SP3118-01ETG

TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3118 Series SP3118 Series 0.3pF 10 kV Bidirectional Discrete TVS RoHS Pb GREEN Description The SP3118 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC 61000-4-2 international standard without performance degradation. The back-toback configuration provides symmetrical ESD protection. Features Pinout 0201 Flipchip 1 2 SOD882 1 • L  ow leakage current of 50nA (max) at 18V • E  FT protection, IEC 61000-4-4, 40A (tp=5/50ns) • Halogen free, Lead free and RoHS compliant • Lightning, 2A (8/20μs as defined in IEC 61000-4-5 2nd edition) 2 • Low capacitance of 0.3pF @ VR=0V Functional Block Diagram 1 • ESD protection of ±10kV contact discharge, ±15kV air discharge, (IEC 610004-2) • S  pace efficient 0201 and SOD882 footprint • Moisture Sensitivity Level (MSL -1) • AEC-Q101 qualified (SOD882) Applications 2 • Tablets • MP3/ PMP • Ultrabook • Set Top Boxes • eReader • Portable Medical • Smart Phones • NFC and FeliCa • Digital Cameras © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/18/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3118 Series Absolute Maximum Ratings Symbol Value Units IPP Peak Current (tp=8/20μs) Parameter 2.0 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Reverse Leakage Current ILEAK Clamp Voltage1 Test Conditions VC Min Typ Max Units 18 V VR=18V 10 50 nA IPP=1A, tp=8/20µs, Fwd 31 35 V IPP=2A, tp=8/20µs, Fwd 34 38 IEC 61000-4-2 (Contact) ±10 IEC 61000-4-2 (Air) ±15 V kV ESD Withstand Voltage1 VESD Dynamic Resistance2 RDYN TLP, tP=100ns, I/O to GND 0.75 Diode Capacitance1 CI/O-I/O Reverse Bias=0V, f=1 MHz 0.3 kV Ω 0.45 pF Note: 1. Parameter is guaranteed by design and/or component characterization. 2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns 8/20μS Pulse Waveform Capacitance vs. Reverse Bias 0.5 110% 100% 0.4 Capacitance (pF) 90% Percent of IPP 80% 70% 60% 50% 40% 30% 0.3 0.2 0.1 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 0 30.0 0 Time (μs) Transmission Line Pulsing (TLP) Plot 0 18 -1 15 18 -2 Attenuation (dB) 16 TLP Current (A) 6 9 12 Bias Voltage (V) Insertion Loss (S21) 20 14 12 10 8 6 -3 -4 -5 -6 -7 4 -8 2 0 3 -9 0 5 10 15 20 25 30 35 40 45 50 55 60 TLP Voltage (V) -10 10 100 Frequency (MHz) 1000 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/18/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3118 Series IEC 61000-4-2 +8kV Contact ESD Clamping Voltage IEC 61000-4-2 -8kV Contact ESD Clamping Voltage Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Part Numbering System SP 3118 – 01 x T G TVS Diode Arrays (SPA®Diodes) G= Green T= Tape & Reel Series Number of Channels Package W: 0201 Flipchip E: SOD882 Part Marking System SP3118-01WTG tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Product Characteristics of 0201 Flipchip Lead Plating Sn Lead Material Copper Lead Coplanarity 6µm(max) Substrate material Silicon Body Material Silicon Product Characteristics of SOD882 Lead Plating Pre-Plated Frame Lead Material Copper Alloy Substrate material Silicon Body Material Molded Epoxy Flammability UL Recognized epoxy meeting flammability rating V-0. Ordering Information SP3118-01ETG Part Number Package SP3118-01WTG 0201 Flipchip Min. Order Qty. 10000 SP3118-01ETG SOD882 10000 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/18/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3118 Series Package Dimensions — 0201 Flipchip D D1 0201 Flipchip E E1 Symbol D2 Top View Bottom View Millimeters Max Min Max D 0.605 0.655 0.0238 0.0258 E 0.305 0.355 0.0120 0.0140 D1 0.145 0.155 0.0057 0.0061 E1 0.245 0.255 0.0096 0.0100 0.400 BSC A A1 A2 D2 Side View 0.0157 BSC A 0.273 0.329 0.0107 A2 0.265 0.315 0.0104 0.0130 0.0124 A1 0.008 0.014 0.0003 0.0006 0.195 0.325 0.205 Inches Min 0.400 0.595 Recommended Soldering Pad Layout (mm) Embossed Carrier Tape & Reel Specification — 0201 Flipchip P1 P0 D P2 E F W D1 T A0 K0 B0 Component Orientation in Tape Symbol Millimeters A0 0.41+/-0.03 B0 0.70+/-0.03 D ø 1.50 + 0.10 D1 ø 0.20 +/- 0.05 E 1.75+/-0.10 F 3.50+/-0.05 K0 0.38+/-0.03 P0 4.00+/-0.10 P1 2.00+/-0.05 P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.23+/-0.02 ,Ref. ,Ref. ,Ref. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/18/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3118 Series Package Dimensions — SOD882 A E SOD882 JEDEC MO-236 Millimeters F B Symbol Package Min e Top View c Bottom View Max 0.043 0.90 1.10 0.035 B 0.50 0.70 0.020 0.028 C 0.40 0.60 0.016 0.024 C1 0.00 0.05 0.000 0.002 E 0.20 0.35 0.008 0.014 F 0.45 0.55 0.018 0.022 0.65 BSC 0.026 BSC 0.325 0.650 0.325 Min A e C1 Side View Inches Max 0.650 0.975 Recommended Soldering Pad Layout (mm) Embossed Carrier Tape & Reel Specification — SOD882 P0 T Top Cover Tape 3° REF P2 Φ2: 1.55±0.05 A0 W P1 User Feeding Direction Symbol Min Max F A0 0.65 0.75 B0 1.10 1.20 K0 0.50 0.60 E 1.65 1.85 Φ: 0.40±0.05 W1 S R K M N Pin 1 Location W Component Orientation in Tape ,Ref. ,Ref. T T T T T ,Ref. Millimetres E B0 K0 Tape Dimensions F 3.45 3.55 P0 3.90 4.10 P1 1.90 2.10 P2 1.95 2.05 T 1.95 2.05 W 7.90 8.10 Reel Dimensions (Size Φ178) H Symbol Millimetres Min Max M 177.0 179.0 N 59.0 61.0 W 11.0 12.0 W1 8.5 9.5 H 12.5 13.5 S 1.9 2.1 K 10.8 11.2 R 0.95 1.05 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/18/19