SP1050-04BTG

TVS Diode Array (SPA® Diodes) Lightning Surge Protection - SP1050 Series SP1050 Series for Power-over-Ethernet PSE Protection RoHS Pb GREEN Description The SP1050-04BTG provides over-voltage protection for Power-over-Ethernet PSE equipment in a space saving SOIC-8 package. It incorporates four TVS Diodes each with their own decoupling capacitor to stabilize power supplies. The SP1050 Series is compatible with the older IEEE 803. af and IEEE 802.3at PoE requirements for Mode A or Mode B for both PSE and PD but is not compatible with the new IEEE 802.3bt ( 4 wire-pair simultaneous powering) PSE/PD Class 5 through Class 8 or other 4 wire-pair simultaneous powering schemes that implement independent sources for each two wire-pair interface. It will protect two wire-pair interfaces that share a common grounding from lightning induced surges as outlined in IEC 61000-4-5 2ND Edition, EFTs (electrically fast transients) as outlined in IEC 61000-4-5, and ±30 kV ESD air and contact discharges as outlined in IEC 61000-4-2. Functional Block Diagram GND 2-3-6-7 PS1 1 PS2 4 PS3 5 PS4 8 The low clamping voltage of 96V(Max) makes it compatible with PSE controller technologies Features • P  eak pulse power: up to 2.7 kW (8/20 μs) Absolute Maximum Ratings Rating Units Peak Pulse Current (8/20µs) Parameter 24 A Peak Pulse Power (8/20µs) 2700 W IEC 61000-4-2, Contact Discharge, (Level 4) 30 kV IEC 61000-4-2, Air Discharge, (Level 4) 30 kV CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. • L  ightning, 24A (8/20 as defined in IEC 61000-4-5 2nd edition) • ESD protection of ±30kV contact discharge, ±30kV air discharge, (IEC 61000-4-2) • Stand-off voltage of 58 V • L  ow clamping voltage of 96V (MAX) at 24A • L  ow leakage current of 0.1 μA at 25 °C and 1 μA at 85 °C Additional Information Applications • PoE (Power over Ethernet) Datasheet Resources Samples Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/08/19 • Operating Tj max: 150 °C • JEDEC registered package outline • Embeds four decoupling capacitors • Meets the most stringent environmental conditions • RoHS compliant and leadfree • Moisture Sensitivity Level(MSL -1) • AEC-Q101 qualified TVS Diode Array (SPA® Diodes) Lightning Surge Protection - SP1050 Series Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units 25°C, VPoE= 58V - - 0.1 µA - - 1 µA Leakage Current IRM Breakdown Voltage VBR IR= 1mA 64 67 - V Clamping Voltage 2 VC IPP= 24A, tp=8/20 μs - - 96 V RDYN TLP, tP=100ns, I/O to GND 2 - 0.35 - Ω C VPoE= 58V - 35 - pF Dynamic Resistance 2 Capacitance 1 85°C, VPoE= 58V 1 Notes: 1 Parameter is guaranteed by design and/or component characterization. 2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns 8/20μS Pulse Waveform Capacitance vs. Reverse Bias 100.0 110% 90.0 90% 80.0 80% 70.0 Capacitance (pF) Percent of IPP 100% 70% 60% 50% 40% 30% 60.0 50.0 40.0 30.0 20.0 20% 10.0 10% 0% 0.0 0.0 5.0 10.0 15.0 20.0 25.0 44 30.0 46 48 50 52 54 56 58 Bias Voltage (V) Time (μs) Clamping Voltage vs IPP Non-Repetitive Peak Pulse Power vs. Pulse Time 100 100.0 80.0 Peak Pulse Power (kW) Clamp Voltage (V C ) 90.0 70.0 60.0 50.0 40.0 30.0 10 1 20.0 10.0 0.0 0.0 4.0 8.0 12.0 16.0 Peak Pulse Current -I PP (A) ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/08/19 20.0 24.0 0.1 1 10 100 Peak Pulse Duraon - tP (µs) 1000 TVS Diode Array (SPA® Diodes) Lightning Surge Protection - SP1050 Series Transmission Line Pulse (TLP) 20 18 TLP Current (A) 16 14 12 10 8 6 4 2 0 0 10 20 30 40 50 60 70 80 TLP Voltage (V) Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Product Characteristics Lead Plating Tin Lead Material Alloy 42 Lead Coplanarity 0.0004 inches (0.102mm) Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/08/19 tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time TVS Diode Array (SPA® Diodes) Lightning Surge Protection - SP1050 Series Application Schematic Figure 1: Typical application circuit with fully integrated PSE controller + Tx 48V Rx RJ-45 - RJ-45 V1 C OM Tx Rx Gnd PS1 PoE Controller PS2 PS3 Tx PS4 Rx RJ-45 SP1050-04BTG Tx RJ-45 Rx Figure 1 shows typical application of power sourcing equipment (PSE) allowing communication and power sourcing for several powered devices (PD). The SP1050-04BTG is optimized for space savings as there is generally a multiple of 4 present. This protection component complies with IEEE 802.3af and IEEE 802.3at (also known as PoE+). This component should be compatible with level 4/5 surge requirements of IEC 61000-4-5 since it is located on the secondary side of the coupling transformer, but lab testing should be conducted to confirm. ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/08/19 TVS Diode Array (SPA® Diodes) Lightning Surge Protection - SP1050 Series Package Dimensions of SOIC-8 Package LF SOIC Pins 8 JEDEC MS-012 Millimetres o Recommended Soldering Pad Outline (Reference Only) Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 1.27 BSC e 0.050 BSC 1.27 0.40 L 0.050 0.016 Embossed Carrier Tape & Reel Specification — SOIC Package Millimetres User Feeding Direction E Pin 1 Location Max Min Max 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1.95 2.05 0.077 0.081 D 1.5 1.6 0.059 0.063 1.50 Min D1 P0 10P0 SP 1050 - 04 B T G ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/08/19 0.059 Min 4.1 0.154 40.0 +/- 0.20 0.161 1.574 +/- 0.008 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 0.30 +/- 0.05 0.012 +/- 0.002 Ordering Information Part Numbering System Number of Channels 3.9 W t TVS Diode Arrays (SPA® Diodes) Series Inches Min G= Green T= Tape & Reel Package B = SOIC Part Number Package Min. Order Qty. SP1050-04BTG SOIC Tape & Reel 2500