SP3003-02XTG

TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series SP3003 Series 0.65pF Diode Array RoHS Pb GREEN Description The SP3003 has ultra low capacitance rail-to-rail diodes with an additional protection diode fabricated in a proprietary silicon avalanche technology to protect each I/O pin providing a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge and ± 15 kV air discharge without performance degradation. Their very low loading capacitance also makes them ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394. Pinout Features SP3003-02X/J NC SP3003-04X/J I/O 1 GND I/O 2 VCC SP3003-02UTG I/O 1 I/O 4 I/O1 1 6 NC GND VCC I/O2 2 5 NC I/O 2 I/O 3 GND 3 4 GND SP3003-0 4A SP3003-0 8A I/O 1 NC I/O 1 I/O 8 I/O 2 NC I/O 2 I/O 7 V CC GND I/O 3 NC I/O 3 NC I/O 4 I/O 6 I/O 4 NC GND I/O 5 6 5 4 SP3003-04ATG 10 9 • C  omplete line of small packaging helps save board space (SC70, SOT553, SOT563, MSOP10, µDFN-6L) • E  FT protection, IEC 61000-4-4, 40A (5/50ns) • Lightning, 2.5A (8/20μs as • AEC-Q101 qualified defined in IEC 61000-4-5 • R  oHS compliant and lead2nd Edition) free • Low capacitance of • Moisture Sensitivity 0.65pF (TYP) per I/O Level(MSL-1) Applications Functional Block Diagram SP3003-04J/XTG • L  ow leakage current of 0.5μA (MAX) at 5V • E  SD protection of ±8kV contact discharge, ±15kV air discharge, (IEC 61000-4-2) 8 7 6 SP3003-02UTG • LCD/ PDP TVs • Set Top Boxes • DVD Players • Mobile Phones • Desktops • Notebooks • MP3/ PMP • Computer Peripherals • Digital Cameras 1 2 3 1 SP3003-02J/XTG 5 4 2 3 4 5 SP3003-08ATG 10 9 8 7 6 Application Example DVI/ HDMI Port *Package is shown as transparent D2+ GND 1 2 3 1 2 3 4 D2- 5 D1+ Vcc/NC GND Additional Information D1- IC D0+ GND D0CLK+ Datasheet Resources Samples Vcc/NC GND CLK- Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. GND GND Signal GND A single, 4 channel SP3003-04 component can be used to protect four (4) of the data lines in a HDMI/DVI interface so two (2) SP3003-04 components provide protection for all eight (8) TMDS lines. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 2.5 A TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR ≤ 1µA 6 V Reverse Leakage Current ILEAK VR=5V 0.5 µA 10.0 12.0 V 11.8 15.0 Clamp Voltage1 IPP=2A, tp=8/20µs, Fwd VESD Diode Capacitance1 CI/O-GND Diode Capacitance1 CI/O-I/O Typ IPP=1A, tp=8/20µs, Fwd VC ESD Withstand Voltage1 Min Max Units V IEC61000-4-2 (Contact) ±8 kV IEC61000-4-2 (Air) ±15 Reverse Bias=0V 0.7 0.8 0.95 pF Reverse Bias=1.65V 0.55 0.65 0.8 pF kV Reverse Bias=0V 0.35 pF Note: 1. Parameter is guaranteed by design and/or component Insertion Loss (S21) I/O to GND Capacitance I/O - GND vs. Bias Voltage 1 1.00 0 0.95 0.90 -2 I/O Capacitance (pF) Insertion Loss [dB] -1 -3 -4 -5 -6 -7 0.80 VCC = Float 0.75 0.70 VCC = 3.3V 0.65 VCC = 5V 0.60 -8 0.55 -9 0.50 -10 1.E+06 0.85 1.E+07 1.E+08 Frequency [Hz] 1.E+09 1.E+10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 I/O DC Bias (V) © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Product Characteristics Capacitance [F] Capacitance vs. Frequency 1.4E-12 Lead Plating Matte Tin (SC70-x, MSOP-10) Pre-Plated Frame (SOT5x3, µDFN-6) 1.2E-12 Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 1E-12 8E-13 6E-13 4E-13 2E-13 0 1.E+06 1.E+07 1.E+08 1.E+09 Frequency [Hz] Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate Reflow 3°C/second max - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C +0/-5 tP TP °C Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Package Dimensions — SC70-5 5 6 Package e e Recommended Solder Pad Layout 4 not used E 5 JEDEC MO-203 Symbol 3 2 1 HE B D A2 A A1 SC70-5 Pins Millimeters Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.65 BSC e C L Inches Min 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions — SC70-6 6 Package e e 5 Recommended Solder Pad Layout 4 E 2 1 HE 6 JEDEC MO-203 Symbol 3 B D A2 A A1 SC70-6 Pins Millimeters Max Min Max A 0.80 1.10 0.031 0.043 A1 0.00 0.10 0.000 0.004 A2 0.70 1.00 0.028 0.039 B 0.15 0.30 0.006 0.012 c 0.08 0.25 0.003 0.010 D 1.85 2.25 0.073 0.089 E 1.15 1.35 0.045 0.053 0.65 BSC e C L Inches Min 0.026 BSC HE 2.00 2.40 0.079 0.094 L 0.26 0.46 0.010 0.018 Package Dimensions — SOT553 A D 6 5 4 2 3 (not used) e E L HE c B Package Recommended Solder Pad Layout SOT 553 Pins Symbol 5 Millimeters Inches Min Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 A 0.50 BSC e 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Package Dimensions — SOT563 A D 6 5 4 2 3 e E Package L Recommended Solder Pad Layout HE Symbol c 6 Millimeters Inches Min Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 A B SOT 563 Pins 0.50 BSC e 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Package Dimensions — MSOP10 Package MSOP10 JEDEC MO-187 Pins Symbol Recommended Solder Pad Layout Recommanded Solder Pad Layout 10 Millimeters Inches Min Max Min Max A - 1.10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 0.50 BSC e HE 0.40 0.020 BSC 0.80 0.016 0.031 Package Dimensions —µDFN-6L Recommended Solder Pad Layout Package µDFN-6L JEDEC MO-229 Pins Symbol 6 Millimeters Inches Min Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.002 0.125REF A3 0.005REF b 0.35 0.45 0.014 b1 0.15 0.25 0.006 0.018 0.010 D 1.55 1.65 0.062 0.065 D2 - - - - E 0.95 1.05 0.038 0.042 E2 - - - - 0.50REF e L 0.33 0.020REF 0.43 0.013 0.017 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Embossed Carrier Tape & Reel Specification — MSOP-10 Symbol Millimetres Max Min Max E 1.65 1.85 0.065 0.073 F 5.40 5.60 0.213 0.220 D 1.50 1.60 0.059 0.063 1.50 Min D1 P0 0.059 Min 3.90 4.10 40.0± 0.20 10P0 User Feeding Direction Inches Min 0.154 0.161 1.574±0.008 W 11.90 12.10 0.469 0.476 P 7.90 8.10 0.311 0.319 A0 5.20 5.40 0.205 0.213 B0 3.20 3.40 0.126 0.134 K0 1.20 1.40 0.047 0.055 0.30 ± 0.05 t 0.012± 0.002 Pin 1 Location Embossed Carrier Tape & Reel Specifications — SC70-5 and SC70-6 Symbol Millimetres Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.077 0.081 D 1.40 1.60 0.055 0.063 D1 1.00 1.25 0.039 0.049 P0 3.90 4.10 0.154 0.161 40.0± 0.20 10P0 User Feeding Direction Pin 1 Location Inches Min 1.574±0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.161 A0 2.14 2.34 0.084 0.092 B0 2.24 2.44 0.088 0.960 K0 1.12 1.32 0.044 0.052 0.27 max t 0.318 0.010 max Embossed Carrier Tape & Reel Specifications — SOT553 and SOT563 Symbol Millimetres Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 40.0± 0.20 10P0 User Feeding Direction Pin 1 Location Inches Min 1.574±0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.318 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t 0.22 max 0.009 max © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3003 Series Embossed Carrier Tape & Reel Specification — µDFN-6L Symbol Millimetres Min Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 40.0±0.20 10P0 1.574±0.008 W 7.90 8.30 0.311 0.319 P 3.90 4.10 0.154 0.161 A0 1.15 1.25 0.045 0.049 B0 1.75 1.85 0.069 0.073 K0 0.65 0.75 0.026 0.03 t 0.22 max 0.009 max User Feeding Direction Pin 1 Location Part Marking System Ordering Information F * * F** Inches Product Series Number of Channels F=SP3003 series (varies) Assembly Site (varies) Part Number Package Marking Min. Order Qty. SP3003-02JTG SC70-5 F*2 3000 SP3003-02UTG µDFN-6L F*2 3000 SP3003-02XTG SOT553 F*2 3000 SP3003-04ATG MSOP-10 F*4 4000 SP3003-04JTG SC70-6 F*4 3000 SP3003-04XTG SOT563 F*4 3000 SP3003-08ATG MSOP-10 F*8 4000 Part Numbering System SP 3003 -0x x T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Series Number of Channels -02 = 2 channel (SC70-5, SOT553, µDFN-6L packages) -04 = 4 channel (SC70-6, SOT563, MSOP-10 packages) -08 = 8 channel (MSOP-10 packages) Package A = MSOP-10, 4000 quantity J = SC70-5 or SC70-6, 3000 quantity X = SOT553 or SOT563, 5000 quantity U= µDFN-6L, 3000 quantity Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/12/19