SP3374NUTG

TVS Diode Array (SPA® Diodes) Lightning Surge Protection - SP3374NUTG SP3374NUTG 3.3V 40A Diode Array RoHS Pb GREEN Description The SP3374NUTG is a low-capacitance, TVS Diode Array designed to provide protection against ESD (electrostatic discharge), CDE (cable discharge events), EFT (electrical fast transients), and lightning induced surges for high-speed, differential data lines. It’s packaged in a µDFN package (3.0 x 2.0mm) and each device can protect up 4 channels or 2 differential pairs, up to 40A (IEC 61000-4-5 2nd edition,) and up to 30kV ESD (IEC 61000-4-2). The “flow-through” design minimizes signal distortion, reduces voltage overshoot, and provides a simplified PCB design. The SP3374NUTG with its low capacitance and low clamping voltage makes it ideal for high-speed data interfaces such as 1GbE applications found in notebooks, switches, etc. Pinout Features Top View 2 4 5 3 4 5 10 9 8 7 • Low capacitance of 3.5pF@0V (TYP) per I/O • Low leakage current of 0.1μA (TYP) at 3.3V Functional Block Diagram LINE2 IN (Pin 2) • Lightning, 40A (8/20μs as defined in IEC 61000-4-5 2nd Edition) 6 NOTE: PIN3, PIN8 are same potential with GND LINE1 IN (Pin 1) • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air • EFT, IEC 61000-4-4, 40A (5/50ns) GND 3 1 GND 2 6 GND 7 GND 1 8 GND 9 GND 10 Bottom View • μDFN-10 package is optimized for high-speed data line routing • Provides protection for two differential data pairs (4 channels) up to 40A • Low operating and clamping voltage • AEC-Q101 qualified • Halogen free, Lead free and RoHS compliant Applications LINE1 OUT (Pin 10) LINE2 OUT (Pin 9) •10/100/1000 Ethernet • LVDS Interfaces • WAN/LAN Equipment • Integrated Magnetics • Desktops, Servers and Notebooks • Smart TV Application Example RJ -45 Connector GND Ethernet PHY GND TP0+ TP0- LINE3 IN (Pin 4) LINE3 OUT (Pin 7) LINE4_IN (Pin 5) LINE4_OUT (Pin 6) TP1+ TP1TP2+ TP2TP3+ TP3- Life Support Note: Not Intended for Use in Life Support or Life Saving Applications SP2574N SP3374 The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/13/19 TVS Diode Array (SPA® Diodes) Lightning Surge Protection - SP3374NUTG Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 40 A PPk Peak Pulse Power (tp=8/20μs) 1000 W TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR ≤ 1µA Reverse Leakage Current IR VRWM = 3.3V, T = 25°C Snap Back Voltage Clamp Voltage Dynamic Resistance2 ESD Withstand Voltage VSB ISB = 50mA VC IPP = 1A, tp = 8/20μs Any I/O to Ground IPP = 10A, tp = 8/20μs Any I/O to Ground IPP = 25A, tp = 8/20μs Any I/O to Ground IPP = 40A, tp = 8/20μs Line-to-Line1, two I/O Pins connected together on each line RDYN VESD Min Typ Max 3.3 V 0.1 0.5 µA 2.8 V 5.5 10.5 18.0 V 25.0 TLP, tp=100ns, Any I/O to Ground 0.15 Ω IEC 61000-4-2 (Contact) ±30 kV IEC 61000-4-2 (Air) ±30 kV CI/O to GND Between I/O Pins and Ground VR = 0V, f = 1MHz 3.5 CI/O to I/O Between I/O Pins VR = 0V, f = 1MHz 1.7 Diode Capacitance Units 5.0 pF pF Notes: 1. Rating with 2 pins connected together per sugguested diagram ( For example, pin1 is connected to pin 10, pin 2 is connected to Pin 9, Pin 4 is connected to pin 7 and pin 5 is connected to pin 6) 2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/13/19 TVS Diode Array (SPA® Diodes) Lightning Surge Protection - SP3374NUTG Clamping Voltage vs. IPP (I/O to GND) 15.0 15 12.0 12 Clamp Voltage (VC) Capacitance (pF) Capacitance vs. Reverse Bias 9.0 6.0 6 3 3.0 0.0 9 0 0 0.5 1 1.5 2 2.5 3 3.5 0 5 Bias Voltage (V) Clamping Voltage vs. IPP (Line-to-Line) 10 15 20 25 25.0 30.0 Peak Pulse Current-IPP (A) 8/20μS Pulse Waveform 25 110% 100% Clamp Voltage (VC) 20 90% 80% Percent of IPP 15 10 60% 50% 40% 30% 5 0 70% 20% 10% 0 5 10 15 20 25 30 35 40 0% 0.0 5.0 10.0 15.0 20.0 Time (μs) Peak Pulse Current-IPP (A) Transmission Line Pulsing(TLP) Plot 20 18 16 TLP Current (A) 14 12 10 8 6 4 2 0 0 2 4 6 8 10 TLP Voltage (V) © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/13/19 TVS Diode Array (SPA® Diodes) Lightning Surge Protection - SP3374NUTG Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max 3°C/second max TS(max) to TL - Ramp-up Rate Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tP TP Critical Zone TL to TP Ramp-up Temperature Reflow Condition TL T S(max) tL Ramp-dow Ramp-down Preheat T S(min) tS 25 time to peak temperature Time Product Characteristics Ordering Information Part Number Package Min. Order Qty. SP3374NUTG µDFN-10 (3.0x2.0mm) 3000 Lead Plating Pre-Plated Frame Lead Material Copper Alloy Substrate material Silicon Body Material Molded Compound UL Recognized compound meeting flammability rating V-0 Flammability Part Numbering System Part Marking System SP 3374N U T G TVS Diode Arrays (SPA® Diodes) Series G= Green bG4 T= Tape & Reel Package μDFN-10 (3.0x2.0mm) © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/13/19 TVS Diode Array (SPA® Diodes) Lightning Surge Protection - SP3374NUTG Package Dimensions — µDFN-10 (3.0x2.0mm) D L b1 Package µDFN-10 (3.0x2.0mm) JEDEC E L1 e PIN1 INDICATOR Symbol b e1 e2 A1 0.25mm 0.25mm 0.95mm 0.40mm 1.40mm 0.85mm 0.95mm 1.98mm 1.40mm 0.95mm 1.00mm 1.98mm 0.95mm 0.60mm 0.65mm 0.65mm 0.60mm 0.60mm 0.40mm 0.60mm 0.60mm Recommended Soldering Pads Layout 0.65mm 0.65mm 0.60mm Inches Min Nom Max Min Nom Max A 0.50 0.60 0.65 0.020 0.024 0.026 A1 0.00 0.03 0.05 0.000 0.001 0.002 0.15 Ref A3 A A3 MO-229 Millimeters 0.006 Ref b 0.15 0.20 0.25 0.006 0.008 0.010 b1 0.25 0.35 0.45 0.010 0.014 0.018 D 2.90 3.00 3.10 0.114 0.118 0.122 E 1.90 2.00 2.10 0.075 0.079 0.083 e 0.60 BSC 0.024 BSC e1 0.65 BSC 0.026 BSC e2 0.95 BSC 0.037 L 0.25 0.30 0.35 0.010 0.012 0.014 L1 0.95 1.00 1.05 0.037 0.039 0.041 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Recommended Stencil Apertures Recommended Stencil thickness 5mils Tape & Reel Specification — µDFN-10 (3.0x2.0mm) P0 T P2 Package ø1.55±0.05 E Top Cover Tape W 5° Max F B0 P K0 ø1.55±0.05 A0 Device Orientation in Tape ø1.0±0.1 Symbol Device Orientation in Tape µDFN-10 (3.0x2.0mm) Millimeters A0 2.30 +/- 0.10 B0 3.20 +/- 0.10 E 1.75 +/- 0.10 F 3.50 +/- 0.05 K0 1.0 +/- 0.10 P 4.00 +/- 0.10 P0 4.00 +/- 0.10 P2 2.00 +/- 0.10 W 8.00 +0.30/- 0.10 Pin1 Location T 0.3 +/- 0.05 E F ø1.0±0.1 Pin1 Location Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/13/19