SP1008-01WTG

TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1008 Series SP1008 Series 6pF 15kV Bidirectional Discrete TVS Protection RoHS Pb GREEN Description The SP1008 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (±15kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. Pinout Features 1 • RoHS compliant, Halogen-free and Leadfree 2 • ESD, IEC 61000-4-2, ±15kV contact, ±15kV air • EFT, IEC 61000-4-4, 40A (5/50ns) Note: Drawing not to scale • Low capacitance of 6pF (@ VR=5V) • Low leakage current of 0.1μA at 5V • Space efficient 0201 footprint • Lightning, 3A (8/20μs as defined in IEC 61000-4-5 2nd Edition) Functional Block Diagram Applications 2 1 Additional Information • Mobile phones • Smart phones • MP3/PMP • External storage • PDA • Tablets • Camcorders • Digital cameras Application Example I/O Controller Keypads P1 Datasheet Resources Samples P2 Outside World P3 IC P4 SP1008 (x4) GND Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/10/19 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1008 Series Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 3.0 A TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage Test Conditions Min Typ Max VRWM V 8.5 V Breakdown Voltage VBR IR=1mA Leakage Current ILEAK VR=5V with 1 pin at GND 0.1 μA IPP=1A, tp=8/20µs, Fwd 10.7 V IPP=2A, tp=8/20µs, Fwd 12.0 V (VC2 - VC1) / (IPP2 - IPP1) 1.3 W Clamp Voltage VC 1 Dynamic Resistance RDYN ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±15 kV IEC 61000-4-2 (Air Discharge) ±15 kV CD Diode Capacitance1 7.0 Units 6.0 Reverse Bias=5.0V 6 9 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Bias Insertion Loss (S21) I/O to GND 0 10.0 Attenuation (dB) 9.0 I/O Capacitance (pF) 8.0 7.0 6.0 5.0 4.0 -5 -10 -15 -20 -25 -30 3.0 -35 2.0 -40 1.0 -45 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 I/O Bias Voltage (V) 3.5 4.0 4.5 5.0 10 100 Frequency (MHz) 1000 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/10/19 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1008 Series Clamping Voltage vs. IPP Pulse Waveform 110% 14 Clamp Voltage (VC) 100% 90% Percent of IPP 80% 70% 60% 50% 12 10 8 6 40% 30% 4 20% 2 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 0 30.0 1.0 Time (μs) 1.5 2.0 Peak Pulse Current-IPP (A) 1.5 2.5 1.5 1.5 Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate Reflow 3°C/second max - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C +0/-5 tP TP °C Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/10/19 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP1008 Series Part Numbering System 1008 SP – Ordering Information 01 W T G TVS Diode Arrays (SPA® Diodes) Part Number Package Min. Order Qty. SP1008-01WTG 0201 Flipchip 10000 G= Green T= Tape & Reel Part Marking System Series Package W: 0201 Flipchip Number of Channels E A A2 D1 Package Dimensions — 0201 Flipchip A1 E1 0201 Flipchip D2 A A2 Symbol Millimeters D2 D Top View Top View Bottom View 0.298 Bottom View Side View 0.298 Min Max Min Max 0.605 0.655 0.0238 0.0258 E 0.305 0.345 0.0120 0.0140 D1 0.145 0.155 0.0057 0.0061 Side E1 View 0.245 0.255 0.0096 0.0100 0.400 BSC D2 0.195 0.195 0.325 0.400 0.325 Inches D D1 D E x A1 E1 0.0157 BSC A 0.273 0.329 0.0107 0.0130 A2 0.265 0.315 0.0104 0.0124 A1 0.008 0.014 0.0003 0.0006 0.400 0.595 0.595 Recommended Soldering Pad Layout (mm) Recommended Soldering Pad Layout (mm) Embossed Carrier Tape & Reel Specification — 0201 Flipchip P1 P2 D P0 0.30 E T A0 0.41±0.03 B0 0.70±0.03 D ø 1.50 + 0.10 0.28 F 0.19 K0 B0 3.50±0.05 K0 0.38±0.03 P0 2.00±0.05 P1 2.00±0.05 P2*Sizes in mm A0 ø 0.20 ± 0.05 1.75±0.10 E 0.75 D1 Millimeters D1 F W Symbol 4.00±0.10 W 8.00 + 0.30 -0.10 T 0.23±0.02 Recommended Solder Pad Footprint Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/10/19