MICROSMD250LR-A-2

厂商：
HAMLIN
封装：
1210
描述：

数据手册：

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MICROSMD250LR-A-2 数据手册

PolySwitch® PTC Devices PRODUCT: microSMD250LR-A-2 Overcurrent Protection Device DOCUMENT: SCD28261 REV LETTER: E REV DATE: JULY 26, 2016 PAGE NO.: 1 OF 3 Specification Status: Released Maximum Electrical Rating Voltage: 6VDC Short Circuit Current: 50A Notes: 1. Termination Finish: NiAu 2. Drawing not to scale 3. For battery application only Marking: L TABLE I. DIMENSIONS: A B C D E MIN MAX MIN MAX MIN MAX MIN MAX MIN mm: 3.00 3.43 0.50 1.00 2.35 2.80 0.25 0.75 0.076 in: (0.118) (0.135) (0.019) (0.039) (0.092) (0.110) (0.010) (0.030) (0.003) TABLE II. PERFORMANCE RATINGS: CURRENT RATINGS** TIME TO TRIP** AMPERES AMPERES AMPERES SECONDS AT 0°C AT 20°C AT 60°C AT 20°C, 9.5A HOLD TRIP HOLD TRIP HOLD TRIP MAX 3.2 7.0 2.5 5.2 1.3 3.0 5.0 RESISTANCE TRIPPED-STATE VALUES POWER DISSIPATION** OHMS WATTS AT AT 20°C 20°C, 6.0V MIN MAX* MAX .005 .018 1.0 * Maximum resistance is measured 1 hour after reflow. ** Values Specified were determined using PCB’s with 0.025” x 2.0 ounce copper traces. Agency Recognition: Reference Document: Precedence: Effectivity: CAUTION: UL, CSA PS300 This specification takes precedence over documents referenced herein. Reference documents shall be the issue in effect on the date of invitation for bid. Operation beyond the rated voltage or current may result in rupture, electrical arcing or flame. Materials Information ROHS Compliant ELV Compliant Pb-Free Halogen Free* HF * Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm. © 2016 Littelfuse,Inc Specifications are subject to change without notice. Revised July 26, 2016 Littelfuse.com PolySwitch® PTC Devices Overcurrent Protection Device PRODUCT: microSMD250LR-A-2 DOCUMENT: SCD28261 REV LETTER: E REV DATE: JULY 26, 2016 PAGE NO.: 2 OF 3 Recommended pad layout (mm.) 2.00 2.65 1.00 1.00 Recommended reflow profile Profile Feature Average ramp up rate (Tsmax to Tp) Preheat • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (tsmin to tsmax) Time maintained above: • Temperature (TL) • Time (tL) Peak/Classification temperature (Tp) Time within 5°C of actual peak temperature (tp) Ramp down rate Time 25°C to peak temperature Pb-Free Assembly 3°C/s max. 150°C 200°C 60-120s 217°C 60-150s 260°C 30s max. 2°C/s max. 8 mins max. Note: All temperatures refer to top side of the package, measured on the package body surface. Solder reflow recommendation        Recommended reflow methods: IR, hot air and Nitrogen Recommended maximum solder paste thickness: 0.25mm Recommended minimum stencil thickness: 0.1mm Devices can be cleaned using standard methods and aqueous solvents. Littelfuse believes the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each device's termination. As such, we request that customers comply with our recommended solder pad layouts. Customer should validate that the solder paste amount and reflow recommendations meet its application. Littelfuse requests that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices. © 2016 Littelfuse,Inc Specifications are subject to change without notice. Revised July 26, 2016 Littelfuse.com PolySwitch® PTC Devices Overcurrent Protection Device PRODUCT: microSMD250LR-A-2 DOCUMENT: SCD28261 REV LETTER: E REV DATE: JULY 26, 2016 PAGE NO.: 3 OF 3 Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications.Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, military, aerospace, medical, lifesaving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation.The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse. © 2016 Littelfuse,Inc Specifications are subject to change without notice. Revised July 26, 2016 Littelfuse.com

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MICROSMD250LR-A-2

物料型号：microSMD250LR-A-2

器件简介： - 该产品是Littelfuse的PolySwitch® PTC（正温度系数）设备，用于过流保护。 - 该设备仅适用于电池应用。 - 产品的最大电气额定值为6V直流电压和50A的短路电流。

引脚分配： - 文档中提供了引脚分配的标记，但未提供具体的引脚功能描述。

参数特性： - 保持电流（HOLD）和触发电流（TRIP）的额定值，以及在20°C时的最大9.5A电流下的触发时间。 - 电阻值和在20°C、6.0V最大时的触发状态功耗。

功能详解： - 该设备在过流条件下会触发，从而限制电流，保护电路。 - 触发后，设备会进入高阻态，从而限制电流流过。 - 文档还提供了推荐的焊盘布局和回流焊接曲线。

应用信息： - 该设备符合UL和CSA认证。 - 产品符合RoHS指令、ELV指令，并且是无铅和无卤素的。

封装信息： - 文档提供了尺寸表，包括最小和最大尺寸，以及推荐的回流焊接方法和条件。

注意事项： - 操作超出额定电压或电流可能导致破裂、电弧或火焰。 - 产品不适用于军事、航空、医疗、生命维持或核设施等应用。

材料信息： - 产品符合2002/95/EC和2000/53/EC指令。

版权信息： - 文档版权归Littelfuse, Inc所有，规格如有变更，恕不另行通知。