ TJ=125°C 2.0 mJ TJ=25°C 1.0 mJ TJ=125°C 1.2 mJ tpsc≤10μS , VGE=15V; TJ=125°C , VCC=900V 45 Junction-to-Case Thermal Resistance (Per IGBT) A 1.2 K/W Diode VF Forward Voltage tRR Reverse Recovery Time IRRM Max. Reverse Recovery Current Erec Reverse Recovery Energy RthJCD IF=15A, VGE=0V, TJ =25°C 1.65 V IF=15A, VGE=0V, TJ =125°C 1.75 V IF=15A, VR=600V diF/dt=-400A/µs TJ=125°C 150 ns 15 A 0.6 mJ Junction-to-Case Thermal Resistance (Per Diode) 2.1 K/W Max Unit NTC Characteristics (TJ = 25°C, unless otherwise specified) Symbol Parameters Test Conditions R25 Resistance Tc=25°C B25/50 MG1225H-XBN2MM 4 211 Min Typ 5 KΩ 3375 K ©2016 Littelfuse, Inc Specifications are subject to change without notice. Revised:10/05/16 Power Module 1200V 25A IGBT Module Figure 1: Typical Output Characteristics for IGBT Inverter Figure 2: Typical Output Characteristics for IGBT Inverter 50 50 VGE =19V VGE =17V VGE =15V VGE =13V VGE =11V VGE = 9V VGE =15V 40 Tj =25°C 30 IC (A) IC (A) 40 20 TJ =125°C 20 Tj =125°C 10 0 0 30 10 0.5 1.0 1.5 2.0 VCE˄V˅ 2.5 3.0 0 3.5 Figure 3: T  ypical Transfer Characteristics for IGBT Inverter 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 VCE˄V˅ Figure 4: Switching Energy vs. Gate Resistor for IGBT Inverter 5 50 VCE=600V IC=25A VGE=±15V Tj =125°C VCE =20V 4 40 Eon Eon Eoff (mJ) IC (A) Tj =25°C 30 Tj =125°C 20 5 6 7 9 8 VGE˄V˅ 10 11 Eoff 0 12 Figure 5: Switching Energy vs. Collector Current for IGBT Inverter 10 8 0 10 20 30 40 RG˄Ω˅ 50 60 70 Figure 6: R  everse Biased Safe Operating Area for IGBT Inverter VCE=600V RG=36Ω VGE=±15V Tj =125°C 50 40 6 Eon IC (A) Eon Eoff (mJ) 2 1 10 0 3 Eoff 4 30 RG=75Ω VGE=±15V Tj =125°C 20 2 10 0 0 MG1225H-XBN2MM 10 20 30 IC˄A˅ 40 0 50 5 212 0 200 400 600 800 1000 1200 1400 VCE˄V˅ ©2016 Littelfuse, Inc Specifications are subject to change without notice. Revised:10/05/16 Power Module 1200V 25A IGBT Module Figure 7: Diode Forward Characteristics for Diode Inverter Figure 8: S  witching Energy vs. Gate Resistort for Diode Inverter 50 3.0 40 2.0 Erec (mJ) IF (A) 30 20 1.5 Tj =125°C 1.0 10 0 0.5 Tj =25°C 0 1.0 0.5 2.0 1.5 VF˄V˅ 2.5 0 3.0 3.0 2.5 0 20 30 40 60 70 10 RG=36Ω VCE=600V Tj =125°C Diode 1 IGBT 1.5 1.0 0.1 TJ =150°C TC =25°C VGE =15V tscİ10µs 0.5 0 0 10 20 30 40 0.01 0.001 0.01 0.1 1 10 Rectangular Pulse Duration (seconds) 50 IF (A) Figure 11: Diode Forward Characteristics Diode- rectifier Figure 12: Typical Output Characteristics IGBT- brake chopper 30 50 25 40 IFGE =25=15V A V VCE=600V TVj =125°C 20 IC (A) 30 Tj =125°C 20 Tj =25°C 15 Tj =125°C 10 10 0 50 Figure 10: Transient Thermal Impedance of Diode and IGBT-inverter 2.0 IF (A) 10 RG˄Ω˅ Figure 9: Switching Energy vs. Forward Current Diode-inverter Erec (mJ) IF=25A VCE=600V Tj =125°C 2.5 5 Tj =25°C 0 MG1225H-XBN2MM 0.2 0.4 0 0 0.6 0.8 1.0 1.2 1.4 1.6 VF˄V˅ 6 213 0.5 1.0 1.5 2.0 VCE˄V˅ 2.5 3.0 3.5 ©2016 Littelfuse, Inc Specifications are subject to change without notice. Revised:10/05/16 Power Module 1200V 25A IGBT Module Figure 14: N  TC Characteristics Figure 13: Diode Forward Characteristics Diode - brake chopper 30 100000 25 IF (A) 20 10000 Tj =25°C R 15 10 Tj =125°C 1000 5 0 0 0.4 0.8 1.2 1.6 VF˄V˅ 2.0 2.4 100 0 2.8 20 40 80 100 120 140 160 60 TC˄°C˅ Circuit Diagram Dimensions-Package H The foot pins are in gold / nickel coating MG1225H-XBN2MM 7 214 ©2016 Littelfuse, Inc Specifications are subject to change without notice. Revised:10/05/16 Power Module 1200V 25A IGBT Module Packing Options Part Number Marking Weight Packing Mode M.O.Q MG1225H-XBN2MM MG1225H-XBN2MM 180g Bulk Pack 40 Part Marking System Part Numbering System MG12 25 H - XB N2 MM PRODUCT TYPE M: Power Module MODULE TYPE G: IGBT VOLTAGE RATING 12: 1200V CURRENT RATING ASSEMBLY SITE MG1225H-XBN2MM WAFER TYPE CIRCUIT TYPE LOT NUMBER Space reserved for QR code PACKAGE TYPE 25: 25A MG1225H-XBN2MM 8 215 ©2016 Littelfuse, Inc Specifications are subject to change without notice. Revised:10/05/16
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MG1225H-XBN2MM
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  • 80+644.4727580+83.18870

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