SP3031-01ETG

TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3031 SP3031 Series 0.8pF 10kV Unidirectional Discrete TVS RoHS Pb GREEN Description The SP3031 is a single channel low capacitance diode that provides protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust diode can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8 kV contact discharge and ±15 kV air discharge) without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines. Features Pinout 1 • RoHS-Compliant, LeadFree and Halogen-Free • Low capacitance of 0.8pF @ VR=0V • ESD protection of ±10kV contact discharge, ±15kV air discharge, (IEC 61000-4-2) • L  ow leakage current of 1μA at 5V • EFT, IEC 61000-4-4, 40A (5/50ns) • AEC-Q101 Qaulified • M  oisture Sensitivity Level(MSL-1) • L  ightning protection, IEC 61000-4-5, 2nd Edition: 8/20μs Surge, 5A Surge 2 Applications Functional Block Diagram 1 • USB 2.0, Ethernet • Smart Phones • MHL/MIPI/MDDI • External Storage • HDMI, Display Port, eSATA • Ultrabooks, Notebooks • Set Top Boxes, Game Consoles • Automotive • Tablets, eReaders USB2.0 Application Example USB2.0 Port 2 USB Controller VBUS D+ D- Additional Information SP1003 IC Datasheet Resources Samples SP3031 (x2) *Package is shown as transparent Life Support Note: Signal GND Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/23/20 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 5.0 A TOP Operating Temperature –40 to 125 °C TSTOR Storage Temperature –55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions VRWM I =1μA Breakdown Voltage Reverse Standoff Voltage VBR IR=1mA Reverse Leakage Current ILEAK VR=5V Clamp Voltage1 VC Dynamic Resistance2 RDYN ESD Withstand Voltage1 VESD Diode Capacitance1 Min Typ Max CI/O-I/O Units 5.0 R V 6.0 V 1 µA IPP=1A, tp=8/20µs, I/O to GND 6.9 IPP=2A, tp=8/20µs, I/O to GND 7.5 V TLP, tp=100ns, I/O to GND 0.6 Ω IEC 61000-4-2 (Contact) ±10 IEC 61000-4-2 (Air) ±15 V kV kV Reverse Bias=0V, f= 1 MHz 0.8 pF Note: 1. Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns Capacitance vs. Reverse Voltage 0 1.2 -5 1.0 Capacitance (pF) Attenuation (dB) Insertion Loss (S21) I/O to GND -10 -15 -20 -25 0.8 0.6 0.4 0.2 -30 0.0 -35 10 100 Frequency (MHz) 0.0 1000 1.0 2.0 3.0 4.0 5.0 DC Bias (V) 8/20µs Waveform 8kV Clamping Voltage 110% 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/23/20 SP3031 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Ordering Information Product Characteristics Lead Plating Pre-Plated Frame Part Number Package Min. Order Qty. Lead Material Copper Alloy SP3031-01ETG SOD882 10000 Substitute Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C +0/-5 °C Part Numbering System SP 3031 TVS Diode Arrays (SPA® Diodes) tP TP Temperature Reflow Condition TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Part Marking System – 01 E T G SOD882 G= Green f T= Tape & Reel Series Number of Channels Critical Zone TL to TP Ramp-up Pin 1 Indicator Product ID Package E: SOD882 © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/23/20 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3031 Package Dimensions — SOD882 Package Symbol SOD882 JEDEC MO-236 Millimeters Inches Min Typ Max Min Typ Max A 0.90 1.00 1.10 0.035 0.039 0.043 B 0.50 0.60 0.70 0.020 0.024 0.028 C 0.40 0.50 0.60 0.016 0.020 0.024 0.45 D 0.018 E 0.20 0.25 0.35 0.008 0.010 0.012 F 0.45 0.50 0.55 0.018 0.020 0.022 Recommended Soldering Pad Layout Embossed Carrier Tape & Reel Specification — SOD882 Symbol Millimeters A0 0.70±0.045 B0 1.10±0.045 K0 0.65±0.045 F 3.50±0.05 P1 2.00±0.10 W 8.00 + 0.30 -0.10 ,Ref. ,Ref. Notes : 1. All dimensions are in millimeters ,Ref. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2020 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 03/23/20