SC1333-01ETG

TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SC1333-01ETG SP1027 SC1333-01ETG 8pF 30kV Bidirectional Discrete TVS RoHS Pb GREEN Description The SC1333-01ETG back-to-back diodes are fabricated in a proprietary silicon avalanche technology. These diodes provide a high ESD (electrostatic discharge) protection level for electronic equipment. The SC1333-01ETG TVS can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines. Additionally, the SC1333-01ETG offers up to 5A 8/20μs surge rating with low clamping voltages. Pinout Features 0201 Flipchip 1 2 • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air 1nA (TYP) at 3.3V • Space Efficient 0402 • EFT, IEC 61000-4-4, 40A (5/50ns) • Halogen free, Lead free and RoHS compliant • Lightning, IEC 61000-45, 2nd Edition, 5A (8/20μs) • Moisture Sensitivity Level (MSL -1) • Low capacitance of 8pF (TYP @ VR=0V) • Low leakage current of Functional Block Diagram Applications • Mobile Phones 1 2 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/05/21 • Smart Phones • Portable Navigation Components • Portable Medical • Tablets • MP3/PMP • Small Size Panel • Point of Sale Terminals TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SC1333-01ETG SP1027 Absolute Maximum Ratings Symbol Parameter Value Units 5 A Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR=1μA Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK VR=3.3V Clamp Voltage1 VC Dynamic Resistance ESD Withstand Voltage1 VESD Diode Capacitance1 CIO-I/O 7 V 9 V TLP, tP=100ns, I/O to I/O 0.3 IEC 61000-4-2 (Contact Discharge) ±30 IEC 61000-4-2 (Air Discharge) ±30 Reverse Bias=0V, f=1MHz 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/05/21 V 5 100% 15.0 4.5 7.5 110% Time (μs) V IPP=5A, tp=8/20μs, I/O to I/O 8/20μs Pulse Waveform 10.0 3.3 IPP=1A, tp=8/20μs, I/O to I/O 2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns 5.0 Units nA 1. Parameter is guaranteed by design and/or component characterization. 0.0 Max 50 Note: 0% 3.5 Typ 1 RDYN 2 Min 20.0 25.0 30.0 Ω kV kV 8 10 pF TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP1027 Capacitance vs Reverse Bias Clamping Voltage vs IPP 10 12.0 8 8.0 Clamp Voltage (VC) Capacitance (pF) 10.0 6.0 4.0 6 4 2 2.0 0.0 0 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 3.3 1 2 3 Bias Voltage (V) Positive TLP 5 Negative TLP 24 0 22 -2 20 -4 18 -6 TLP Current (A) 16 14 TLP Current (A) 4 Peak Pulse Current -I PP (A) 12 10 -8 -10 -12 -14 8 -16 6 -18 4 -20 2 -22 0 -24 0 1 2 3 4 5 6 TLP Voltage (V) IEC Contact Discharge at +8 kV ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/05/21 7 8 9 10 11 12 -12 -11 -10 -9 -8 -7 -6 TLP Voltage (V) IEC Contact Discharge at -8 kV -5 -4 -3 -2 -1 0 TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP1027 SC1333-01ETG Soldering Parameters Pre Heat Pb – Free assembly 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Ordering Information Part Number Package Min. Order Qty. SC1333-01ETG 0402 DFN 10000 Part Marking System tP TP - Temperature Min (Ts(min)) Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 time to peak temperature Time Product Characteristics Lead Plating Pre-Plated Frame Matte Tin Lead material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Part Numbering System SC 1333 – 01 E T G 1 N* 2 TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel N= Product code * : Date code ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/05/21 Series Number of Channels Package E: 0402 DFN TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SC1333-01ETG SP1027 Package Dimensions — SOD882 D SOD882 e Symbol L2 L1 TOP VIEW 1 BOTTOM VIEW-1 Min Typ Max Min Typ Max 0.40 0.50 0.55 0.016 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 L1 0.20 0.25 0.30 0.008 0.010 0.012 L2 0.45 0.50 0.55 0.018 0.020 0.022 D 0.95 1.00 1.05 0.037 0.039 0.041 E 0.55 0.60 0.65 0.022 0.024 0.026 A1 L2 A e Inches A E PIN#1 ID. (OPTIONAL) Millimeters 0.65 BSC e SIDE VIEW L1 0.026 BSC 1 0.60mm BOTTOM VIEW-2 0.35mm 0.30mm 1.00mm Recommended Soldering Pattern Drawing# : E03-B Embossed Carrier Tape & Reel Specification — SOD882 P0 P1 P2 D0 Symbol E F W 0.20 ± 0.05 T 0º MAX A0 0º MAX K0 B0 8mm TAPE AND REEL Millimeters Inches Min Max Min Max A0 0.33 0.40 0.013 0.016 B0 0.63 0.70 0.025 0.028 D0 1.40 1.60 0.055 0.063 E 1.65 1.85 0.065 0.073 0.140 F 3.45 3.55 0.136 K0 0.30 0.39 0.012 0.015 P0 1.90 2.10 0.075 0.083 P1 1.95 2.05 0.077 0.081 P2 3.90 4.10 0.154 0.161 T 0.13 0.25 0.005 0.010 W 7.90 8.30 0.311 0.327 11.6mm 13.1mm 180mm 57mm 8.75mm Product Disclaimer: Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse. “Littelfuse” includes Littelfuse, Inc., and all of its affiliate entities. http://www.littelfuse.com/disclaimer-electronics. ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/05/21