SMTBJ050A

SMTBJ SiBOD™ series FEATURES 2.16 2.74 2.16 ● Bi-directional transient voltage protection ● Glass passivated junction ● Nano second clamping response 2.26 ● Surge capability up to 250 (Amps) ● No performance degradation under service life Solder Pads ● Industry standard DO-2144AA Jedec outline All dimensions in mm ● Available on tape (12mm) ● UL recognised MECHANICAL CHARACTERISTICS ● Transfer molded, void free epoxy body ● Terminals: modified ‘J’ bend for large contact area ● Tin/Lead plated leads ● Maximum case temperature for soldering purposes: 230°C for 10 seconds ● Standard packaging: 12mm tape (meets EIA 481-1) A 2.0 B ● Device marking, device code, logo 3.30/3.94 5.21/5.59 4.06/4.57 2.18/2.44 SEATING PLANE .102 .203 0.76/1.27 w w w. l i t t e l f u s e . c o m 59 SMTBJ SiBOD™ series ELECTRICAL CHARACTERISTICS @ 25°C Tamb SYMBOL PARAMETER VRM Stand-off voltage IRM Stand-off current VBR Breakdown voltage IBO Breakover current VBO Breakover voltage IH Holding current VT On-state voltage ABSOLUTE RATINGS SYMBOL PARAMETER Ipp Peak Pulse Current VALUE Type A Type B 10/1000 µsec 50 100 A 8-20 µs expo 150 250 A tp20 ms 30 A Non-repetitive 100 A/µs -40 to +150 °C 150 °C 230 °C Itsm Non-repetitive surge peak on-state current di/dt Critical rate of rise of on-state current T stg Storage and operating junction temperature range Tj TL Maximum temperature for soldering (For period of 10 seconds max) Device Type Vbo MAX Vt TYP @ 1A Ibo TYP (mA) Ih MIN (mA) 60 80