SETP0805-100-SE

POLY-FUSE® Temperature Indicators Surface Mount > setP™ Series setP™ Temperature Indicators for USB Type-C RoHS Description The Littelfuse setP™ temperature indicator helps protect USB Type-C plugs from overheating. It has been designed to the unique specifications of USB Type-C and is capable of helping to protect even the highest levels of USB Power Delivery. Features • Compact footprint: 0805 mils (2.0 x 1.2mm) • Sensitive and reliable temperature indication • SMD compatible with reflow soldering process • Zero IR loss contribution Agency Approvals Agency Agency File Number Pending • Easy part selection • USB Power Delivery compliant • Protects systems with 100W or higher power Pending Applications • USB Type-C Plugs • Chargers with captive Type-C Cables • Fast charging standards and protocols compliant with USB-C and USB-PD Temperature Indication Characteristics Part Number Marking SETP0805-100-SE RT Indicating Temperature (°C) Min 90 Typical 100 1 Resistance (Ω) Max Max at 25°C 2 Rind 3 10 12 35,000 Notes: 1. Tind = Typical indicating temperature: Typical temperature when device switches to indicating resistance (Rind) 2. Maximum post reflow resistance measured at 25°C in still air 3. Rind = Indicating resistance when device reaches the indicating temperature (Tind) © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/12/18 POLY-FUSE® Temperature Indicators Surface Mount > setP™ Series Electrical Characteristics Part Number Marking Ihold 1 (A) SETP0805-100-SE RT 0.06 Itrip 2 (A) Vmax 3 (Vdc) Imax 4 (A) 0.25 6 1 Maximum Time-To-Trip Pd 5 typ. (W) Current Time (A) (Sec.) 0.6 0.3 1 Resistance Rmin 6 (Ω) R1max 7 (Ω) 0.5 12 Agency Approvals P P Notes: 1. Ihold = Hold current: maximum current device will pass without tripping in 20°C still air 2. Itrip = Trip current: minimum current at which the device will trip in 20°C still air 3. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) 4. Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) 5. Pd = Power dissipated from device when in the tripped state at 20°C still air 6. Rmin = Minimum resistance of device in initial (un-soldered) state 7. R1max = Maximum resistance of device at 20°C measured one hour after tripping or reflow Soldering of 260°C for 20 seconds (Values specified were determined using PCBs with 0.115in x 1.0in ounce copper traces) Caution: Operation beyond the specified rating may result in damage and possible arcing and flame Environmental Specifications Percentage of Rated Current Temperature Rerating Curve 170% Operating Temperature -40°C to +85°C 150% Maximum Device Surface Temperature in Tripped State 125°C Passive Aging +70°C, 1000 hours -/+10% typical resistance change Humidity Aging +60°C, 85% R.H.,100 hours -/+15% typical resistance change Thermal Shock MIL–STD–202, Method 215 No change -40°C to +85°C, 10 Cycles Solvent Resistance MIL–STD–202, Method 215 No change Vibration MIL–STD–883, Method 2007, Condition A No change Moisture Sensitivity Level Level 2a, J–STD–020 130% 110% 90% 70% 50% 30% 10% -40 -30 -20 -10 0 10 20 30 40 Temperature (°C) 50 60 70 80 Physical Specifications Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002, Category 3. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/12/18 POLY-FUSE® Temperature Indicators Surface Mount > setP™ Series Soldering Parameters Profile Feature Pb-Free Assembly Average Ramp-Up Rate (TS(max) to TP) 3°C/second max 150°C Temperature Max (Ts(max)) 200°C Time (Min to Max) (ts) 60 – 120 secs Time Maintained Temperature (TL) 217°C Above: 60 – 150 seconds Temperature (tL) tL Ramp-do Ramp-down Preheat TS(min) tS Peak / Classification Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 30 seconds max Ramp-down Rate 2°C/second max -- All temperature refer to topside of the package, measured on the package body surface Time 25°C to peak Temperature (TP) 8 minutes Max. -- If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements +0/-5 °C Critical Zone tL to tP Ramp-up TL TS(max) Temperature Pre Heat: Temperature Min (Ts(min)) tP TP 25 time to peak temperature Time -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead -- Recommended maximum paste thickness is 0.25mm (0.010 inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices Dimensions Product Dimensions Solder Pad Layout Device Dimension Part Number A B inch Min mm Max Min Max inch Min Solder Pad C mm inch D mm E inch Max Min Max Min Max Min Max Min Max mm SIZE INDICATING TEMP SINGLE-END CABLE © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/12/18 - 0.027 - 0.69 G H inch mm inch mm inch mm - 1.00 - 1.20 - 1.50 Packaging SETP 0805 -100 -SE SERIES mm Min Max Min Max Min Max SETP0805-100-SE 0.079 0.087 2.00 2.20 0.017 0.025 0.43 0.60 0.051 0.079 1.30 2.00 0.017 0.087 0.43 2.20 Part Ordering Number System inch F Part Number Ordering Number Minimum Order Quantity SETP0805-100-SE RF4795-000 20,000 Packaging Quantity Option Tape & Reel 4,000 POLY-FUSE® Temperature Indicators Surface Mount > setP™ Series Installation and Handling Guidelines • Operation of these devices beyond the stated maximum ratings could result in damage to the devices and lead to electrical arcing and/or fire. • These devices are intended to protect against the effects of temporary over-current or over-temperature conditions and are not intended to perform as protective devices where such conditions are expected to be repetitive or prolonged in duration. • Exposure to silicon-based oils, solvents, electrolytes, acids, and similar materials can adversely affect the performance of these PPTC devices. • These devices undergo thermal expansion under fault conditions, and thus shall be provided with adequate space and be protected against mechanical stresses. • Circuits with inductance may generate a voltage (L di/dt) above the rated voltage of the PPTC device. • Hand-soldering of PTC devices on boards is generally not recommended. Users shall define and verify this process if needed. • Consult Littelfuse when the device is to be applied with thermal processes other than reflow process on the circuit board, such as molding, encapsulation. User should evaluate molding materials used in the charging cable applications to ensure there are no adverse effect on the PTC devices. Tape and Reel Specifications SETP0805-100-SE W 8.0 ± 0.30 P0 4.0 ± 0.10 P1 4.0 ± 0.10 P2 2.0 ± 0.05 A0 1.70 ± 0.10 B0 2.45 ± 0.10 B1 max. 4.35 D0 1.55 ± 0.05 F 3.50 ± 0.05 E1 1.75 ± 0.10 E2 min. 6.25 T max. 0.3 T1 max. 0.1 K0 0.86 ± 0.10 A max. 179 N min. 53.5 W1 9.5 ± 0.5 W2 max. 15 Standard Pack Quantity: 4,000 pcs Minimum Order Quantity: 20,000 pcs Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/12/18