SP1003-01ETG

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1003 Series SP1003 Series - 30pF 30kV Unidirectional Discrete TVS RoHS Pb GREEN Description Zener diodes fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation. Additionally, each diode can safely dissipate 7A of 8/20µs surge current (IEC61000-4-5) with very low clamping voltages. Features Pinout 1 1 2 • Tiny SOD723/ SOD882 (JEDEC MO-236) package saves board space • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air • Fits solder footprint of industry standard 0402 (1005) devices • EFT, IEC 61000-4-4, 40A (5/50ns) 2 SOD723 • RoHS compliant, Halogen-free and Leadfree SOD882 (AEC-Q101 qualified) • Lightning, IEC 61000-4-5 2nd edition, 7A (8/20µs) • Low leakage current of 100nA (MAX) at 5V • A  EC-Q101 qualified (SOD882 package) • M  oisture Sensitivity Level (MSL Level-1) Functional Block Diagram Applications 1 • Mobile phones • Digital cameras • Smart phones • Portable medical devices • Tablets • Wearable Technology • Portable navigation devices 2 Application Example Additional Information Low - speed port Resources Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 B1 B2 B3 B4 Samples Outside World Datasheet I/O port Controller (4) SP1003-01 Shield Ground Signal Ground TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1003 Series Absolute Maximum Ratings Symbol Thermal Information Parameter Value Units IPP Peak Pulse Current (tp=8/20μs) 7.0 A TOP Operating Temperature –40 to 125 °C °C TSTOR Storage Temperature –55 to 150 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Parameter Storage Temperature Range Rating –55 to 150 Units °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Forward Voltage Drop Reverse Voltage Drop Symbol Test Conditions VF IF = 10mA VR IR=1mA Reverse Standoff Voltage VRWM IR≤1µA Reverse Leakage Current ILEAK Clamp Voltage1 RDYN ESD Withstand Voltage1 VESD Diode Capacitance1 6.0 Typ Max Units 0.8 1.2 V 7.8 VR=5V VC Dynamic Resistance Min 8.5 V 5.0 V 100 nA Ipp=6A tp=8/20µs 11.4 V Ipp=7A tp=8/20µs 12.0 V TLP, tp =100ns, 1/O to GND 0.25 Ω IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V 30 pF CD Note: 1 Parameter is guaranteed by design and/or device characterization. Clamping Voltage vs. IPP Capacitance vs. Reverse Bias 14.0 35.0 12.0 30.0 10.0 Clamp Voltage (VC) Capacitance (pF) 40.0 25.0 20.0 15.0 10.0 5.0 8.0 6.0 4.0 2.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 DC Bias (V) 3.0 3.5 4.0 4.5 5.0 0.0 1 2 3 4 5 6 7 Peak Pulse Current-IPP (A) © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1003 Series Transmission Line Pulsing (TLP) Plot Leakage vs. Temperature 35.0 20 18 30.0 Leakage Current (nA) TLP Current (A) 16 14 12 10 8 6 4 2 0 25.0 20.0 15.0 10.0 5.0 0 2 4 6 8 10 12 14 16 18 0.0 0 TLP Voltage (V) 10 20 30 40 50 Temperature (ºC) Pulse Waveform 110% 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1003 Series Part Numbering System Product Characteristics SP 1003 – 01 * T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Series Package D: SOD723 E: SOD882 Number of Channels -01 = 1 Channel Product ID C Cathode Identifier 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Part Number Package SP1003-01DTG SOD723 SP1003-01ETG SOD882 Marking c c X uct ID Copper Alloy Lead Coplanarity Ordering Information SOD882 C Pre-Plated Frame or Matte Tin Lead Material Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Marking System SOD723 Lead Plating Min. Order Qty. c or c or 8,000 10,000 Pin 1 or C Package Dimensions — SOD723 SOD723 0.45 [0.018] D b E 1.10 [0.043] Symbol HE A 0.50 [0.020] Recommended Solder Pad Layout L c Millimeters (Inches) Millimeters Inches Min Max Min Max A 0.46 0.65 0.018 0.026 b 0.23 0.35 0.009 0.014 c 0.08 0.13 0.003 0.005 D 0.90 1.10 0.035 0.043 E 0.58 0.64 0.023 0.025 HE 1.37 1.47 0.054 0.058 L 0.15 0.25 0.006 0.010 Package Dimensions — SOD882 Symbol 0.325 0.650 0.975 Recommended Soldering Pad Layout SOD882 JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max A 0.90 1.00 1.10 0.035 0.039 0.043 B 0.50 0.60 0.70 0.020 0.024 0.028 C 0.40 0.50 0.60 0.016 0.020 0.024 0.325 0.650 Package 0.45 D 0.018 E 0.20 0.25 0.35 0.008 0.010 0.012 F 0.45 0.50 0.55 0.018 0.020 0.022 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1003 Series Embossed Carrier Tape & Reel Specification — SOD723 PO t User Feeding Direction D Ø ØD1 P BO B1 F W E P2 Symbol Pin 1 Location AO A1 Millimetres Max Min Max E 1.65 1.85 0.064 0.072 F 3.40 3.60 0.134 0.142 D1 0.45 0.55 0.017 0.021 D 1.50 -- 0.060 -- PO 3.90 4.10 0.153 0.161 40.0± 0.20 10PO 1.570±0.010 W 7.90 8.20 0.311 0.322 P2/P 1.90 2.10 0.074 0.082 AO 0.60 0.80 0.024 0.032 0.33 REF A1 BO KO Inches Min 1.61 0.010 REF 1.81 0.063 1.10 REF B1 0.071 0.040 REF KO 0.54 0.78 0.021 0.031 t -- 0.21 -- 0.008 Embossed Carrier Tape & Reel Specification — SOD882 Symbol A User Feeding Direction Pin 1 Location Millimetres Inches Min Max Min Max 0.65 0.70 0.026 0.028 B 1.10 1.20 0.043 0.047 C 0.50 0.60 0.020 0.024 dØ 1.40 1.60 0.055 0.063 E 1.65 1.85 0.065 0.073 F 3.40 3.60 0.134 0.142 P0 3.90 4.10 0.154 0.161 P 1.90 2.10 0.075 0.083 P1 1.90 2.10 0.075 0.083 W 7.90 8.10 0.311 0.319 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17