SP1002-02JTG

TVS Diode Array General Purpose ESD Protection - SP1002 Series SP1002 Series 5pF 8kV Bidirectional TVS Array RoHS Pb GREEN Description Back-to-Back Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-42 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting highspeed signal pins. Pinout Features SP1002-01JTG SP1002-02JTG (SC70-3) (SC70-5) 1 5 1 NC NC 2 4 3 • Low capacitance of 5pF (TYP) I/O to I/O • Small package saves board space • ESD protection of ±8kV contact discharge, ±15kV air discharge, (Level 4, IEC 61000-4-2) • Lightning Protection, IEC 61000-4-5, 2nd edition 2A (8/20µs) • EFT protection, IEC 61000-4-4, 40A (5/50ns) • RoHS compliant and lead free • AEC-Q101 qualified • Low leakage current of 0.5μA (MAX) at 5V Functional Block Diagram SP1002-01JTG Applications SP1002-02JTG 1 1 3 • Computer Peripherals • LCD/PDP TVs • Mobile Phones • Set Top Boxes • Digital Cameras • DVD Players • Desktops/Notebooks • MP3/PMP Application Example 2 5 4 Additional Information MultiMedia Device MultiMedia Device Audio Out L Audio In L Audio Out R Audio In R 2 x SP1002-01 Datasheet Resources Samples SCART MultiMedia Application of SP1002-01 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19 TVS Diode Array General Purpose ESD Protection - SP1002 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value Parameter Units Rating Units IPP Peak Current (tp=8/20μs) 2 A Storage Temperature Range –55 to 150 °C TOP Operating Temperature –40 to 125 °C Maximum Junction Temperature 150 °C Storage Temperature –55 to 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Symbol Voltage Drop Test Conditions Min 6.0 Typ Max Units 9.5 V VD IR=1mA Reverse Standoff Voltage VRWM IR≤1µA with 1 I/O at GND 6.0 V Leakage Current ILEAK VR=5V with I/O at GND 0.5 µA V Clamp Voltage1 VC Dynamic Resistance RDYN ESD Withstand Voltage1,2 VESD Diode Capacitance1 IPP=1A, tp=8/20µs, Fwd 9.2 13.0 IPP=2A, tp=8/20µs, Fwd 11.2 16.0 (VC2 - VC1) / (IPP2 - IPP1) 2.0 V Ω IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 kV CD Reverse Bias=0V 6 pF Reverse Bias=2.5V 5 pF Reverse Bias=5V 5 pF Notes: 1 Parameter is guaranteed by device characterization 2 A minimum of 1,000 ESD pulses are applied at 1s intervals Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate Reflow 3°C/second max - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes max. Do not exceed 260°C +0/-5 tP TP °C Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19 TVS Diode Array General Purpose ESD Protection - SP1002 Series Package Dimensions — SC70-3 B Solder Pad Layout 3 1.30 [0.0512] E Package 0.65 [0.0256] 0.70 [0.0276] HE 2 1 e e 1.90 [0.0748] D A2 A A1 SC70-3 Pins 3 JEDEC MO-203 Symbol Millimeters Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.66 BSC 0.90 [0.0354] e C Inches Min 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 L Package Dimensions — SC70-5 e e 6 5 not used Package 4 Solder Pad Layout E 5 JEDEC MO-203 HE Symbol 2 1 SC70-5 Pins 3 B D A2 A A1 Millimeters Min Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.65 BSC e C L Inches 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19 TVS Diode Array General Purpose ESD Protection - SP1002 Series Part Numbering System SP 1002 Part Marking System – B* * ** J T G TVS Diode Arrays (SPA® Diodes) B** G= Green Product Series (varies) Assembly Site T= Tape & Reel Series Number of Channels B = SP1002 Series (varies) Ordering Information Number of Channels Package -01 = 1 Channel -02 = 2 Channel J = SC70-3 SC70-5 Part Number Package Marking Min. Order Qty. SP1002-01JTG SC70-3 B*1 3000 SP1002-02JTG SC70-5 B*2 3000 Embossed Carrier Tape & Reel Specification — SC70-3 PO Symbol t F W E ØD P2 AO A1 BO B1 ØD1 P K1 Millimetres Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 40.0 ± 0.20 10P0 1.574 ± 0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.161 A0 2.30 2.50 0.090 0.098 2.50 0.090 1.00 Ref A1 B0 KO Inches Min 2.30 K0 0.039 Ref 1.90 Ref B1 0.318 0.098 0.074 1.10 1.30 0.043 0.051 K1 0.60 Ref 0.023 Ref t 0.27 max 0.010 Embossed Carrier Tape & Reel Specification — SC70-5 and SC70-6 Symbol Millimetres Inches Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 40.0 ± 0.20 10P0 1.574 ± 0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.096 K0 1.12 1.32 0.044 0.052 t 0.27 max 0.318 0.010 max Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19