SLVU2.8-4BTG-S

TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SLVU2.8-4 Series SLVU2.8-4 Series 2.8V 40A TVS Array RoHS Pb GREEN Description The SLVU2.8-4 was designed to protect low voltage, CMOS devices from ESD and lightning induced transients. There is a compensating diode in series with each low voltage TVS to present a low loading capacitance to the line being protected. These robust structures can safely absorb repetitive ESD strikes at ±30kV (contact discharge) per IEC 61000-4-2 standard and each structure can safely dissipate up to 40A (IEC 61000-4-5 2nd edition, tP=8/20μs) with very low clamping voltages. Features • EFT, IEC 61000-4-4, 40A (5/50ns) • SOIC-8 (JEDEC MO-012) pin configuration allows for simple flow-through layout • Lightning, IEC 61000-4-5 2nd edition, 40A (8/20μs) • RoHS Compliant and Lead Free • Low capacitance of 2pF per line • Moisture Sensitivity Level (MSL-1) • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air Pinout 4 3 2 1 • Low leakage current of 1μA (MAX) at 2.8V 5 6 7 8 Applications Functional Block Diagram Pin 1.3 Pin 6.8 • 10/100/1000 Ethernet • Analog Inputs • WAN/LAN Equipment • Base Stations • Switching Systems • Desktops, Servers, and Notebooks Application Example Pin 2.4 Pin 5.7 Ethernet PHY Tx+ TxRx+ Rx- RJ-45 Connector J1 Additional Information SLVU2.8-4 Device is shown as transparent for actual footprint Resources Samples J8 Case GND © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SLVU2.8-4 Series Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions VRWM IR≤1μA Reverse Breakdown Voltage VBR IT=2μA 3.0 V Snap Back Voltage VSB IT=50mA 2.8 V Reverse Leakage Current Reverse Standoff Voltage Min ILEAK VR=2.8V (Each Line) Clamping Voltage 1 VC IPP=5A, tP=8/20μs (Each Line) Clamping Voltage 1 VC IPP=24A, tP=8/20μs (Each Line) Typ V μA 7.0 8.5 V 13.9 15.0 V IEC61000-4-2 (Contact) ±30 kV IEC61000-4-2 (Air) ±30 kV VESD Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1) (Each Line) 0.4 CD VR=0V, f=1MHz (Each Line) 2.0 Diode Capacitance Units 2.8 1 ESD Withstand Voltage1 1 Max Ω 2.5 pF Note: 1Parameter is guaranteed by design and/or device characterization. Absolute Maximum Ratings Figure 1: Capacitance vs. Reverse Voltage Rating Units Peak Pulse Power (tP=8/20µs) 600 W Peak Pulse Current (tP=8/20µs) 40 A Operating Temperature –40 to 125 ºC Storage Temperature –55 to 150 ºC 4.0 3.5 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Capacitance (pF) Parameter 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.0 0.5 1.0 1.5 2.0 2.5 DC Bias (V) Figure 2: Clamping Voltage vs. IPP Figure 3: 8/20 µs Pulse Waveform 110% 14 100% 90% Percent of IPP Clamping Voltage-VC (V) 12 10 8 6 80% 70% 60% 50% 40% 30% 20% 4 10% 0% 0.0 2 0 0 5 10 15 20 25 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) Peak Pulse Current-IPP (A) © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SLVU2.8-4 Series Soldering Parameters Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material V-0 per UL 94 Molded Epoxy Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to JEDEC SPEC MO-203 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. Pb – Free assembly Reflow Condition Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 5°C/second max TS(max) to TL - Ramp-up Rate Reflow 5°C/second max - Temperature (TL) (Liquidus) 217°C 60 – 150 seconds - Temperature (tL) Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package SOIC-8 Pins 8 JEDEC MS-012 Millimetres Inches LF A 1.35 1.75 0.053 0.069 o A1 0.10 0.25 0.004 0.010 Min Recommended Soldering Pad Outline (Reference Only) Min Max A2 1.25 1.65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 1.27 BSC e L © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17 Max 0.40 0.050 BSC 1.27 0.016 0.050 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection - SLVU2.8-4 Series Part Marking System Part Numbering System U 2.8 -4 SLVU2.8 -4 B T G U2.8-4 Product Series No. of channels U = SLVU2.8 Voltage Level G= Green T= Tape & Reel Package B = SOIC-8 No. of channels Series Ordering Information Part Number Package Marking Min. Order Qty. SLVU2.8-4BTG SOIC-8 U2.8-4 2500 Embossed Carrier Tape & Reel Specification — SOIC Package User Feeding Direction Pin 1 Location Symbol Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1.9 2.1 0.075 0.083 D 1.5 1.6 0.059 0.063 4.1 0.154 1.50 Min D1 P0 3.9 40.0 ± 0.20 10P0 W 0.059 Min 0.161 1.574 ± 0.008 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 t 0.30 ± 0.05 0.012 ± 0.002 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/12/17