P0300Q22CLRP

SIDACtor® Protection Thyristors Broadband OptimizedTM Protection Q2L Series - 3.3x3.3 QFN RoHS Pb e3 Description Q2L Series 3.3x3.3 QFN are low capacitance SIDACtor® devices designed to protect high density broadband equipment from damaging overvoltage transients. The series provides a low profile, chip scale surface mount solution that enables broadband equipment to comply with global regulatory standards while limiting the impact to broadband signals and board space. Features and Benefits Agency • 2nd level interconnect is Pb-free per IPC/JEDEC J-STD-609A.01 • Recognized to UL 497B as an Isolated Loop Circuit Protector • • • • • • Low profile Small footprint Low capacitance Low voltage overshoot Low on-state voltage Does not degrade surge capability after multiple surge events within limit. • Fails short circuit when surged in excess of ratings Agency Approvals Agency File Number E133083 Schematic Symbol Applicable Global Standards Additional Information Datasheet Samples Resources • TIA-968-A • GR 1089 Intra-building • TIA-968-B • IEC 61000-4-5 • ITU K.20/21 Enhanced Level • YD/T 1082 • ITU K.20/21 Basic Level • YD/T 950 • YD/T 993 • GR 1089 Inter-building Electrical Characteristics VDRM @lDRM=5µA VS @100V/µs V min V max 6 25 50 800 P03C 25 40 50 P0640Q22CLRP P06C 58 77 P0720Q22CLRP P07C 65 P0900Q22CLRP P09C P1100Q22CLRP VT@IT = 2.2 Amps A max V max pF min pF max 2.2 5 35 75 800 2.2 5 25 45 150 800 2.2 5 55 85 88 150 800 2.2 5 50 75 75 98 150 800 2.2 5 45 70 P11C 90 130 150 800 2.2 5 45 70 P1200Q22CLRP P12C 100 130 150 800 2.2 5 45 70 P1300Q22CLRP P13C 120 160 150 800 2.2 5 40 60 P1500Q22CLRP P15C 140 180 150 800 2.2 5 35 55 P1800Q22CLRP P18C 170 220 150 800 2.2 5 35 50 P2000Q22CLRP P20C 180 220 150 800 2.2 5 30 50 P2300Q22CLRP P23C 190 260 150 800 2.2 5 30 50 P2500Q22CLRP P25C 230 290 150 800 2.2 5 30 50 P2600Q22CLRP P26C 220 300 150 800 2.2 5 30 45 P3100Q22CLRP P31C 275 350 150 800 2.2 5 30 45 P3500Q22CLRP P35C 320 400 150 800 2.2 5 25 40 P4500Q22CLRP P45C 400 530 150 800 2.2 5 25 45 Marking P0080Q22CLRP P-8C P0300Q22CLRP IH IS Capacitance @1MHz, 2V bias IT Part Number mA min mA max Notes: - Absolute maximum ratings measured at TA= 25ºC (unless otherwise noted). - Devices are bi-directional (unless otherwise noted). © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/31/20 SIDACtor® Protection Thyristors Broadband OptimizedTM Protection Surge Ratings Series 2x10 1 2x10 2 A min 8x20 1 1.2x50 2 A min 10x160 1 10x160 2 A min 10x560 1 10x560 2 A min 10x1000 1 10x1000 2 A min 5x310 1 10x700 2 A min ITSM 50/60 Hz A min A/µs max C 500 400 200 150 100 200 3 30 500 di/dt Notes: 1. Current waveform in µs 2. Voltage waveform in µs 3. For surge rating of P4500Q22CLRP 10x700µs min=150A & typical=180A - Peak pulse current rating (IPP) is repetitive and guaranteed for the life of the product. - IPP ratings applicable over temperature range of -40ºC to +85ºC - The device must initially be in thermal equilibrium with -40°C < TJ < +150°C Thermal Considerations Package Symbol Parameter 3.3 x 3.3 QFN Value Unit TJ Operating Junction Temperature Range -40 to +150 °C TS Storage Temperature Range -65 to +150 °C RƟJA Thermal Resistance: Junction to Ambient 120 °C/W V-I Characteristics tr x td Pulse Waveform IPP – Peak Pulse Current – %IPP +I IT IS IH IDRM -V +V VT VDRM VS tr = rise time to peak value td = decay time to half value Peak Value 100 Waveform = tr x td 50 Half Value 0 td tr 0 t – Time (µs) -I Normalized DC Holding Current vs. Case Temperature 10 IH 8 6 25 °C 4 IH (TC = 25ºC) 2.0 14 12 Ratio of Percent of VS Change – % Normalized VS Change vs. Junction Temperature 2 0 -4 -6 1.8 1.6 1.4 0.8 0.6 0.4 -8 -40 -20 0 20 40 60 80 100 120 140 160 Junction Temperature (TJ) – °C 25°C 1.2 1.0 -40 -20 0 20 40 60 80 100 120 140 160 Case Temperature (TC) - ºC © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/31/20 SIDACtor® Protection Thyristors Broadband OptimizedTM Protection Soldering Parameters Pb-Free assembly - Temperature Min (Ts(min)) +150°C - Temperature Max (Ts(max)) +200°C - Time (Min to Max) (ts) 60-180 secs. Average ramp up rate (Liquidus Temp (TL) to peak) 3°C/sec. Max. TS(max) to TL - Ramp-up Rate 3°C/sec. Max. Pre Heat +217°C - Temperature (TL) (Liquidus) Reflow 60-150 secs. - Temperature (tL) Peak Temp (TP) +260(+0/-5)°C Time within 5°C of actual Peak Temp (tp) 30 secs. Max. Ramp-down Rate 6°C/sec. Max. Time 25°C to Peak Temp (TP) 8 min. Max. Do not exceed +260°C Physical Specifications TP tP Critical Zone TL to TP Ramp-up TL T S(max) tL Ramp-down Preheat T S(min) tS 25 time to peak temperature (t 25ºC to peak) Time Environmental Specifications Lead Material Copper Alloy Terminal Finish 100% Matte-Tin Plated UL recognized epoxy meeting flammability classification 94V-0 Body Material Figure 1 Temperature Reflow Condition High Temp Voltage Blocking Temp Cycling Biased Temp & Humidity High Temp Storage Can be A or B Low Temp Storage Thermal Shock Resistance to Solder Heat Moisture Sensitivity Level 80% Rated VDRM (VAC Peak ) +125°C or +150°C, 504 or 1008 hrs. MIL-STD-750 (Method 1040) JEDEC, JESD22-A-101 -65°C to +150°C, 15 min. dwell, 10 up to 100 cycles. MIL-STD-750 (Method 1051) EIA/JEDEC, JESD22-A104 52 VDC (+85°C) 85%RH, 504 up to 1008 hrs. EIA/ JEDEC, JESD22-A-101 +150°C 1008 hrs. MIL-STD-750 (Method 1031) JEDEC, JESD22-A-101 -65°C, 1008 hrs. 0°C to +100°C, 5 min. dwell, 10 sec. transfer, 10 cycles. MIL-STD-750 (Method 1056) JEDEC, JESD22-A-106 +260°C, 30 secs. MIL-STD-750 (Method 2031) 85%RH, +85°C, 168 hrs., 3 reflow cycles (+260°C Peak). JEDEC-J-STD-020, Level 1 Dimensions — 3.3x3.3 QFN Dimensions BOTTOM VIEW TOP VIEW C A E J B END VIEW A F H 2.23 SIDE VIEW 2.15 0.585 N2 N1 K1 M1 M2 K2 Recommended Soldering Pad Outline (Reference Only) Inches Millimeters Min Max Min Max 0.126 0.134 3.200 3.400 3.400 B 0.126 0.134 3.200 C 0.075 0.083 1.900 2.100 E 0.011 0.019 0.285 0.485 2.430 F 0.088 0.096 2.230 H 0.035 0.043 0.900 1.100 J 0.000 0.008 0.000 0.200 K1 0.004 0.012 0.100 0.300 K2 0.004 0.012 0.100 0.300 M1 0.063 0.071 1.610 1.810 M2 0.045 0.053 1.153 1.353 N1 0.095 0.103 2.420 2.620 N2 0.082 0.090 2.080 2.280 © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/31/20 SIDACtor® Protection Thyristors Broadband OptimizedTM Protection Part Numbering Part Marking P xxx 0 Q22 C L RP Terminals on Back Reel Pack Type P=SIDACtor RoHS Compliant Median Voltage Construction Variable XXXX XXXXX IPP Rating Package Type Part Marking Code (Refer to Electrical Characteristics Table) Date code Packing Options Package Type Description Quantity Added Suffix Industry Standard Q22 3.3x3.3 QFN Tape and Reel Pack 5000 RP EIA-481-D Tape and Reel Specifications — 3.3x3.3 QFN Reel Dimension Symbols A C A D N W1 B Tape Leader and Trailer Dimensions END START CARRIER TAPE COVER TAPE TRAILER 160mm MIN LEADER 400mm MIN Tape Dimension Items D0 P0 P2 T CARRIER TAPE D1 B0 F W0 K0 P1 E1 E2W Description Reel Diameter Inches Millimeters Min Max Min Max N/A 12.992 N/A 330.0 B Drive Spoke Width 0.059 N/A 1.50 N/A C Arbor Hole Diameter 0.504 0.531 12.80 13.50 D Drive Spoke Diameter 0.795 N/A 20.20 N/A N Hub Diameter 1.969 N/A 50.00 N/A W1 Reel Inner Width at Hub 0.488 0.567 12.40 14.40 A0 Pocket Width at Bottom 0.138 0.146 3.50 3.70 B0 Pocket Length at Bottom 0.138 0.146 3.50 3.70 D0 Feed Hole Diameter 0.059 0.063 1.50 1.60 D1 Pocket Hole Diameter 0.059 N/A 1.50 N/A E1 Feed Hole Position 1 0.065 0.073 1.65 1.85 E2 Feed Hole Position 2 0.400 0.408 10.15 10.35 F Feed Hole Center - Pocket Hole Center 2 0.215 0.219 5.45 5.55 K0 Pocket Depth 0.039 0.051 1.00 1.30 P0 Feed Hole Pitch 0.153 0.161 3.90 4.10 P1 Component Spacing 0.311 0.319 7.90 8.10 P2 Feed Hole Center - Pocket Hole Center 1 0.077 0.081 1.90 2.05 T Carrier Tape Thickness 0.010 0.014 0.25 0.35 W Embossed Carrier Tape Width 0.453 0.484 11.50 12.30 W0 Cover Tape Width 0.358 0.366 9.10 9.30 A0 COVER TAPE Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics. © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/31/20