SP3006-02XTG

TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3006 Series SP3006 Series 0.5pF, 8kV Diode Array Pb GREEN RoHS Description The SP3006 Series includes ultra low capacitance back toback zener diodes to protect high-speed ports of electronic equipment that may experience destructive electrostatic discharges (ESD). The robust diode can safely absorb repetitive ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Its very low loading capacitance makes it ideal for protecting high-speed data lines such as USB2.0, USB3.0, HDMI, and IEEE 1394. Pinout and Functional Block Diagram 6 5 1 2 Features • R  oHS compliant and leadfree • • ESD protection of ±8kV contact discharge, • ±15kV air discharge, (IEC 61000-4-2) • • E  FT protection, IEC 61000-4-4, 40A (5/50ns) • • L  ightning Protection, IEC 61000-4-5 2nd edition, 4 3 Life Support Note: The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Additional Information Resources Low capacitance of 0.5pF (@ VR=0V)  ow leakage current of L 0.5μA (MAX) at 5V  iniature SOT563 M package (1.6x1.6x0.5mm) saves board space AEC-Q101 qualified Applications Not Intended for Use in Life Support or Life Saving Applications Datasheet 2.0A (8/20µs) Samples • Game Consoles • Digital Cameras • LCD/ PDP TVs • Set Top Boxes • DVD Players • Smart Phones • Desktops • Notebooks • MP3/ PMP • Computer Peripherals Application Example USB Controller USB Port NC D+ D- IC NC SP3006 GND © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3006 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Parameter Value Units IPP Peak Current (tp=8/20μs) 2.0 A Storage Temperature Range TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Maximum Junction Temperature Maximum Lead Temperature (Soldering 20-40s) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Rating Units -55 to 150 °C 150 °C 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Breakdown Voltage Test Conditions Min 9.0 Typ Max Units VBR IR=5mA Reverse Standoff Voltage VRWM IR ≤ 1µA 6 V Reverse Leakage Current ILEAK VR=5V 0.5 µA Clamp Voltage1 IPP=1A, tp=8/20µs, Fwd VC ESD Withstand Voltage1 12.5 IPP=2A, tp=8/20µs, Fwd VESD Diode Capacitance 1 V 15.0 IEC 61000-4-2 (Contact) ±8 IEC 61000-4-2 (Air) ±15 CI/O-I/O V V kV kV Reverse Bias=0V 0.5 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Voltage Pulse Waveform 110% 1.2 100% 90% 80% 0.8 Percent of IPP Capacitance (pF) 1.0 0.6 0.4 70% 60% 50% 40% 30% 0.2 20% 10% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 DC Bias (V) 3.5 4.0 4.5 5.0 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3006 Series Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max 3°C/second max TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Product Characteristics tP TP Critical Zone TL to TP Ramp-up Temperature Reflow Condition TL T S(max) tL Ramp-dow Ramp-down Preheat T S(min) tS 25 time to peak temperature Time Ordering Information Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Part Number Package Marking Min. Order Qty. SP3006-02XTG SOT563 1*2 3000 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Numbering System SP 3006 TVS Diode Arrays (SPA® Diodes) Part Marking System 02 X T G G= Green T= Tape & Reel Series Number of Channels Package X = SOT563 1 * 2 1*2 Product Series Number of Channels 1=SP3006 series (varies) Assembly Site (varies) 02 = 2 channel © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3006 Series Package Dimensions — SOT563 Package A D E L Recommended Solder Pad Layout Symbol HE e SOT 563 Pins c Inches Min Max Min Max 0.50 0.60 0.020 0.024 B 0.17 0.27 0.007 0.011 c 0.08 0.18 0.003 0.007 D 1.50 1.70 0.059 0.067 E 1.10 1.30 0.043 0.051 A B 6 Millimeters 0.50 BSC e 0.020 BSC L 0.10 0.30 0.004 0.012 HE 1.50 1.70 0.059 0.067 Embossed Carrier Tape & Reel Specifications — SOT563 Symbol Pin 1 Location Inches Max Min Max E 1.65 1.85 0.064 0.073 F 3.45 3.55 0.135 0.139 P2 1.95 2.05 0.076 0.081 D 1.40 1.60 0.055 0.063 D1 0.45 0.55 0.017 0.021 P0 3.90 4.10 0.154 0.161 10P0 User Feeding Direction Millimetres Min 40.0+/- 0.20 1.574+/-0.008 W 7.70 8.10 0.303 P 3.90 4.10 0.153 0.318 0.161 A0 1.73 1.83 0.068 0.072 B0 1.73 1.83 0.068 0.072 K0 0.64 0.74 0.025 0.029 t 0.22 max 0.009 max Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/06/19