SP3130-01ETG

TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3130 Series SP3130 Series 0.3pF 10KV Bidirectional Discrete TVS RoHS Pb GREEN Description The SP3130 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC 61000-4-2 international standard without performance degradation. The back-to back configuration provides symmetrical ESD protection for data lines when AC signals are present. Features Pinout • ESD protection of ±10kV contact discharge, ±15kV air discharge, (IEC 610004-2) 0201 Flipchip 1 2 • E  FT protection, IEC 61000-4-4, 40A (tp=5/50ns) SOD882 1 • Lightning Protection, IEC 61000-4-5 2nd edition, 2A (tp=8/20µs) 2 Functional Block Diagram 1 • Low capacitance of 0.3pF @ VR=0V • L  ow leakage current of 50nA (max) at 28V • S  pace efficient 0201 and 0402 footprint • Halogen free, Lead free and RoHS compliant • AEC-Q101 qualified (SOD882) Applications 2 • Tablets • MP3/ PMP • Ultrabook • Set Top Boxes • eReader • Portable Medical • Smart Phones • NFC and FeliCa • Digital Cameras © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/18/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3130 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Units Parameter Rating Units IPP Peak Current (tp=8/20μs) 2.0 A Storage Temperature Range -55 to 150 °C TOP Operating Temperature -40 to 125 °C 260 °C TSTOR Storage Temperature -55 to 150 °C Maximum Lead Temperature (Soldering 20-40s) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Reverse Leakage Current ILEAK Clamp Voltage1 Test Conditions Min Typ Max Units 28 V VR=28V with 1pin at GND 10 50 nA IPP=1A, tp=8/20µs, Fwd 39 44 V IPP=2A, tp=8/20µs, Fwd 42 48 VC IEC61000-4-2 (Contact) ±10 IEC61000-4-2 (Air) ±15 V kV ESD Withstand Voltage1 VESD Dynamic Resistance2 RDYN TLP, tP=100ns, I/O to GND 1.0 Diode Capacitance1 CI/O-I/O Reverse Bias=0V, f=1 MHz 0.3 kV Ω 0.45 pF Note: 1. Parameter is guaranteed by design and/or device characterization. 2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns 8/20μS Pulse Waveform Capacitance vs. Reverse Bias 0.5 110% 100% 90% Capacitance (pF) Percent of IPP 80% 70% 60% 50% 40% 30% 20% 0.4 0.3 0.2 0.1 10% 0% 0.0 5.0 10.0 15.0 Time (μs) 20.0 25.0 30.0 0 0 4 8 12 16 Bias Voltage (V) 20 24 28 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/18/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3130 Series Transmission Line Pulsing (TLP) Plot Insertion Loss (S21) 20 0 18 -1 -2 14 -3 12 Attenuation (dB) TLP Current (A) 16 10 8 6 -5 -6 -7 4 -8 2 0 -4 -9 0 5 10 15 20 25 30 35 40 45 50 55 60 -10 TLP Voltage (V) 10 100 Frequency (MHz) 1000 Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max 3°C/second max TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Part Numbering System SP 3130 TVS Diode Arrays (SPA®Diodes) – 01 x T G Critical Zone TL to TP Ramp-up TL T S(max) tL Ramp-dow Ramp-down Preheat T S(min) tS 25 time to peak temperature Time Product Characteristics of 0201 Flipchip Lead Plating Sn Lead Material Copper Lead Coplanarity 6µm(max) Substrate material Silicon Body Material Silicon Product Characteristics of SOD882 G= Green T= Tape & Reel Series Number of Channels tP TP Temperature Reflow Condition Package W: 0201 Flipchip E: SOD882 Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/18/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3130 Series Ordering Information Part Number Package Min. Order Qty. Packaging Option P0/P1 Packaging Specification SP3130-01WTG 0201 Flipchip 10000 Tape & Reel – 8mm tape/7” reel 4mm/2mm EIA RS-481 SP3130-01ETG SOD882 10000 Tape & Reel – 8mm tape/7” reel 4mm/2mm EIA RS-481 Package Dimensions — 0201 Flipchip D 0201 Flipchip D1 E E1 Symbol D2 Top View Inches Min Max Min Max D 0.605 0.655 0.0238 0.0258 E 0.305 0.355 0.0120 0.0140 D1 0.145 0.155 0.0057 0.0061 E1 0.245 0.255 0.0096 0.0100 0.400 BSC D2 0.0157 BSC A 0.273 0.329 0.0107 A2 0.265 0.315 0.0104 0.0130 0.0124 A1 0.008 0.014 0.0003 0.0006 A1 A A2 Bottom View Millimeters Side View 0.195 0.325 0.205 0.400 0.595 Recommended Soldering Pad Layout (mm) Embossed Carrier Tape & Reel Specification — 0201 Flipchip P1 P0 D P2 E F W D1 T A0 K0 B0 D evic e O r ien tatio n in Tap e Symbol Millimeters A0 0.41+/-0.03 B0 0.70+/-0.03 D ø 1.50+0.10 D1 ø 0.20+/- 0.05 E 1.75+/-0.10 F 3.50+/-0.05 K0 0.38+/-0.03 P0 4.00+/-0.10 P1 2.00+/-0.05 P2 2.00+/-0.05 W 8.00+0.30/-0.10 T 0.23+/-0.02 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/18/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP3130 Series Package Dimensions — SOD882 A Symbol F B E c Top View SOD882 JEDEC MO-236 Millimeters A e Bottom View Package Inches Min Max Min Max 0.90 1.10 0.035 0.043 B 0.50 0.70 0.020 0.028 C 0.40 0.60 0.016 0.024 E 0.20 0.35 0.008 0.014 F 0.45 0.55 0.018 0.022 0.65 BSC e 0.026 BSC Side View 0.325 0.650 0.325 0.650 0.975 Recommended Soldering Pad Layout (mm) Embossed Carrier Tape & Reel Specification — SOD882 P0 T P2 Φ2: 1.55±0.05 E Top Cover Tape W 3° REF F A0 B0 K0 P1 Φ: 0.40±0.05 Reel Size 7 Inch W1 S R Tape Dimensions Symbol Millimetres Min Max A0 0.65 0.75 B0 1.10 1.20 K0 0.50 0.60 E 1.65 1.85 F 3.45 3.55 P0 3.90 4.10 P1 1.90 2.10 P2 1.95 2.05 T 1.95 2.05 W 7.90 8.10 K M N Reel Dimensions (Size Φ178) H W Device Orientation in Tape Symbol Millimetres Min Max M 177.0 179.0 N 59.0 61.0 W 11.0 12.0 W1 8.5 9.5 H 12.5 13.5 T T T T T S 1.9 2.1 K 10.8 11.2 R 0.95 1.05 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/18/19