SP1555-01UTG

TVS Diode Arrays (SPA®® Diodes) Surge Protection - SP1555Series SP1555 Series 120A for VBUS RoHS Pb GREEN Description The SP1555 integrates a 15V TVS diode to provide lightning surge protection for the USB VBUS pin up to 120A (tP=8/20μs) per the IEC61000-4-5 2nd edition standard. The SP1555 provides superior protection for current intensive applications such as fast charging peripherals. The SP1555 comes in a space saving 2.0x1.8mm μDFN package with a typical height of 0.55mm making it an ideal solution for smart phones, tablets, and other portable electronics. Pinout Features • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air • Benchmark setting protection • EFT, IEC 61000-4-4, 80A (tP=5/50ns) • High current handling capability for fast charging applications GND GND • Surge, IEC 61000-4-5 2nd edition, 120A (tP=8/20μs) • Protection for VBUS operating up to 15V • Moisture Sensitivity Level (MSL-1) • Lead-free and RoHS compliant Bottom View Functional Block Diagram Applications • Protection for the VBUS circuit on USB2.0 Fast Charging Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/30/16 SP1255P Series TVS Diode Arrays (SPA®® Diodes) Surge Protection - SP1555Series Absolute Maximum Ratings Parameter Value Units IPP (Pin 1) Peak Current (tp=8/20μs) 120 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses at or above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Also due to variations in test equipment stresses shown above are averages. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions VRWM Pin 1 to GND Reverse Breakdown Voltage VBR IT=1mA, Pin 1 to GND Reverse Leakage Current ILEAK VR=15V, Pin 1 to GND Min Typ Max Units 15 V USB VBUS (Pin 1) Reverse Standoff Voltage Forward Voltage VF 17.5 IF=10mA, GND to Pin 1 0.6 IPP=30A, tp=8/20µs, Fwd Clamp Voltage VC 1 ESD Withstand Voltage1 VESD Diode Capacitance1 CD 18.8 20.1 V 0.05 1 µA 0.7 1.0 V 21.5 V IPP=100A, tp=8/20µs, Fwd 27.5 V IPP=120A, tp=8/20µs, Fwd 29.5 V IEC 61000-4-2 (Contact) ±30 IEC 61000-4-2 (Air) ±30 kV kV Reverse Bias=0V, f=1MHz 800 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Bias (Pin1 to GND) Clamping Voltage vs IPP 800 30.0 700 25.0 500 Clamp Voltage (VC) Capacitance (pF) 600 400 300 200 15.0 10.0 5.0 100 0 20.0 0 3 6 9 12 0.0 15 Bias Voltage (V) 30 40 50 60 70 80 90 100 110 120 Peak Pulse Current-IPP (A) Non-Repetitive Peak Pulse Power vs. Pulse Duration (Pin1 to GND) P eak Pulse Power - Ppp (kW) 100 10 1 0.1 0.1 1 10 100 1000 P ulse Duration  tp(µs) ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/30/16 SP1255P Series SP3012 Symbol TVS Diode Arrays (SPA®® Diodes) Surge Protection - SP1555Series Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time Product Characteristics SP 1555 – 01 U T G G= Green T= Tape & Reel Series Number of Channels tL °C Part Numbering System TVS Diode Arrays (SPA® Diodes) Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition Package U=μDFN-6 Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. Part Marking System 5. Package surface matte finish VDI 11-13. P H 1 Product Series P = SP1555 Number of Channels Assembly Site Ordering Information Part Number Package Min. Order Qty. Packaging Option P0/P1 SP1555-01UTG µDFN-6 3000 Tape & Reel – 8mm tape/7” reel 4mm/4mm ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 09/30/16 Packaging Specification EIA RS-481 SP1255P Series TVS Diode Arrays (SPA®® Diodes) Surge Protection - SP1555Series Package Dimensions — µDFN-6 (1.8x2.0x0.55mm) Top View JEDEC MO-229 Millimeters Symbol B Nom Max Min Nom Max A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 - 0.05 0.000 - 0.002 0.15 Ref A3 C J N Side View F G P Y Z X Recommended Soldering Footprint Bottom View Inches Min 0.006 Ref D 1.75 1.80 1.85 0.069 0.071 0.073 E 1.95 2.00 2.05 0.077 0.079 0.081 b 0.15 0.20 0.25 0.006 0.008 0.010 L 0.20 0.30 0.40 0.008 0.012 0.016 D2 0.35 0.45 0.55 0.014 0.018 0.022 E2 0.74 0.84 0.94 0.029 0.033 0.037 e 0.40 BSC 0.016 BSC e1 0.80 BSC 0.031 BSC B 0.80 BSC 0.031 BSC C 0.35 0.45 0.55 0.014 0.018 0.022 F 0.81 0.84 0.87 0.032 0.033 0.034 G 0.82 0.85 0.88 0.032 0.033 0.034 J 0.24 0.25 0.26 0.010 0.010 0.010 N 0.47 0.48 0.49 0.018 0.019 0.020 P 0.24 0.25 0.26 0.010 0.010 0.010 X 0.23 0.24 0.25 0.009 0.009 0.009 Y 0.35 0.36 0.37 0.014 0.014 0.014 Z 0.62 0.64 0.66 0.024 0.025 0.026 Notes: 1. Dimension and tolerancing comform to ASME Y14.5M-1994. 2. Controlling dimensions: Millimeter. Converted Inch dimensions are not necessarily exact. P0 E F W Symbol Millimeters A0 1.95 +/- 0.05 B0 2.30 +/- 0.05 D0 1.50 + 0.10 D1 Ø 0.60 + 0.05 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 0.75 +/- 0.05 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00+/-0.05 T 0.25 +/- 0.02 W 8.00 + 0.30 /- 0.10 1.46 D1 ø155.37 D0 ø70.55 P2 ø13.22 P1 ø179.90 22.12 Embossed Carrier Tape & Reel Specification — µDFN-6 24.32 1.11 9.04 8mm TAPE AND REEL 5 T Pin1 Location K0 ©2016 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 10/04/16 B0 5 ø58.11 ø15.57 A0 SP1255P Series