SP3205-01ETG

TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESDProtection Protection- SP1027 - SP3205 General Purpose ESD SP3205 0.3pF 4A Unidirectional Diode Array RoHS Pb GREEN Description The SP3205 provides low capacitance, unidirectional and a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). The typical capacitance of 0.3pF helps ensure excellent signal integrity on the most challenging consumer electronics interfaces, such as USB 3.1, HDMI, DisplayPort, Thunderbolt and V-by-One®. It can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation and safely dissipate 4A of 8/20μs surge current (IEC 61000-4-5 2nd edition). Pinout Features 0201 Flipchip 1 2 SOD882 • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air • Low leakage current of 1nA (TYP) at 3.3V • EFT, IEC 61000-4-4, 40A (5/50ns) • Halogen free, lead free and RoHS compliant • Lightning, 4A (8/20μs as defined in IEC 61000-4-5 2nd edition) • Moisture Sensitivity Level (MSL -1) • AEC-Q101 Qualified • Low capacitance of 0.3pF (TYP @ VR=0V) Functional Block Diagram Applications 1 • USB 3.1 • S-ATA • HDMI • NFC • DisplayPort 2 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/13/20 TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESDProtection Protection- SP1333 - SP3205 General Purpose ESD SP1027 Absolute Maximum Ratings Symbol Parameter Value Units 4 A Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR=1μA Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK VR=3.3V Clamp Voltage1 Dynamic Resistance VC RDYN 2 ESD Withstand Voltage1 Diode Capacitance1 VESD CIO-GND Min 3.6 Typ Max Units 3.3 V 5.5 1 V 100 nA IPP=1A, tp=8/20μs 7.5 9 V IPP=4A, tp=8/20μs 9.5 12 V TLP, tP=100ns 0.3 IEC 61000-4-2 (Contact Discharge) ±30 IEC 61000-4-2 (Air Discharge) ±30 Reverse Bias=0V, f=1MHz Ω kV kV 0.3 0.5 pF Note: 1. Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 0.2ns rise time, and average window t1=70ns to t2= 90ns Capacitance vs. Reverse Bias Clamping voltage vs. IPP for 8/20μs waveshape 12.0 Clamp Voltage –VC (V) Capacitance (pF) 2.0 1.5 1.0 0.5 0.0 0.0 1.1 Bias Voltage (V) ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/13/20 2.2 3.3 10.0 8.0 6.0 4.0 2.0 0.0 1.0 2.0 3.0 Peak Pulse Current-IPP (A) 4.0 TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESDProtection Protection- SP1333 - SP3205 General Purpose ESD SP1027 Positive Transmission Line Pulsing (TLP) Plot 0 20 -2 18 -4 16 TLP Current (A) TLP Current (A) Negative Transmission Line Pulsing (TLP) Plot -6 -8 -10 -12 -14 14 12 10 8 6 -16 4 -18 2 0 -20 -10 -8 -6 -4 -2 0 TLP Voltage (V) IEC 61000-4-2 +8 kV Contact ESD Clamping Voltage 8/20μs Pulse Waveform 110% 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 Time (μs) ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/13/20 20.0 25.0 30.0 0 2 4 6 8 10 12 TLP Voltage (V) IEC 61000-4-2 -8 kV Contact ESD Clamping Voltage 14 TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESDProtection Protection- -SP1027 SP3205 General Purpose ESD SP1333 Soldering Parameters Pre Heat Pb – Free assembly 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Ordering Information Part Number Package Min. Order Qty. SP3205-01ETG SOD882 10,000 Part Marking System tP TP - Temperature Min (Ts(min)) Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 time to peak temperature Time Product Characteristics Lead Plating Pre-Plated Frame Lead material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Part Numbering System SP 3205 – 01 E T G Y* Y : Part code * : Date code ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/13/20 TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Series Number of Channels Package E: SOD882 TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESDProtection Protection- SP1027 - SP3205 General Purpose ESD Package Dimensions — SOD882 D e SOD882 Millimeters L2 E Symbol PIN#1 ID. (OPTIONAL) L1 TOP VIEW 1 BOTTOM VIEW-1 Min Typ Max Min Typ Max A 0.40 0.50 0.55 0.016 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 L1 0.20 0.25 0.30 0.008 0.010 0.012 L2 0.45 0.50 0.55 0.018 0.020 0.022 D 0.95 1.00 1.05 0.037 0.039 0.041 E 0.55 0.60 0.65 0.022 0.024 0.026 A1 L2 A e Inches SIDE VIEW L1 0.65 BSC e 1 0.026 BSC 0.60mm BOTTOM VIEW-2 0.35mm 0.30mm 1.00mm Recommended Soldering Pattern Drawing# : E03-B Embossed Carrier Tape & Reel Specification — SOD882 3 ' 7 < 3 Symbol ( ) % . 3 $ < '