SMAJ300A-E

TVS Diodes Surface Mount – 400W > SMAJ-E Series SMAJ-E Series RoHS Pb e3 08/21/2020 41356 SMAJ Series Description Uni-directional The SMAJ-E series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Features Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25ºC by 10/1000µs Waveform (Fig.2)(Note 1), (Note 2) PPPM 400 W Power Dissipation on Infinite Heat Sink at TL=50OC PD 3.3 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) IFSM 60 A VF 3.5 V Maximum Instantaneous Forward Voltage at 25A for Unidirectional Only Operating Temperature Range TJ -65 to 150 °C Storage Temperature Range TSTG -65 to 175 °C Typical Thermal Resistance Junction to Lead RθJL 30 °C/W Typical Thermal Resistance Junction to Ambient RθJA 120 °C/W Notes: 1. Non-repetitive current pulse, per Fig.4 and derated above TJ (initial) =25ºC per Fig. 3. • Excellent clamping capability • For surface mounted applications to optimize board space • Low profile package • Typical failure mode is short from over-specified voltage or current • Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c • IEC 61000-4-2 ESD 30kV(Air), 30kV (Contact) • EFT protection of data lines in accordance with IEC 61000-4-4 • Built-in strain relief • 400W Peak pulse power capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01% • Fast response time: typically less than 1.0ps from 0 Volts to VBR min • Glass passivated junction • Low inductance • High temperature to reflow soldering guaranteed: 260°C/40sec  BR @ TJ= VBR@25°C •V x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%) •E  PI silicon technology •M  eet MSL level1, per J-STD-020C, LF maximun peak of 260°C • Matte tin lead–free Plated • Halogen free and RoHS compliant • Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01) 2. Mounted on 5.0x5.0mm copper pad to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only. Functional Diagram Applications Bi-directional Cathode Anode TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. Uni-directional © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BA.08/12/20 TVS Diodes Surface Mount – 400W > SMAJ-E Series Electrical Characteristics (T =25°C unless otherwise noted) A Part Number (Uni) Reverse Stand off Marking Voltage VR (Volts) SMAJ300A-E SMAJ350A-E SMAJ400A-E* SMAJ450A-E* SMAJ500A-E* SMAJ550A-E* SMAJ600A-E* SMAJ650A-E* SMAJ700A-E* SMAJ750A-E* SMAJ850A-E* XE XG XK XM XN XP XR XS XT XU XV 300 350 400 440 500 550 600 650 700 750 850 MIN MAX Test Current IT (mA) 335.0 391.0 447.0 492.0 558.0 614.0 670.0 726.0 782.0 837.0 950.0 371.0 432.0 494.0 543.0 618.0 680.0 741.0 803.0 865.0 927.0 1050.0 1 1 1 1 1 1 1 1 1 1 1 Breakdown Voltage VBR (Volts) @ IT Maximum Maximum Maximum Reverse Clamping Peak Pulse Leakage IR Voltage VC Current Ipp @ Ipp @ VR (A) (V) (µA) 486.0 567.0 648.0 713.0 810.0 891.0 971.0 1052.0 1133.0 1213.0 1365.0 0.80 0.70 0.60 0.60 0.50 0.46 0.42 0.39 0.36 0.33 0.30 1 1 1 1 1 1 1 1 1 1 1 Note: for parts with * are still under development I-V Curve Characteristics Uni-directional Vc VBR VR IR VF IT V Ipp PPPM VR VBR VC IR VF Peak Pulse Power Dissipation -- Max power dissipation Stand-off Voltage -- Maximum voltage that can be applied to the TVS without operation Breakdown Voltage -- Maximum voltage that flows though the TVS at a specified test current (IT) Clamping Voltage -- Peak voltage measured across the TVS at a specified Ippm (peak impulse current) Reverse Leakage Current -- Current measured at VR Forward Voltage Drop for Uni-directional © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BA.08/12/20 TVS Diodes Surface Mount – 400W > SMAJ-E Series Ratings and Characteristic Curves (T =25°C unless otherwise noted) A Figure 1 - TVS Transients Clamping Waveform Figure 2 - Peak Pulse Power Rating Curve Voltage Transients PPPM-Peak Pulse Power (kW) 100 Voltage or Current Voltage Across TVS Current Through TVS TJ initial = Tamb 10 1 0.1 0.001 0.01 0.1 Time Figure 3 - Peak Pulse Power Derating Curve 150 IPPM- Peak Pulse Current, % IRSM Peak Pulse Power (PPP) or Current (IPP) Derating in Percentage % 10 Figure 4 - Pulse Waveform 100 80 60 40 20 0 1 td-Pulse Width (ms) 0 25 50 75 100 125 150 TJ - Initial Junction Temperature (ºC) tr=10µsec Peak Value IPPM 100 Half Value IPPM IPPM ( ) 2 50 0 175 TJ=25°C Pulse Width(td) is defined as the point where the peak current decays to 50% of IPPM 10/1000µsec. Waveform as defined by R.E.A td 0 1.0 2.0 3.0 4.0 t-Time (ms) Figure 5 - Typical Junction Capacitance Figure 6 - Typical Transient Thermal Impedance 1000.00 Transient Thermal Impedance ( °C/W) 1000 Cj (pF) 100.00 10.00 1.00 100 1000 VBR - Reverse Breakdown Voltage (V) 100 10 1 0.1 0.001 0.01 0.1 1 10 100 1000 TP - Pulse Duration (s) © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BA.08/12/20 TVS Diodes Surface Mount – 400W > SMAJ-E Series Figure 7 - Maximum Non-Repetitive Forward Surge Current Uni-Directional Only Figure 8 - Peak Forward Voltage Drop vs Peak Forward Current (Typical Values) 100.0 60 I F- Peak Forward Current (A) IFSM - Peak Forward Surve Current (A) 70 50 40 30 20 10.0 1.0 10 0.1 0 1 10 0.0 100 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 VF - Peak Forward Voltage (V) Number of Cycles at 60 Hz Soldering Parameters Pre Heat Lead–free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus Temp (TA) to peak 3°C/second max TS(max) to TA - Ramp-up Rate 3°C/second max Reflow - Temperature (TA) (Liquidus) 217°C - Time (min to max) (ts) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Physical Specifications Weight 0.002 ounce, 0.061 gram Case JEDEC DO-214AC Molded Plastic over glass passivated junction Polarity Color band denotes cathode except Bipolar Terminal Matte Tin-plated leads, Solderable per JESD22-B102 tp TP Ramp-up TL Temperature (T) Reflow Condition tL Critical Zone TL to TP Ts(max) Ramp-down Ts(min) ts Preheat 25˚C t 25˚C to Peak Time (t) Environmental Specifications High Temp. Storage JESD22-A103 HTRB JESD22-A108 Temperature Cycling JESD22-A104 MSL JEDEC-J-STD-020, Level 1 H3TRB JESD22-A101 RSH JESD22-A111 © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BA.08/12/20 TVS Diodes Surface Mount – 400W > SMAJ-E Series Dimensions DO-214AC (SMA) Inches Dimensions Cathode Band (for Uni-directional products only) Min Max Min Max 0.049 0.065 1.250 1.650 B 0.157 0.181 3.990 4.600 C 0.095 0.110 2.400 2.790 A C A B H D F E G L K J I Millimeters D 0.075 0.090 1.900 2.290 E 0.030 0.060 0.780 1.520 F - 0.008 - 0.203 G 0.189 0.208 4.800 5.280 H 0.006 0.012 0.152 0.305 I 0.070 - 1.800 - J 0.082 - 2.100 - K - 0.090 - 2.300 L 0.082 - 2.100 - Solder Pads (all dimensions in mm) Part Numbering System Part Marking System SMAJ xxx A-E Cathode Band (for Uni-directional products only) F EPI SILICON TECHNOLOGY 5% VBR VOLTAGE TOLERANCE Littelfuse Logo XX YMXXX VR VOLTAGE Marking Code Trace Code Marking Y:Year Code M: Month Code XXX: Lot Code SERIES Packaging Part number Component Package SMAJxxxA-E DO-214AC Packaging Option Quantity 5000 Tape & Reel - 12mm tape/13” reel Packaging Specification EIA STD RS-481 Tape and Reel Specification 0.157 (4.0) Cathode 0.47 (12.0) 0.157 (4.0) 0.059 DIA (1.5) Cover tape 13.0 (330) 0.80 (20.2) Arbor Hole Dia. 0.49 (12.5) Dimensions are in inches (and millimeters). Direction of Feed © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: BA.08/12/20