SP4322-01ETG

TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP4322 SP4322 0.4pF 11A Bidirectional Diode Array RoHS Pb GREEN Description SP4322 is specifically designed to protect high-speed interfaces against ElectroStatic Discharge (ESD), such as DisplayPort interfaces and USB 3.1 Gen 1. The signal line is protected by low line capacitance of 0.4 pF typical. SP4322 can absorb repetitive ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard without performance degradation and safely dissipate 11A of 8/20μs surge current (IEC 61000-4-5 2nd edition). Note: This package image is for example and reference only. for detail package drawing, please refer to the package section in this datasheet. Pinout Excellent low capacitance, clamping capability, low leakage, and fast response time make this part an ideal solution for protecting high speed data lines. Features 0201 Flipchip 1 2 SOD882 • ESD, IEC 61000-4-2, ±18kV contact, ±30kV air • Low leakage current of 1nA (TYP) at 5V • EFT, IEC 61000-4-4, 40A (5/50ns) • Halogen free, lead free and RoHS compliant • Lightning, 11A (8/20μs as defined in IEC 61000-4-5 2nd edition) • Moisture Sensitivity Level (MSL -1) • AEC-Q101 Qualified • Low capacitance of 0.4pF (TYP @ VR=0V) Functional Block Diagram 1 Applications 2 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/14/20 • USB 3.1 • NFC • DisplayPort • 1G/2.5G/10G Ethernet • S-ATA TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP4322 Absolute Maximum Ratings Symbol Parameter Value Units 11 A Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C IPP Peak Current (tp=8/20μs) TOP TSTOR CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR=1μA Breakdown Voltage VBR IR=1mA 9 Reverse Leakage Current ILEAK VR=5V 1 Holding Voltage VHOLD Clamp Voltage1 VC Dynamic Resistance RDYN 2 ESD Withstand Voltage1 VESD Diode Capacitance1 Min Typ Max Units 5 V V 100 nA I/O to I/O 2.3 V IPP=1A, tp=8/20μs 4 V IPP=11A, tp=8/20μs 8 V TLP, tP=100ns 0.2 Ω IEC 61000-4-2 (Contact Discharge) ±18 kV IEC 61000-4-2 (Air Discharge) ±30 kV CIO-GND Reverse Bias=0V, f=1MHz 0.4 0.5 pF Note: 1. Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 0.2ns rise time, and average window t1=70ns to t2= 90ns Capacitance vs. Reverse Bias Clamping voltage vs. IPP for 8/20μs waveshape 1.0 10.0 0.9 Clamp Voltage (VC) Capacitance (pF) 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 8.0 6.0 4.0 2.0 0.0 0 0.5 1 1.5 2 2.5 3 Bias Voltage (V) ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/14/20 3.5 4 4.5 5 1 3 5 7 Peak Pulse Current-IPP (A) 9 11 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP4322 Positive Transmission Line Pulsing (TLP) Plot Negative Transmission Line Pulsing (TLP) Plot 0 24 -2 22 -4 20 18 -8 TLP Current (A) TLP Current (A) -6 -10 -12 -14 -16 -18 14 12 10 8 6 -20 4 -22 -24 16 2 -20 -15 -10 -5 TLP Voltage (V) 0 0 0 5 10 TLP Voltage (V) 15 20 8/20μs Pulse Waveform 110% 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 25.0 30.0 Time (μs) IEC 61000-4-2 +8 kV Contact ESD Clamping Voltage ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/14/20 IEC 61000-4-2 -8 kV Contact ESD Clamping Voltage TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP4322 Soldering Parameters Pre Heat Pb – Free assembly 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Ordering Information Part Number Package Min. Order Qty. SP4322-01ETG SOD882 10,000 Part Marking System 1 tP TP - Temperature Min (Ts(min)) Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 time to peak temperature Time Product Characteristics Lead Plating Pre-Plated Frame, Tin Lead material Copper Alloy Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 Part Numbering System 2 SP 4322 – 01 E T G TVS Diode Arrays (SPA® Diodes) G= Green T= Tape & Reel Date code Part code ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/14/20 Series Number of Channels Package E: SOD882 TVS Diode Arrays (SPA® Diodes) Low Capacitance ESD Protection - SP4322 Package Dimensions — SOD882 D e SOD882 L2 E Symbol PIN#1 ID. (OPTIONAL) L1 TOP VIEW 1 BOTTOM VIEW-1 Inches Min Typ Max Min Typ Max A 0.40 0.50 0.55 0.016 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 L1 0.20 0.25 0.30 0.008 0.010 0.012 L2 0.45 0.50 0.55 0.018 0.020 0.022 D 0.95 1.00 1.05 0.037 0.039 0.041 E 0.55 0.60 0.65 0.022 0.024 0.026 L2 A1 A e Millimeters SIDE VIEW L1 1 e 0.65 BSC 0.026 BSC 0.60mm BOTTOM VIEW-2 0.35mm 0.30mm 1.00mm Recommended Soldering Pattern Drawing# : E03-B Embossed Carrier Tape & Reel Specification — SOD882 Symbol Millimeters A0 0.70+/-0.045 B0 1.10+/-0.045 K0 0.65+/-0.045 F 3.50+/-0.05 P1 2.00+/-0.10 W 8.00 + 0.30 -0.10 ,Ref. ,Ref. 8mm TAPE AND REEL ,Ref. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/14/20