SP1020-01WTG

TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP1020 Series SP1020 Series 20pF 30kV Bidirectional Discrete TVS RoHS Pb GREEN Description The SP1020 includes back-to-back Zener diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present. Features Pinout • RoHS compliant, Halogen-free and Leadfree 0201 Flipchip 1 • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air 2 • EFT, IEC 61000-4-4, 40A (5/50ns) Note: Drawing not to scale • Low leakage current of 0.1μA at 5V • Industry’s smallest ESD footprint available (01005) • Lightning, IEC 610004-5, 2nd Edition, 5A (tP=8/20μs) Functional Block Diagram 1 • Low capacitance of 20pF (@ VR=0V) Applications 2 • Mobile Phones • Wearable Technology • Smart Phones • Portable Medical • Portable Navigation Devices • Digital Cameras • Tablets Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 11/23/16 SP1020 Series 1 1 TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP1020 Series Absolute Maximum Ratings Symbol Parameter Value IPP Peak Current (tp=8/20μs) TOP TSTOR Units 5.0 1 A Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C Notes: 1. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C Storage Temperature Range Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Typ Max Units 6.0 V VR=3.3V with 1 pin at GND 1 Leakage Current ILEAK Clamp Voltage1 RDYN ESD Withstand Voltage1 VESD Diode Capacitance IPP=1A, tp=8/20µs, Fwd 9.3 V IPP=2A, tp=8/20µs, Fwd 10.0 V TLP, tP=100ns, I/O to GND, 8/20µs Dynamic Resistance 0.32 Ω IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV CD 1 nA μA 0.1 VC Dynamic Resistance2 10 0.5 VR=5V with 1 pin at GND Reverse Bias=0V 20 pF Note: 1 Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Pulse Waveform Capacitance vs. Reverse Bias 25 110% 100% 20 90% 70% Capacitance (pF) Percent of IPP 80% 60% 50% 40% 30% 20% 15 10 5 10% 0% 0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0 Time (μs) ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 11/23/16 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Bias Voltage (V) 2 2 SP1020 Series TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP1020 Series Clamping Voltage vs IPP Transmission Line Pulsing (TLP) Plot 20 14.0 18 TLP Current (A) Clamp Voltage (VC) 12.0 10.0 8.0 6.0 16 14 12 10 8 6 4.0 4 2.0 2 0.0 0 1.0 2.0 3.0 4.0 0 5.0 5 10 15 20 TLP Voltage (V) Peak Pulse Current -I PP (A) Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition time to peak temperature Time °C Part Marking System Part Numbering System SP 1020 – 01 W T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Series Number of Channels Package W: 01005 Flipchip Ordering Information ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 11/23/16 Part Number Package Marking Min. Order Qty. SP1020-01WTG 01005 Flipchip • • 15000 SP1020 Series 3 3 TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP1020 Series Package Dimensions — 01005 Flipchip BOTTOM VIEW 0.24 0.34 0.55 0.21 TOP VIEW 0.19 0.20 0.16 Stencil opening Recommended Solder Pad Footprint and Stencil opening 0.24 01005 Flipchip Symbol 0.21 *Sizes in mm Min Typ Max Min Typ Max 0.181 0.209 0.0060 0.0071 0.0082 0.008 0.011 0.0143 0.0003 0.0004 0.19 0.0006 0.170 0.1950.20 0.0057 0.0067 0.0077 0.205 0.230 0.255 0.415 0.440 0.465 A2 0.145 D E 0.34 A1 Thickness of Stencil opening is 0.08mm Inches 0.153 0.55 A Millimeters Stencil opening 0.00810.16 0.0091 0.0163 Solder Pad 0.0173 0.0100 0.0183 Solder Pad Embossed Carrier Tape & Reel Specification — 01005 Flipchip Recommended Solder Pad Footprint and Stencil opening Thickness of Stencil opening is 0.08mm *Sizes in mm ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 11/23/16 4 4 Symbol Millimeters A0 0.30+/-0.03 B0 0.51+/-0.03 K0 0.20 + 0.03 F 3.50 +/- 0.05 P1 2.00+/-0.10 W 8.00+/-0.10 SP1020 Series