PulseGuard ® Suppressors
Surface Mount Polymeric ESD Suppressors
PGB Series 0805 ESD Suppressor
Product Overview
PulseGuard ESD Suppressors help protect sensitive electronic
equipment against electrostatic discharge (ESD). They supplement the
on-chip protection of integrated circuitry and are best suited for lowvoltage, high-speed applications where low capacitance is important.
Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394
and InfiniBandSM can benefit from this new technology. PulseGuard
suppressors use polymer composite materials to suppress fast-rising
ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883E).
Features
• Ultra-low capacitance
• Low leakage current
• Fast response time
• 4-lines of protection
• Bi-directional
• Withstands multiple ESD strikes
• Based on industry standard 2012 package
• Compatible with pick-and-place processes
• Available in 1,000 and 5,000 piece reels (EIA-RS481)
Reference Dimensions:
Reflow Solder
•
•
•
•
•
•
2.03 (.080") TYP
0.71 (.028")
Typical Applications
Servers
Laptop/Desktop Computers
Network Hardware
Computer Peripherals
Digital Cameras
External Storage
1.27
(.050")
0.74
(.029")
1.27
(.050") TYP
0.203
(.008") TYP
0.51 (.020")
0.635 (.025")
0.127
(.005") TYP
0.279
(.011")
0.74
(.029")
NOTE: When wave soldering, the gap between pads should be
covered with photo-imageable solder mask to prevent bridging
between terminations under the component. Also the spacing
between the ground contacts should be increased from
.635mm (.025") to .889 (.035").
Ordering Information
CATALOG NUMBER
PIECES PER REEL
PGB0040805MR
1,000
PGB0040805NR
5,000
0.406 (.016") TYP
Equivalent Circuit
1
6
Design Consideration
Because of the fast rise-time of the ESD transient, placement of
PulseGuard suppressors is a key design consideration. To achieve
optimal ESD suppression, the devices should be placed on the circuit
board as close to the source of the ESD transient as possible. Install
PulseGuard suppressors directly behind the connector so that they are
the first board-level circuit component encountered by the ESD transient.
They are connected from signal/data line to ground.
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5
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PulseGuard ® Suppressors
Surface Mount Polymeric ESD Suppressors
PGB Series 0805 ESD Suppressor
Electrical Characteristics
Capacitance vs. Frequency
ESD Capability
** Note: 1,000 fF = 1 pF
70
Capacitance (fF)
IEC 61000-4-2 Direct Discharge ....................................................8kV
IEC 61000-4-2 Air Discharge .......................................................15kV
Trigger Voltage1 ..................................................................1,000 V, typical
Clamping Voltage1 ..................................................................150V, typical
Rated Voltage ........................................................................24VDC, max
Capacitance2 ................................................................................0.055 pF
Response Time1 ................................................................................< 1ns
Leakage Current3 .............................................................................< 1nA
60
50
40
4
ESD Pulse Withstand4 ..........................................1,000 pulses, minimum
0.5
Notes:
1.0
1.5
2.0
Environmental Specifications
Carrier Tape Specifications
Parts are delivered on 7" (178mm) reel, paper carrier tape
Tt
Operating Temperature: -65°C to +125°C.
Moisture Resistance, steady state: MIL-STD-833, method 1004.7,
85% RH, 85°C, 1000hrs.
Thermal Shock: MIL-STD-202, Method 107G, -65°C to 125°C,
30 min cycle, 10 cycles.
Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz,
1 min. cycle, 2grs each in X-Y-Z)
Chemical Resistance: ASTM D-543, 4hrs @ 40°C, 3 solutions (H2O,
detergent solution, defluxer)
Solder leach resistance and terminal adhesion: Per EIA-576
test
PULSEGUARD®
SUPPRESSORS
Frequency (GHz)
1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct
discharge method.
2. Capacitance measured at 1MHZ.
3. Leakage current measured at 6VDC.
4. Pulse Withstand- some shifting in characteristics may occur when tested
over multiple pulses at a very rapid rate.
Ds
Dd
+
+
+
+
Tw
+
Pd
Ct
Ph
+
+
Pw
Ps
Physical Specifications
Materials:
Body: Glass Epoxy
Terminations: Copper/Nickel/Tin/Lead
Solderability: MIL-STD-202, Method 208 (95% coverage)
DESCRIPTION
MEASUREMENT (MM)
Soldering Parameters:
Ct - Cover tape thickness
0.06
Wave Solder – 260°C, 10 seconds maximum.
Reflow Solder – 260°C, 30 seconds maximum.
Dd - Drive hole diameter
1.50
Ds - Drive hole spacing
4.00
Pd - Pocket depth
0.58
Ph - Pocket height
2.21
Ps - Pocket spacing
4.00
Pw - Pocket width
1.45
Tt - Carrier tape thickness
0.65
Tw - Carrier tape width
8.00
Packaging Specifications
8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 1,000 pieces per
reel, add packaging suffix, MR; 5,000 per reel, add packaging suffix NR.
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