SP0402B-ELC-01ETG

TVS Diode Arrays (SPA® Diodes) Enhanced ESD Discrete TVS Series Enhanced ESD Discrete TVS Series RoHS Pb GREEN ELV The Enhanced ESD Discrete TVS Series provides ultra low capacitance unidirectional and bidirectional ESD protection for the world’s most challenging high speed serial interfaces. Ultra low capacitance permits excellent signal integrity on the most challenging consumer electronics interfaces, such as USB 3.1, HDMI 2.0, DisplayPort, and V-by-One®. Providing in excess of 22kV contact ESD protection (IEC 61000-4-2) while maintaining extremely low leakage and dynamic resistance. Offered in the industry’s most popular footprints (0402 and 0201), the series sets higher standards for signal integrity and usability. Pinout Features • 0.15 pF TYP bidirectional 0201DFN 0402 DFN • ESD, IEC 61000-4-2, 1 1 • 0.30 pF TYP unidirectional ±22kV contact, ±22kV air • Low clamping voltage of 14V @ IPP=2.5A (Bidirectional) (tP=8/20μs) 2 • Low profile 0201 and 0402 DFN packages • Facilitates excellent signal integrity • ELV Compliant • Halogen free, Lead free and RoHS compliant 2 Applications Bottom View Functional Block Diagram • Ultra-high speed data lines • C  onsumer, mobile and portable electronics • USB 3.1, 3.0, 2.0 • Tablet PC and external storage with high speed interfaces • HDMI 2.0, 1.4a, 1.3 1 1 • DisplayPort(TM) • V-by-One® • LVDS interfaces 2 Unidirectional • Applications requiring high ESD performance in small packages 2 Bidirectional Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/12/17 SP1013 Description TVS Diode Arrays (SPA® Diodes) Enhanced ESD Discrete TVS Series Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 2.5 A TOP Operating Temperature -30 to 85 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Uidirectional Electrical Characteristics - (TOP=25°C) Parameter Test Conditions Min Typ Max Units Input Capacitance @ VR = 0V, f = 3GHz 0.30 pF Breakdown Voltage VBR @ IT=1mA 8.80 V Reverse Working Voltage 7.0 V Reverse Leakage Current IL @ VRWM=5.0V 25 nA Clamping Voltage VCL @ IPP=2.5A 13.0 V ESD Withstand Voltage IEC 61000-4-2 (Contact) ±22 IEC 61000-4-2 (Air) ±22 kV Bidirectional Electrical Characteristics - (TOP=25°C) Parameter Test Conditions Min Typ @ VR = 0V, f = 3GHz Input Capacitance Max Units 0.15 pF Breakdown Voltage VBR @ IT=1mA ± 9.6 V Clamping Voltage VCL @ IPP=2.5A ± 14.0 V ESD Withstand Voltage IEC 61000-4-2 (Contact) ±22 IEC 61000-4-2 (Air) ±22 Insertion Loss Diagram - Bidirectional 0 0 -5.0 -5.0 S21 Insertion Loss (dB) S21 Insertion Loss (dB) Insertion Loss Diagram - Unidirectional -10.0 -15.0 -20.0 -25.0 -30.0 1.E+06 -10.0 -15.0 -20.0 -25.0 -30.0 1.E+07 1.E+08 Frequency (Hz) ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/12/17 kV 1.E+09 1.E+10 1.E+06 1.E+07 1.E+08 Frequency (Hz) 1.E+09 1.E+10 TVS Diode Arrays (SPA® Diodes) Enhanced ESD Discrete TVS Series 1.0 1.0 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0.0 -0.2 -0.4 SP1013 Device IV Curve - Bidirectional Current (mA) Current (mA) Device IV Curve - Unidirectional 0.0 -0.2 -0.4 -0.6 -0.6 -0.8 -0.8 -1.0 -1.0 -2 -1 0 1 2 3 4 5 6 7 8 9 -10 10 -8 -6 -4 0 -2 2 4 6 8 10 Voltage (V) Voltage (V) USB3.0 Eye Diagram 5.0 Gb/s, 1000mV differential, CPO Compliant Test Pattern Without Device With Device Soldering Parameters - Temperature Min (Ts(min)) Pre Heat Pb – Free assembly 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate Time 25°C to peak Temperature (TP) Do not exceed tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Product Characteristics of 0402 DFN Package Lead Plating Pre-Plated Frame 6°C/second max Lead Material Copper Alloy 8 minutes Max. Lead Coplanarity 0.004 inches(0.102mm) 260°C Substrate material Silicon Body Material Molded Epoxy Flammability UL Recognized epoxy meeting flammability rating V-0. Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/12/17 TVS Diode Arrays (SPA® Diodes) Enhanced ESD Discrete TVS Series Package Dimensions — 0201 DFN Symbol SIDE VIEW SOLDERING PATTERN Inches Min Max Min Max A 0.23 0.33 0.009 0.013 A1 0.00 0.05 0.000 0.002 A3 SIDE VIEW TOP VIEW Millimeters 0.100 ref. 0.004 ref. b 0.2 0.3 0.008 0.012 D 0.55 0.65 0.022 0.026 E 0.25 0.35 0.010 0.014 e 0.35-0.40 BSC L1 0.12 0.23 0.005 0.009 L2 0.12 0.24 0.005 0.009 K 0.014-0.016 BSC 0.17 BSC 0.007 BSC BOTTOM VIEW Package Dimensions — 0402 DFN Symbol Millimeters Min Typ Max Min Typ Max A 0.33 - 0.55 0.013 - 0.022 A1 0 - 0.05 0.000 - 0.002 A3 TOP VIEW END VIEW-1 TOP VIEW END VIEW-2 b D END VIEW-2 END VIEW-1 E 0.13REF L 0.25 0.30 0.008 0.010 0.012 0.95 1.00 1.05 0.037 0.039 0.041 0.60 0.65 0.022 0.024 0.026 0.55 BOTTOM VIEW-2 BOTTOM VIEW-1 ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/12/17 0.65BSC 0.45 0.50 0.026BSC 0.55 SIDE VIEW-2 SIDE VIEW-1 BOTTOM VIEW-1 0.005REF 0.20 e SIDE VIEW-1 Inches SIDE VIEW-2 SOLDERING PATTERN BOTTOM VIEW-2 SOLDERING PATTERN 0.018 0.020 0.022 TVS Diode Arrays (SPA® Diodes) Enhanced ESD Discrete TVS Series Part Numbering System Part Marking System SP xxxx X – ELC – 01 X T G TVS Diode Arrays (SPA® Diodes) D G= Green D D D Unidirectional Package U: 0201 DFN E: 0402 DFN Directional U: Unidirectional B: Bidirectional Bidirectional Number of Channels Surge Ordering Information Part Number Package Marking Reel Quantity SP0201U-ELC-01UTG 0201 DFN I D 15000 SP0201B-ELC-01UTG 0201 DFN D 15000 SP0402U-ELC-01ETG 0402 DFN I D 10000 SP0402B-ELC-01ETG 0402 DFN D 10000 Embossed Carrier Tape & Reel Specification — 0201 DFN P1 D0 P2 P0 E1 F W D1 T K0 A0 Symbol Millimeters A0 0.33 min/0.41 max B0 0.63 min/0.71 max D0 ø 1.50 +0.10/ -0 D1 ø 0.20 +/- 0.05 E1 1.75+/-0.10 F 3.50+/-0.05 K0 0.30 min/0.39 max P0 4.00+/-0.10 P1 2.00+/-0.10 P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.13 min/0.25 max Symbol Millimeters A0 0.70+/-0.05 B0 Embossed Carrier Tape & Reel Specification — 0402 DFN P1 P2 P0 D0 E1 F W D1 T A0 K0 B0 1.15+/-0.05 D0 ø 1.50+/-0.10 D1 ø 0.40 +/-0.10 E1 1.75+/-0.10 F 3.50+/-0.10 K0 0.55+/-0.05 P0 4.00+/-0.10 P1 2.00+/-0.10 P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.20+/-0.05 B0 ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/12/17 SP1013 T= Tape & Reel Size 0201 0402