NGB8207ABNT4G

NGB8207ABNT4G

  • 厂商:

    HAMLIN

  • 封装:

    SOT404

  • 描述:

    IGBT 365V 20A 165W D2PAK3

  • 数据手册
  • 价格&库存
NGB8207ABNT4G 数据手册
Ignition IGBT Surface Mount > 365V > NGB8207ABN NGB8207ABN - 20 A, 365 V, N-Channel Ignition IGBT, Pb Description This Logic Level Insulated Gate Bipolar Transistor (IGBT) features monolithic circuitry integrating ESD and Over− Voltage clamped protection for use in inductive coil drivers applications. Primary uses include Ignition, Direct Fuel Injection, or wherever high voltage and high current switching is required. Features • Ideal for Coil−on−Plug and Driver−on−Coil Applications • Gate−Emitter ESD Protection • Temperature Compensated Gate−Collector Voltage Clamp Limits Stress Applied to Load 20 Amps, 365 Volts VCE(on) ≤ 1.5 V @ IC = 10A, VGE ≥ 4.5 V • Integrated ESD Diode Protection • Low Threshold Voltage for Interfacing Power Loads to Logic or Microprocessor Devices • Low Saturation Voltage • High Pulsed Current Capability Maximum Ratings and Thermal Characteristics • Minimum Avalanche Energy − 500 mJ (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Collector−Emitter Voltage VCES 365 V Gate−Emitter Voltage VGE ±15 V Collector Current−Continuous @ TC = 25°C − Pulsed IC 20 50 ADC AAC Continuous Gate Current IG 1.0 mA Transient Gate Current (t ≤ 2 ms, f ≤ 100 Hz) IG 20 mA ESD (Charged−Device Model) ESD 2.0 kV ESD (Human Body Model) R = 1500 Ω, C = 100 pF ESD 8.0 kV ESD (Machine Model) R = 0 Ω, C = 200 pF ESD 500 V 165 Watts 1.1 W/°C −55 to +175 °C Total Power Dissipation @ TC = 25°C Derate above 25°C Operating and Storage Temperature Range PD TJ, Tstg • Gate Resistor (RG) = 70 Ω • These are Pb−Free Devices Applications • Ignition Systems Functional Diagram Additional Information Datasheet Resources Samples Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/18 Ignition IGBT Surface Mount > 365V > NGB8207ABN Unclamped Collector−To−Emitter Avalanche Characteristics (−55° ≤ TJ ≤ 175°C) Symbol Value Unit Single Pulse Collector−to−Emitter Avalanche Energy VCC = 50 V, VGE = 10 V, Pk IL = 16.5 A, L = 3.7 mH, Rg = 1 kΩ Starting TJ = 25°C 500 mJ EAS VCC = 50 V, VGE = 10 V, Pk IL = 10 A, L = 6.1 mH, Rg = 1 kΩ Starting TJ = 125°C 306 Reverse Avalanche Energy VCC = 100 V, VGE = 20 V, Pk IL = 25.8 A, L = 6.0 mH, Starting TJ = 25°C EAS(R) 2000 mJ Thermal Characteristics Symbol Value Unit Thermal Resistance, Junction to Case RθJC 0.9 °C/W Thermal Resistance, Junction to Ambient (Note 2) RθJA 50 °C/W TL 275 °C Maximum Lead Temperature for Soldering Purposes, 1/8” from case for 5 seconds 2. When surface mounted to an FR4 board using the minimum recommended pad size. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/18 Ignition IGBT Surface Mount > 365V > NGB8207ABN Electrical Characteristics - OFF Characteristic Collector−Emitter Clamp Voltage Symbol BVCES Test Conditions Temperature Min Typ Max IC = 2.0 mA TJ = −40°C to 175°C 325 350 375 IC = 10 mA TJ = −40°C to 175°C 340 365 390 TJ = 25°C − 0.1 2.0 TJ = 25°C − 1.0 5 TJ = 175°C 70 85 150 TJ = -40°C − 0.25 2.5 TJ = 25°C 30 33 39 TJ = 175°C 30 36 42 TJ = −40°C 29 32 35 TJ = 25°C 0.10 0.25 0.85 TJ = 175°C 20 25 40 TJ = −40°C − 0.03 0.3 VGE = 0 V, VCE = 24V Zero Gate Voltage Collector Current ICES VCE = 250V VGE = 0 V Reverse Collector−Emitter Clamp Voltage Reverse Collector−Emitter Leakage Current BVCES (R) ICES(R) IC = −75 mA VCE = −24 V Unit V µA V mA Gate−Emitter Clamp Voltage BVGES IG = ± 5.0 mA TJ = −40°C to 175°C 12 13 14.5 V Gate−Emitter Leakage Current IGES VGE = ± 10.0 V TJ = −40°C to 175°C 500 700 1000 µA Gate Resistor RG _ TJ = −40°C to 175°C − 70 − Ω Gate Emitter Resistor RGE TJ = −40°C to 175°C 14.25 16 25 kΩ Unit Electrical Characteristics - ON (Note 3) Characteristic Gate Threshold Voltage Symbol VGE (th) Threshold Temperature Coefficient (Negative) − Test Conditions IC = 1.0 mA, VGE = VCE − IC = 6.0 mA, Collector−to−Emitter On−Voltage VGE (on) VGE = 4.0 V IC = 10 mA, VGE = 4.5 V Temperature Min Typ Max TJ = 25°C 1.2 1.5 2.0 TJ = 175°C 0.6 0.8 1.2 TJ = −40°C 1.4 1.7 2.0 − 12 12 12 TJ = 25°C 1.0 1.3 1.6 TJ = 175°C 0.8 1.1 1.4 TJ = −40°C 1.15 1.4 1.75 TJ = 25°C − 0.62 1.0 *Maximum Value of Characteristic across Temperature Range. 3. Pulse Test: Pulse Width ≤ 300 µS, Duty Cycle ≤ 2%. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/18 V mV/°C V Ignition IGBT Surface Mount > 365V > NGB8207ABN Electrical Characteristics - ON (Note 4) Characteristic Symbol Test Conditions IC = 8.0 A, VGE = 4.0 V IC = 10 A, VGE = 3.7 V IC = 10 A, VGE = 4.0 V Collector−to−Emitter On−Voltage VCE (on) IC = 10 A, VGE = 4.5 V IC = 15 A, VGE = 4.0 V IC = 20 A, VGE = 4.0V Forward Transconductance gfs VCE = 5.0 V, IC = 6.0 A Temperature Min Typ Max TJ = 25°C 1.1 1.5 1.7 TJ = 175°C 1.0 1.3 1.6 TJ = −40°C 1.2 1.5 1.85 TJ = 25°C 1.2 1.6 1.9 TJ = 175°C 1.1 1.45 1.8 TJ = −40°C 1.3 1.7 2.0 TJ = 25°C 1.1 1.5 1.85 TJ = 175°C 1.1 1.4 1.75 TJ = −40°C 1.35 1.7 2.1 TJ = 25°C 1.2 1.5 1.8 TJ = 175°C 1.1 1.4 1.7 TJ = −40°C 1.2 1.6 2.0 TJ = 25°C 1.45 1.85 2.15 TJ = 175°C 1.6 1.9 2.4 TJ = −40°C 1.5 1.9 2.25 TJ = 25°C 1.6 2.1 2.6 TJ = 175°C 2.0 2.4 3.1 TJ = −40°C 1.6 2.1 2.5 TJ = 25°C − 15.8 − © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/18 Unit V Mhos Ignition IGBT Surface Mount > 365V > NGB8207ABN Dynamic Characteristics Characteristic Symbol Input Capacitance CISS Output Capacitance COSS Transfer Capacitance CRSS Test Conditions Temperature VCE = 25 V f = 10 kHz Min Typ Max 750 810 900 75 90 105 4 7 12 TJ = 25°C Unit pF Switching Characteristics Characteristic Symbol Turn−On Delay Time (Resistive) Low Voltage td (on) Rise Time (Resistive) Low Voltage tf Turn−Off Delay Time (Resistive) Low Voltage td (off) Fall Time (Resistive) Low Voltage tf Test Conditions VCE = 14 V RL = 1.0 Ω VGE = 5.0 V RG = 1000 Ω Temperature Min Typ Max TJ = 25°C 0.5 0.55 0.7 TJ = 25°C 2.0 2.32 2.7 TJ = 25°C 2.0 2.5 3.0 TJ = 25°C 8.0 10 13 Unit µSec Turn−On Delay Time (Resistive) High Voltage td (on) Rise Time (Resistive) High Voltage tr Turn−Off Delay Time (Resistive) High Voltage td (off) Fall Time (Resistive) High Voltage tf VCE = 300 V RL = 46 Ω VGE = 5.0 V RG = 1000 Ω TJ = 25°C 0.5 0.65 0.75 TJ = 25°C 0.7 1.8 2.0 TJ = 25°C 4.0 4.7 6.0 TJ = 25°C 6.0 10 15 4. Pulse Test: Pulse Width ≤ 300 µS, Duty Cycle ≤ 2%. *Maximum Value of Characteristic across Temperature Range. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/18 Ignition IGBT Surface Mount > 365V > NGB8207ABN Ratings and Characteristic Curves Figure 1. Typical Self Clamped Inductive Switching Performance (SCIS) @ 25°C Figure 2. Typical Self Clamped Inductive Switching Performance (SCIS) @ 150°C 50 40 70 S 40 A 510 mJ 40 35 140 S 25.6 A 660 mJ 30 25 175 S 21 A 675 mJ 20 15 10 30 25 140 S 16 A 400 mJ 20 230 S 9 A 375 mJ 15 10 5 5 0 35 S 39.8 A 250 mJ 35 PEAK CURRENT (A) PEAK CURRENT (A) 45 0 50 100 150 200 250 0 300 0 50 100 CLAMPING TIME ( S) Figure 5. On−Region Characteristics @ TJ = 25°C 250 Figure 4. Collector−to−Emitter Voltage vs. Junction Temp VCE, COLLECTOR TO EMITTER VOLTAGE (V) Figure 3. Collector−to−Emitter Voltage vs. Collector Current 200 150 CLAMPING TIME ( S) 3.0 2.5 IC = 20 A 2.0 IC = 15 A IC = 10 A 1.5 IC = 6.0 A 1.0 IC = 8.0 A 0.5 0 50 25 0 25 50 75 100 125 150 175 TJ, JUNCTION TEMPERATURE (°C) Figure 5. On−Region Characteristics @ TJ = -40°C © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/18 Ignition IGBT Surface Mount > 365V > NGB8207ABN Figure 8. Transfer Characteristics Figure 9. Collector−to−Emitter Leakage Current vs. Temp Figure 10. Gate Threshold Voltage vs. Temperature LEAKAGE CURRENT ( A) 100,000 10,000 VCE = 24 V 1000 100 VCE = 320 V 10 1 50 25 05 2 50 75 100 125 150 175 VGE(th), GATE THRESHOLD VOLTAGE (V) Figure 7. On−Region Characteristics @ TJ = 175°C 2.0 MEAN + 4s 1.75 MEAN 1.5 MEAN 4s 1.25 1.0 0.75 0.5 50 TJ, JUNCTION TEMPERATURE (°C) 25 50 75 100 125 150 175 TJ, JUNCTION TEMPERATURE (°C) Figure 12. Resistive Switching Time Variation vs. Temperature 100 t, TIME ( s) Figure 11. Capacitance Variation 0 25 VCC = 300 V VGE = 5.0 V R G = 1000 IC = 10 A 10 tf td(off) tr 1 0.1 td(on) 25 50 75 100 125 150 TEMPERATURE ( °C) © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/18 175 Ignition IGBT Surface Mount > 365V > NGB8207ABN Figure 13. Inductive Switching Time Variation vs. Temperature 100 VCC = 300 V IC = 10 A VGE = 5.0 V L = 300 H R G = 1000 IC , COLLECTOR CURRENT (A) t, TIME ( S) 1000 Figure 14. Forward Biased Safe Operating Area tr 100 td(on) tf 10 td(off) 1 VGE = 4.0 V Single Pulse TC = 25°C 100 s 50 75 100 125 150 175 1 ms 10 ms VCE(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 1 0.1 25 10 s 10 dc Mounted on 2 � sq. FR4 board (1� sq. 2 oz. Cu 0.06� thick single sided) 11 0 100 1000 VCE , COLLECTOR EMITTER VOLTAGE (V) TEMPERATURE ( °C) Figure 15. Best Case Transient Thermal Resistance (Non−normalized Junction−to−Case Mounted on Cold Plate) 1 0.2 0.1 ° 0.1 0.02 0.01 0.000001 1 t1 t2 0.01 1 2 0.00001 0.0001 0.001 0.01 0.1 1 © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/18 Ignition IGBT Surface Mount > 365V > NGB8207ABN Soldering Footrpint Dimensions 8.38 0.33 1.016 0.04 10.66 0.42 0.13 (0.005) M T B M 17.02 0.67 5.08 0.20 3.05 0.12 SCALE 3:1 mm inches K Part Marking System 4 Collector Dim Inches Millimeters Min Max Min Max A 0.340 0.380 8.64 9.65 B 0.380 0.405 9.65 10.29 C 0.160 0.190 4.06 4.83 D 0.020 0.035 0.51 0.89 E 0.045 0.055 1.14 1.40 F 0.310 0.350 7.87 8.89 G 0.100 BSC 0.080 0.110 2.03 2.79 J 0.018 0.025 0.46 0.64 K 0.090 0.110 2.29 2.79 L 0.052 0.072 1.32 1.83 M 0.280 0.320 7.11 8.13 N 0.197 REF 5.00 REF P 0.079 REF 2.00 REF 0.039 REF 1 Gate 3 Emitter 2 Collector NGB8207B = Device Code NGB8207ABN A= Y= WW G= Assembly Location Year = Work Week Pb Free Package 2.54 BSC H R NGB LF 8207BG 8207ABNG AYWW ORDERING INFORMATION Device Package Shipping† NGB8207BNT4G D2PAK (Pb−Free) 800 / Tape & Reel 0.99 REF S 0.575 0.625 14.60 15.88 V 0.045 0.055 1.14 1.40 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B−01 THRU 418B−03 OBSOLETE, NEW STANDARD 418B−04. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/15/18
NGB8207ABNT4G 价格&库存

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NGB8207ABNT4G
  •  国内价格
  • 200+15.34375
  • 400+14.88346

库存:225

NGB8207ABNT4G
  •  国内价格
  • 5+15.81862
  • 200+15.34375
  • 400+14.88346

库存:225