SP3530-01UTG

TVS Diode Arrays (SPA®® Diodes) Enhanced ESD Discrete TVS Series - SP3530 SP3530 0.3pF 22 kV unidirectional TVS diode RoHS Pb GREEN ELV Description This SP3530 unidirectional diode is fabricated in a proprietary silicon avalanche technology. This provides a high level of protection for electronic equipment that may be exposed to electrostatic discharges (ESD). This robust component can safely absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard (±8kV contact discharge) without performance degradation. The extremely low loading capacitance also makes it ideal for protecting high speed signal pins such as V-By-One®, HDMI, USB3.0, USB2.0, and IEEE 1394. Pinout Features Bottom View 1 1 1 1 SOD882 2 2 2 2 0201 DFN Bottom View • ESD, IEC 61000-4-2, ±22kV contact, ±22kV air • Facilitates excellent signal integrity • EFT, IEC 61000-4-4, 40A (tP=5/50ns) • ELV Compliant • Lightning, IEC 610004-5, 2nd edition, 2.5A (tP=8/20μs) • Halogen free, Lead free and RoHS compliant • Low capacitance of 0.3pF (TYP) at 3GHz SOD882 • Moisture Sensitivity Level (MSL-1) 35• Low profile 0201 DFN packages and SOD882 packages Functional Block Diagram Applications 1 1 • Ultra-high speed data lines • C  onsumer, mobile and portable electronics • USB 3.1, 3.0, 2.0 • Tablet PC and external storage with high speed interfaces • HDMI 2.0, 1.4a, 1.3 • DisplayPort(TM) • V-by-One® 2 Unidirectional ©2017 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/03/17 • AEC-Q101 qualified • LVDS interfaces 2 Bidirectional • Applications requiring high ESD performance in small packages TVS Diode Arrays (SPA®® Diodes) Enhanced ESD Discrete TVS Series - SP3530 Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 2.5 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics - (TOP=25°C) Parameter Test Conditions Min Typ Max Units Input Capacitance @ VR = 0V, f = 3GHz 0.30 pF Breakdown Voltage VBR @ IT=1mA 8.2 V Reverse Working Voltage IR≤1μA Reverse Leakage Current IL @ VRWM=5.0V 0.02 TLP, tP=100ns, I/O to GND 0.58 Ω 11.8 V Dynamic Resistance 2 VCL @ IPP=2.5A Clamping Voltage 1 ESD Withstand Voltage1 IEC 61000-4-2 (Contact) ±22 IEC 61000-4-2 (Air) ±22 7.0 V 1 μA kV Note: 1. Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns Clamping Voltage vs IPP 8/20μs Pulse Waveform 110% 14.0 100% 90% 10.0 80% Percent of IPP Clamp Voltage (VC) 12.0 8.0 6.0 4.0 40% 20% 10% 1 1.5 2 Peak Pulse Current - IPP(A) ©2017 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/03/17 50% 30% 2.0 0.0 70% 60% 2.5 0% 0.0 5.0 10.0 15.0 Time (μs) 20.0 25.0 30.0 TVS Diode Arrays (SPA®® Diodes) Enhanced ESD Discrete TVS Series - SP3530 Negative Transmission Line Pulsing (TLP) Plot 40 0 35 -5 30 -10 TLP Current (A) TLP Current (A) Positive Transmission Line Pulsing (TLP) Plot 25 20 15 -15 -20 -25 10 -30 5 -35 0 -40 0 5 10 15 20 25 30 35 -18 -16 -14 -12 IEC61000−4−2 +8 kV Contact ESD Clamping Voltage -10 -8 TLP Voltage (V) TLP Voltage (V) -6 -4 -2 0 IEC61000−4−2 -8 kV Contact ESD Clamping Voltage Soldering Parameters - Temperature Min (Ts(min)) Pre Heat Pb – Free assembly 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C ©2017 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/03/17 tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time TVS Diode Arrays (SPA®® Diodes) Enhanced ESD Discrete TVS Series - SP3530 Package Dimensions — 0201 DFN D e E L2 Symbol PIN1 L1 Top View h 1 A1 A Bottom View Millimeters Min Inches Max Max Min Min Max A 0.23 0.28 0.33 0.009 0.011 0.013 A1 0.00 0.02 0.05 0.000 0.001 0.002 L1 0.12 0.18 0.24 0.005 0.007 0.009 L2 0.18 0.24 0.30 0.007 0.009 0.012 D 0.55 0.60 0.65 0.022 0.024 0.026 E 0.25 0.30 0.35 0.010 0.012 0.014 e 0.35 (BSC) 0.014 (BSC) h 0.05 ( x 45° ) 0.002 ( x 45° ) Side View Side View Package outline 0.32mm 0.14mm 0.24mm Recommended soldering pad layout Package Dimensions — SOD882 D e h E L2 Symbol L1 PIN1 Top View 1 Bottom View 0.65mm A A1 Package outline Side View 0.40mm Millimeters Max Max A 0.40 0.45 0.50 0.016 0.018 0.020 A1 0.00 0.02 0.05 0.000 0.001 0.002 0.20 0.25 0.30 0.008 0.010 0.012 0.45 0.50 0.55 0.018 0.020 0.022 D 0.90 1.00 1.10 0.035 0.039 0.043 E 0.50 0.60 0.70 0.020 0.024 0.028 e 0.65 (BSC) 0.026 (BSC) h 0.125 ( x 45° ) 0.005 ( x 45° ) Part Marking System + SP 3530 – 01 U T G G= Green T= Tape & Reel Revision: 07/03/17 Max L1 Part Numbering System ©2017 Littelfuse, Inc. Specifications are subject to change without notice. Min L2 Recommended soldering pad layout Series Number of Channels Min 0.30mm 1.10mm TVS Diode Arrays (SPA® Diodes) Inches Min Package U: 0201 DFN E: SOD882 Ordering Information Part Number Package SP3530-01UTG 0201 DFN SP3530-01ETG SOD882 Marking + Min. Order Qty. 15000 10000 P1 TVS Diode Arrays (SPA®® Diodes) W1 S Enhanced ESD Discrete TVS Series - SP3530 R K M N H W Embossed Carrier Tape & Reel Specification — 0201 DFN P1 D0 P2 P0 Symbol Millimeters A0 0.33 min/0.41 max Device Orientation in Tape E1 F W Pin1 B0 0.63 min/0.71 max D0 ø 1.50 +0.10/ -0 D1 ø 0.20 +/- 0.05 E1 1.75+/-0.10 F 3.50+/-0.05 K0 0.30 min/0.39 max P0 4.00+/-0.10 2.00+/-0.10 P1 D1 T A0 K0 P0 T Top Cover Tape B0 3° REF P2 P2 W 2.00+/-0.05 Φ2: 1.558.00+0.30/-0.10 ±0.05 0.13 min/0.25 max T E F A0 W B0 K0 8mm TAPE AND REEL Φ: 0.40±0.05 P1 Embossed Carrier Tape & Reel Specification — SOD882 W1 S R M N Symbol Millimeters A0 0.70+/-0.045 B0 1.10+/-0.045 K0 0.65+/-0.045 F W K H 3.50+/-0.05 P1 2.00+/-0.10 W 8.00 + 0.30 -0.10 Device Orientation in Tape Pin1 8mm TAPE AND REEL Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimier-electronics. ©2017 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 07/03/17