SP3012-04UTG

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series SP3012 Series 0.5pF Diode Array for USB3.0 Pb RoHS GREEN Description The SP3012 Series integrates either 3, 4 or 6 channels of ultra low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust devices can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal lines such as USB3.0, HDMI, USB2.0, and eSATA. Features Pinout 4 5 *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. 6 6 7 8 9 10 • ESD, IEC 61000-4-2, ±12kV contact, ±25kV air • EFT, IEC 61000-4-4, 40A (tP=5/50ns) 3 2 5 1 SP3012-03UTG 4 6 8 3 2 1 SP3012-04UTG (AEC-Q101 Qualified) 5 • Lightning, IEC 610004-5 2nd edition, 4A (tP=8/20μs) • Low capacitance of 0.5pF (TYP) per I/O 4 14 • Low leakage current of 1.5μA (MAX) at 5V 7 • Small form factor μDFN (JEDEC MO-229) and SOT23-6 (JEDEC MO178AB) packages provide flow through routing to simplify PCB layout • AEC-Q101 Qaulified (μDFN10 and μDFN14) • RoHS compliant and leadfree Applications 1 SP3012-06UTG (AEC-Q101 Qualified) *Pins 1, 2, 3, 4, 5, 6, 7 are not internally connected but should be connected to the opposite pin with the PCB trace. 1 2 SP3012-04HTG 3 Functional Block Diagram SP3012-03UTG SP3012-06UTG PIN 1 PIN 11 PIN 12 PIN 13 PIN 14 PIN 4 PIN 5 PIN 8 PIN 9 • LCD/PDP TVs • Set Top Boxes • External Storages • Smartphones • DVD/Blu-ray Players • Ultrabooks/Notebooks • Desktops • Digital Cameras • MP3/PMP • Automotive Electronics Application Example for USB3.0 USB Port USB Controller VBUS GND (PIN 2) PIN 10 SP3012-04UTG SP3012-04HTG SSTX+ SSTX- PIN 1 PIN 2 PIN 4 PIN 5 IC SSRX+ PIN 1 PIN 3 PIN 4 PIN 6 SSRXGND SP3012-06UTG D+ GND (PIN 3, 8) GND (PIN 2) D- Additional Information Signal GND Life Support Note: Not Intended for Use in Life Support or Life Saving Applications Datasheet Resources © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 Samples The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Absolute Maximum Ratings Parameter Value Peak Current (tp=8/20μs) TOP TSTOR Units 4.0 A Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C SP3012 Symbol IPP CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR ≤ 1µA 5.0 V Reverse Leakage Current ILEAK VR=5V, Any I/O to GND 1.5 µA 6.6 7.9 V IPP=2A, tp=8/20µs, Fwd 7.0 8.4 (VC2 - VC1) / (IPP2 - IPP1) 0.4 Clamp Voltage1 Dynamic Resistance RDYN ESD Withstand Voltage1 VESD Diode Capacitance IPP=1A, tp=8/20µs, Fwd VC 1 Diode Capacitance1 V Ω IEC61000-4-2 (Contact) ±12 kV IEC61000-4-2 (Air) ±25 kV CI/O-GND Reverse Bias=0V, f=1 MHz 0.5 0.65 pF CI/O-/O Reverse Bias=0V, f=1 MHz 0.3 0.4 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Bias Voltage Insertion Loss (S21) I/O to GND 0 1.0 -3 -6 Attenuation (dB) Capacitance (pF) 0.8 -9 -12 0.6 -15 -18 0.4 -21 -24 0.2 -27 0.0 -30 0.0 2.0 1.0 3.0 Bias Voltage (V) 4.0 Clamping Voltage vs. IPP TLP Current (A) 8.0 Clamp Voltage (V) 6.0 4.0 2.0 1 2 Frequency (MHz) 1000 Transmission Line Pulsing(TLP) Plot 10.0 0.0 100 5.0 Current (A) 3 4 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 1 2 3 4 5 6 7 8 TLP Voltage (V) 9 10 11 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Pulse Waveform Product Characteristics 110% Lead Plating Pre-Plated Frame (µDFN) Matte Tin (SOT23) Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% Notes : 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds tP TP Temperature Reflow Condition TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Critical Zone TL to TP Ramp-up time to peak temperature Time Part Numbering System SP 3012 – xx x T G TVS Diode Arrays (SPA® Diodes) Ordering Information Part Number Package Marking Min. Order Qty. SP3012-03UTG µDFN-6 V*3 3000 SP3012-04UTG µDFN-10 V*4 3000 SP3012-06UTG µDFN-14 V*6 3000 SP3012-04HTG SOT23-6 V*4 3000 G= Green T= Tape & Reel Series Package Number of Channels U= µDFN-6 (1.6x1.6mm) µDFN-10 (2.5x1.0mm) 03 = 3 channel 04 = 4 channel 06 = 6 channel µDFN-14 (3.5x1.35mm) H= SOT23-6 (3.0x1.75mm) Part Marking System V* * Number of Product Series Channels V = SP3012 Assembly Site 3 = 3 channel 4 = 4 channel 6 = 6 channel © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Application Information Signal Integrity of High-Speed Data Interfaces Figure 1: PCB Layout of the SP3012-06UTG for USB 3.0 Adding external ESD protection to a high-speed data port is not trivial for a variety of reasons. J1 1. ESD protection devices will add parasitic capacitance to each data line from line to GND and line to line causing impedance mismatches between the differential pairs. This ultimately affects the signal eye-diagram and whether or not the transceiver can distinguish a “1” from a “0”. 2. ESD devices should be placed as close as possible to the port being protected to maximize their effect (i.e. clamping capability) and minimize the effect that PCB trace inductance can have during an ESD transient. Depending on the package size and pinout this could be challenging and the bigger the package, the larger the land pattern must be, which adds more parasitic capacitance. U1 Figure 2 shows the USB 3.0 eye diagram that resulted from the PCB layout above with the SP3012-06UTG soldered on the landing pattern. 3. Stub traces can add another element of discontinuity adversely affecting signal integrity so ESD protection is best employed when it’s “overlaid” on the data lines or when the signals can simply pass underneath the device. 500 Taking all of this into account Littelfuse developed the SP3012 Series which was designed specifically for protection of high-speed data ports such as HDMI 1.3/1.4 and USB 3.0. They present less than 0.5pF from line to GND and only 0.3pF from line to line minimizing impedance mismatch between the differential pairs. Furthermore, the SP3012 is rated up to ±12kV (contact discharge) which far exceeds the maximum requirement of the IEC 61000-4-2 standard. There are two options available (4 channel and 6 channel) and both are housed in leadless µDFN packages so the data lines can pass directly underneath the device to reduce discontinuities and maintain signal integrity. 0 Wfrms:500 -500 Base: 27.0000 ns Scale:33.0 ps/div Figure 2: USB 3.0 Eye Diagram with the SP3012-06UTG Using a similar layout as above, Figure 3 shows the eye diagram that resulted using the SP3012-04UTG to protect the Super-Speed data lines and the SP3003-02UTG to protect the legacy data pair. 500 USB 3.0 Eye Diagram Data Figure 1 shows the layout used for the SP3012-06UTG in a USB 3.0 application. The traces routed toward the top are the two legacy USB 2.0 lines (D+/D-) that run at the slower speed of 480Mbps and therefore are not as critical as the 5Gbps Super-Speed traces. 0 Wfrms:850 -500 Base: 27.0000 ns Scale:33.0 ps/div Figure 3: USB 3.0 Eye Diagram with the SP3012-04UTG © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Package Dimensions — μDFN-6 Bottom View Top View 6 5 D2 A D 0.05 C L 4 4 6 5 0.05 C E E2 Pin 1 Index Area 1 2 3 2 3 B 1 Pin 1 chamfer 0.10 x 45’ ℮ Side View 0.05 C A3 A1 A Seating plane Package μDFN-6 (1.6x1.6x0.5mm) JEDEC MO-229 Symbol Millimeters Max Min Max A 0.45 0.55 0.018 0.022 A1 0.00 0.05 0.000 0.152Ref A3 0.002 0.006 Ref b 0.20 0.30 0.008 0.012 D 1.55 1.65 0.061 0.065 D2 1.05 1.30 0.042 0.052 E 1.50 1.70 0.060 0.067 E2 0.40 0.65 0.016 0.026 0.50 BSC e C Inches Min L 0.164 0.020BSC 0.316 0.006 0.012 b 0.10 M C A B 0.05 M C D Embossed Carrier Tape & Reel Specification — μDFN-6 t W E P2 Symbol Millimetres Min Max Min Max E 1.65 1.85 0.06 0.07 F 3.45 3.55 0.14 0.14 D1 1.00 1.25 0.04 0.05 1.50 MIN D P0 K0 A0 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 B0 F D1 P0 Inches 10P0 3.90 0.06 MIN 4.10 40.0+/- 0.20 0.15 0.16 1.57+/-0.01 W 7.90 8.30 0.31 0.33 P2 1.95 2.05 0.08 0.08 A0 1.78 1.88 0.07 0.07 B0 1.78 1.88 0.07 0.07 K0 0.84 0.94 0.03 t 0.25 TYP 0.04 0.01 TYP TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Package Dimensions— µDFN-10 (2.5x1.0x0.5mm) Top View Top View A D A D Package µDFN-10 (2.5x1.0x0.5mm) JEDEC MO-229 E Millimeters Symbol E Side View 0.05 C B C 0.05 C 0.10 A3 M C A B A1 0.05 M C A 0.05 C b1 C Bottom View b Nom Max Min Nom Max A 0.48 0.515 0.55 0.019 0.020 0.021 A1 0.00 -- 0.05 0.000 0.125 Ref A3 0.05 C b1 b Side View Seating Plane A3 A1 A Seating Plane 0.022 0.005 Ref b 0.15 0.20 0.25 0.006 0.008 0.012 b1 0.35 0.40 0.45 0.014 0.016 0.018 D 2.40 2.50 2.60 0.094 0.098 0.102 E 0.90 1.00 1.10 0.035 0.039 0.043 0.43 0.012 0.50 BSC e R0.125 Inches Min B 0.30 L 0.020 BSC 0.365 0.014 0.016 0.10 M LC A B 0.05 M C 2xR0.075mm (7x) Soldering Pad Layout Dimensions e Recomended Soldering Pad Layout Bottom View P1 R0.125 P Y Z (C) (Y1) G L X 2xR0.075mm (7x) X1 e Alternative Soldering Pad Layout Recomended Soldering Pad Layout P1 P1 P Inch Millimeter C G P P1 X X1 Y (0.034) 0.008 0.020 0.039 0.008 0.016 0.027 (0.875) 0.20 0.50 1.00 0.20 0.40 0.675 Y1 Z (0.061) 0.061 (1.55) 1.55 P Y Y (Y1) Z (C) G X (Y1) Z (C) G X X1 X1 Embossed Carrier Tape & Reel Specification— µDFN-10 Package P0 T User Feeding Direction B0 F W E D 0 P1 P2 D1 A0 K0 5º Max 5º Max Pin 1 Location µDFN-10 (2.5x1.0x0.5mm) Symbol Millimeters A0 1.30 +/- 0.10 B0 2.83 +/- 0.10 D0 Ø 1.50 + 0.10 D1 Ø 1.00 + 0.25 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 0.65 +/- 0.10 P0 4.00 +/- 0.10 P1 4.00 +/- 0.10 P2 2.00 +/- 0.05 T 0.254 +/- 0.02 W 8.00 + 0.30 /- 0.10 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Package Dimensions — µDFN-14 (3.5x1.35x0.5mm) µDFN-14 (3.5x1.35x0.5mm) Top View A D JEDEC MO-229 Millimeters E PIN 1 Index Area Symbol 1 2 3 4 Seating Plane A1 A C Nom Max Min Nom Max A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 B Side View A2 0.203 Ref A2 b Bottom View 0.008 Ref b 0.15 0.20 0.25 0.006 0.008 0.012 D 3.40 3.50 3.60 0.134 0.138 0.142 D2 - - - - - - E 1.25 1.35 1.45 0.050 0.054 0.058 E1 - - - - - - 0.500 BSC e 0.25 L Pin 1 Identification Chamfer 0.10X45º Inches Min 0.020 BSC 0.30 0.35 0.010 0.012 0.014 Notes: 1. Dimension and tolerancing comform to ASME Y14.5M-1994. 2. Controlling dimensions: Millimeter. Converted Inch dimensions are not necessarily exact. Recomended Soldering Pad Layout Soldering Pad Layout Dimensions Symbol Millimeter Symbol D E b L e s s1 Millimeters Inches Inches Nom Nom 3.30 1.65 0.30 0.50 0.50 typ 0.20 0.65 0.1299 0.0571 0.0118 0.0197 0.020 typ 0.0078 0.0256 Embossed Carrier Tape & Reel Specification — µDFN-14 P1 P2 P0 D0 User Feeding Direction E F W Pin 1 Location D1 A0 T K0 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 B0 Symbol Millimeters A0 1.58 +/- 0.10 B0 3.73 +/- 0.10 D0 Ø 1.50 + 0.10 D1 Ø 0.60 +/- 0.05 E 1.75 +/- 0.10 F 5.50 +/- 0.05 K0 0.68 + 0.12/ -0.10 P0 2.00 +/- 0.05 P1 4.00 +/- 0.10 P2 4.00 +/- 0.10 T 0.28 +0.02/ -0.05 W 12.00 + 0.30 /- 0.10 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3012 Series Package Dimensions — SOT23-6 Package SOT23 Pins 6 JEDEC MO-178AB Millimeters Min Max Max Notes A 0.900 1.450 0.035 0.057 - 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref e1 1.9 Ref 0.0748 Ref 0.30 0.600 0.012 8º 0º 6 N a M Min A1 L Recommended Solder Pad Layout Inches 0º - 0.023 6 4,5 6 8º - M 2.590 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - Notes: 1. Dimensioning and tolerancing Per ASME Y14.5M-1994. 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Foot length L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. 6. “N” is the number of terminal positions. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. P R O Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND REEL 14.4mm ACCESS HOLE 13mm 180mm 4.0mm 2.0mm 1.5mm DIA. HOLE 1.75mm CL 8mm 4.0mm 60mm GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. SOT-23 (8mm POCKET PITCH) 8.4mm USER DIRECTION OF FEED PIN 1 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. COVER TAPE © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17