SP3025-04HTG

SP3025-04HTG

  • 厂商:

    HAMLIN

  • 封装:

    SOT-23-6

  • 描述:

    SP3025-04HTG是一款低电容TVS二极管阵列,旨在为高速差分数据线提供针对ESD(静电放电)、CDE(电缆放电事件)、EFT(电快速瞬变)和雷电感应浪涌的保护。它采用SOT23 - 6L封装,...

  • 数据手册
  • 价格&库存
SP3025-04HTG 数据手册
TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SP3025 SP3025, 2.5V, 30A Diode Array RoHS Pb GREEN Description The SP3025 is a low-capacitance, TVS Diode Array designed to provide protection against ESD (electrostatic discharge), CDE (cable discharge events), EFT (electrical fast transients), and lightning induced surges for highspeed, differential data lines. It’s packaged in a SOT236L and each device can protect up 4 channels up to 30A (IEC 61000-4- 5 2nd edition,) and up to ±30kV ESD (IEC 61000-4-2). *Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace. 4 3 5 6 2Pinout 1 6 7 8 9 10 5 4 3 2 1 The SP3025 with its low capacitance and low clamping voltage makes it ideal for high-speed data interfaces such as 1GbE applications found in notebooks, switches, etc. Features SP3012-04UTG (AEC-Q101 Qualified) SP3012-03UTG 6 5 4 14 • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air • Low operating and clamping voltage • EFT, IEC 61000-4-4, 40A (5/50ns) • Provides protection for two differential data pairs (4 channels) up to 30A • Lightning, IEC 610004-5 2nd edition, 30A (tP=8/20μs) 1 1 (AEC-Q101 Qualified) 1 7 are not internally connected ted to the opposite pin • Low capacitance of 1.7pF@0V (TYP) 2 2 • Halogen free, Lead free and RoHS compliant • Moisture Sensitivity Level (MSL -1) • Low leakage current of 1nA (TYP) at 2.5V 3 SP3012-04HTG(AEC-Q101 Qualified) Functional Block Diagram 1 3 G,3,4 Applications 4 6 •10/100/1000 Ethernet • LVDS Interfaces • WAN/LAN Equipment • Integrated Magnetics • Desktops, Servers and Notebooks • Smart TV • 2.5G/5G/10G Ethernet 2 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: JC.01/12/21 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SP3025 Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 30 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage Test Conditions Min Typ 5.5 7.0 VRWM IR = 1μA Breakdown Voltage VBR IR = 1mA Reverse Leakage Current ILEAK VR=2.5V 1 Holding Voltage VHOLD I/O to GND 1.6 Clamp Voltage1 VC IPP=30A, tp=8/20μs 9 Dynamic Resistance2 RDYN ESD Withstand Voltage1,3 TLP, tp=100ns VESD CI/O-GND Diode Capacitance1 Units 2.5 V 100 nA 11 V V V 0.14 IEC 61000-4-2 (Contact Discharge) ±30 IEC 61000-4-2 (Air Discharge) ±30 Ω kV kV Reverse Bias=0V, f=1MHz CI/O-I/O Max 1.7 2.5 0.8 1.2 pF Notes: 1. Parameter is guaranteed by design and/or component characterization. 2. Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: start t1=70ns to end t2=90ns 3. Device stressed with ten non-repetitive ESD pulses. 8/20μs Pulse Waveform Capacitance vs. Reverse Bias 110% 100% 2.5 90% Capacitance (pF) Percent of IPP 80% 70% 60% 50% 40% 30% 20% 1.5 1.0 0.5 0.0 10% 0% 2.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0.0 0.5 1.0 1.5 Bias Voltage (V) 2.0 2.5 Time (μs) © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: JC.01/12/21 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SP3025 Negative Transmission Line Pulsing (TLP) Plot 25 0 20 -5 TLP Current (A) TLP Current (A) Positive Transmission Line Pulsing (TLP) Plot 15 10 5 0 -10 -15 -20 0 2 4 6 8 10 12 14 16 TLP Voltage (V) -25 -5 -4 -3 -2 -1 0 TLP Voltage (V) Clamping Voltage vs. Peak Pulse Current Clamp Voltage – VC (V) 12.0 10.0 8.0 6.0 4.0 2.0 0.0 0.0 5.0 10.0 15.0 20.0 Peak Pulse Current -I PP (A) 25.0 30.0 IEC 61000-4-2 +8kV Contact ESD Clamping Voltage IEC 61000-4-2 -8kV Contact ESD Clamping Voltage © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: JC.01/12/21 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SP3025 Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Ordering Information tP TP TL T S(max) tL Ramp-dow Ramp-down Preheat T S(min) tS 25 time to peak temperature Package Min. Order Qty. SP3025-04HTG SOT23-6L 3000 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches (0.102mm) Substrate Material Silicon Body Material Molded Compound UL Recognized compound meeting flammability rating V-0 Flammability Part Marking System Part Numbering System 5 SP 3025 4 TVS Diode Arrays (SPA® Diodes) 2 – 04 H T G G= Green T= Tape & Reel ADD* 1 Time Product Characteristics Part Number 6 Critical Zone TL to TP Ramp-up Temperature Reflow Condition Series Number of Channels Package H= SOT23-6L 3 AD : Part code D : Assembly code * : Date code © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: JC.01/12/21 TVS Diode Arrays (SPA® Diodes) Lightning Surge Protection- SP3025 Package Dimensions — SOT23-6L D Millimeters A1 A A2 E E1 Symbol Pin1 Bottom View bx6 e e1 L1 b1 L1 θ B b L Detail A Side View - - 1.45 A1 0.00 - 0.15 A2 0.90 1.15 1.30 b 0.30 - 0.50 b1 0.30 0.40 0.45 c 0.08 - 0.22 c1 0.08 0.13 0.20 D 2.75 2.90 3.05 E 2.60 2.80 3.00 E1 1.45 1.60 1.75 1.90 BSC L Section B-B 0.30 L1 0.50 0.60 0.60 REF L2 0.25 BSC Ɵ 0° 4° 8° 0.95 0.85 0.33 0.85 0.95 Max 0.95 BSC e1 B L Nom A e c Detail A c1 L2 (gauge plane) Top View Min 0.60 Recommended soldering pad layout (unit :mm) Embossed Carrier Tape & Reel Specification — SOT23-6L 8mm TAPE AND REEL 14.4mm ACCESS HOLE 13mm 180mm 60mm 4.0mm 2.0mm 1.5mm DIA. HOLE 1.75mm CL 8mm 4.0mm GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. SO T-23 (8mm POCKET PITCH) 8.4mm USER DIRECTION OF FEED PIN 1 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: JC.01/12/21
SP3025-04HTG 价格&库存

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SP3025-04HTG

    库存:0

    SP3025-04HTG
    •  国内价格
    • 10+5.59060
    • 200+3.33500
    • 800+2.33450
    • 3000+1.66750
    • 6000+1.58410
    • 30000+1.46740

    库存:1500

    SP3025-04HTG
    •  国内价格 香港价格
    • 1+14.049411+1.81855
    • 10+8.8879910+1.15046
    • 100+5.90642100+0.76453
    • 500+4.62778500+0.59902
    • 1000+4.216421000+0.54577

    库存:3392

    SP3025-04HTG
    •  国内价格 香港价格
    • 3000+3.078163000+0.39844
    • 6000+3.043796000+0.39399

    库存:3392

    SP3025-04HTG
    •  国内价格 香港价格
    • 3000+3.238813000+0.41923

    库存:0