SP3030-01ETG

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series SP3030 Series 0.5pF 20kV Unidirectional Discrete TVS Pb RoHS GREEN Description The SP3030 includes low capacitance rail to rail diodes with an additional Zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in the IEC61000-4-2 international standard (±20kV contact discharge) without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines such as HDMI, DVI, USB2.0, USB3.0 and eSATA. Features Pinout 1 • E  SD protection of ±20kV contact discharge, ±30kV air discharge, (IEC61000-4-2) • Low capacitance of 0.5pF @ VR=0V • E  FT protection, IEC61000-4-4, 40A (tp=5/50ns) • S  mall SOD882 packaging helps save board space • AEC-Q101 qualified • L  ightning Protection, IEC61000-4-5, 3A (tp=8/20µs) 2 (AEC-Q101 qualified) • L  ow leakage current of 0.1μA at 5V (SOD882 package) Applications Functional Block Diagram 1 • Digital Cameras • Ultrabook • MP3/ PMP • eReader • Set Top Boxes • Smart Phones • Portable Medical USB3.0 Application Example 2 Life Support Note: • Tablets USB Port Not Intended for Use in Life Support or Life Saving Applications VBUS The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. SP1003 *Packages are shown as transparent HDMI Application Example HDMI Port USB Controller D+ IC D*Packages are shown as transparent HDMI Chipset D2+ SSTX+ SSTX- D2- SSRX+ D1+ D1- SSRX- D0+ D0CLK+ Signal Ground CLK- IC SP3030 (x6) SP3030 (x8) Additional Information CEC SCL SDA HPD PWR SP3002 Datasheet © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 Resources Samples TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series Absolute Maximum Ratings Parameter Value Units IPP Peak Current (tp=8/20μs) 3.0 A Storage Temperature Range TOP Operating Temperature -40 to 125 °C Maximum Junction Temperature °C Maximum Lead Temperature (Soldering 20-40s) Storage Temperature TSTOR -55 to 150 Parameter Rating Units -55 to 150 °C 150 °C 260 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Reverse Leakage Current ILEAK Clamp Voltage1 Test Conditions VC ESD Withstand Voltage1 VESD Min Typ Max Units 5 V 0.5 µA VR=5V with 1pin at GND 0.1 IPP=1A, tp=8/20µs, Fwd 9.2 V IPP=2A, tp=8/20µs, Fwd 10.0 V IEC61000-4-2 (Contact) ±20 kV IEC61000-4-2 (Air) ±30 kV Dynamic Resistance RDYN (VC2-VC1)/(IPP2-IPP1) 0.55 Ω Diode Capacitance1 CI/O-I/O Reverse Bias=0V, f=1 MHz 0.5 pF Note: 1. Parameter is guaranteed by design and/or device characterization. Normalized Capacitance vs. Reverse Voltage Insertion Loss (S21) I/O to GND 2.0 -1 1.8 -2 1.6 Normalized Capacitance (pF) 0 Attenuation (dB) -3 -4 -5 -6 -7 1.2 1.0 0.8 0.6 0.4 -8 0.2 -9 -10 1.4 10 HDMI 1.4 Eye Diagram 100 Frequency (MHz) 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Bias Voltage (V) USB3.0 Eye Diagram © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 SP3030 Symbol Thermal Information TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series Pulse Waveform Transmission Line Pulsing(TLP) Plot 20 110% 16 80% 14 TLP Current (A) 18 90% Percent of IPP 100% 70% 60% 50% 40% 30% 20% 12 10 8 6 4 10% 2 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 0 Time (μs) 0 5 10 15 20 25 TLP Voltage (V) Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Part Numbering System SP 3030 – 01 E T G G= Green T= Tape & Reel Series Number of Channels tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Package E: SOD882 Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Marking System X Pin 1 © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17 Time °C Ramp-down Rate TVS Diode Arrays (SPA® Diodes) Critical Zone TL to TP Ramp-up TL TS(max) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition Product ID “T” or “W” TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP3030 Series Ordering Information Part Number Package Marking Packaging Options P0/P1 Packaging Specifications Min. Order Qty. SP3030-01ETG SOD882 “T” or “W” Tape & Reel - 8mm tape/7” reel 4mm/2mm EIA-481 10,000 Package Dimensions — SOD882 Symbol Package SOD882 JEDEC MO-236 Millimeters Typ Max Min Typ Max A 0.90 1.00 1.10 0.037 0.039 0.041 B 0.50 0.60 0.70 0.022 0.024 0.026 C 0.40 0.50 0.60 0.016 0.020 0.024 0.45 D Recommended Soldering Pad Layout Inches Min 0.018 E 0.20 0.25 0.35 0.008 0.010 0.012 F 0.45 0.50 0.55 0.018 0.020 0.022 Embossed Carrier Tape & Reel Specification — SOD882 P0 T Top Cover Tape 3° REF P2 Φ2: 1.55±0.05 E F A0 W B0 K0 P1 Φ: 0.40±0.05 W1 S R K M N Tape Dimensions Symbol Min Max A0 0.65 0.75 B0 1.10 1.20 K0 0.50 0.60 E 1.65 1.85 F 3.45 3.55 P0 3.90 4.10 P1 1.90 2.10 P2 1.95 2.05 T 1.95 2.05 W 7.90 8.10 Reel Dimensions (Size Ø 178) H W D evice Orientation in Tape Pin1 Millimeters Symbol Millimeters Min Max M 177.0 179.0 N 59.0 61.0 W 11.0 12.0 W1 8.5 9.5 H 12.5 13.5 S 1.9 2.1 K 10.8 11.2 R 0.95 1.05 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. © 2017 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 02/23/17