SP5001-04TTG

TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP5001 Series SP5001 Series 4 Channel TVS Common Mode Filter RoHS Pb GREEN Description The SP5001 Series is a highly integrated Common Mode Filter (CMF) providing both ESD protection and EMI common mode noise filtering for systems using high speed differential serial interfaces, such as MIPI D-PHY or HDMI. The SP5001 Series can protect and filter two differential line pairs in a small RoHS-compliant TDFN-10 package, with cost and space savings over discrete solutions. Pinout Features In 1+ 1 1 0 Out 1+ In 1- 2 9 Out 1- G ND 3 8 G ND In 2+ 4 7 Out 2+ In 2- 5 6 Out 2- • Large differential bandwidth > 2.5 GHz • High Common Mode Stop Band Attenuation: > 25 dB at 700 MHz > 30 dB at 800 MHz • ±15kV ESD protection per channel (IEC 610004-2 Level 4, contact discharge and ±30kV air discharge) Note :This drawing is not to scale. Functional Block Diagram External • RoHS-compliant, Leadfree packaging • Moisture Sensitivity Level (MSL-1) Applications Pin1 Pin10 Pin2 Pin9 Pin4 Pin7 Pin5 Pin6 (Connector) Pin3 • TDFN-10 2.50mm × 2.00mm × 0.75mm package with 0.50mm lead pitch • HDMI/DVI Display in Mobile Phones Internal • MIPI D-PHY (CSI-2, DSI, etc) in Mobile Phones and Digital Still Cameras (ASIC) Pin8 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/19/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP5001 Series Absolute Maximum Ratings Symbol Parameter Value Units IDC PDC TOP TSTOR DC Current Per Line DC Package Power Rating Operating Temperature Storage Temperature 100 0.5 -40 to 125 -55 to 150 mA W °C °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Channel Resistance Symbol Test Conditions RCH Pins 1−10, 2−9, 4−7 and 5−6 VI/O = 1.65VDC Reverse Bias; f=1MHz, 30mVAC Total Channel Capacitance CTOTAL Reverse Standoff Voltage VRWM Min Typ Max Units 8.0 0.8 Ω 1.3 pF 5.0 V Breakdown Voltage VBR IT=1mA 6.0 8.0 10.0 V Forward Voltage at IF VF IF=1mA 0.4 0.7 1.5 V VI/O =3.3V 0.01 0.10 µA Positive (tp=8/20µs) 1.3 Reverse Leakage Current ILEAK RDYN Dynamic Resistance2 3 ESD Withstand Voltage1 2 Differential Mode Cutoff Frequency2 Common Mode Stop Band Attenuation2 VESD Negative (tp=8/20µs) 0.7 TLP, tp=100ns, I/O to GND 0.36 Ω IEC 61000-4-2 (Contact Discharge) ±15 kV IEC 61000-4-2 (Air Discharge) ±30 kV F3dB ZSOURCE=50 Ω, ZLOAD50 Ω 2.5 GHz Fα f=800MHz 30 dB Notes: 1. ESD zapping at I/O pins (1,2,4,5) with respect to GND. 2. Guaranteed by design. 3. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Differential Mode Attenuation SDD21 vs. Frequency (Zdiff = 100Ω) Common Mode Attenuation SCC21 vs. Frequency (Zcomm= 50Ω) 0 0 -1 -5 -2 -10 Inseron Loss(dB) Insertion Loss(dB) -3 -4 -5 -6 -7 -15 -20 -25 -30 -8 -35 -9 -10 -40 1 10 100 Frequency (MHz) 1000 1 10 100 Frequency (MHz) 1000 © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/19/19 TVS Diode Array (SPA® Diodes) Low Capacitance ESD Protection - SP5001 Series Differential Return Loss SDD11 vs. Frequency (Zdiff = 100Ω) Differential Return Loss SDD22 vs. Frequency (Zdiff = 100Ω) 0 0 -5 -5 -10 Inseron Loss(dB) Inseron Loss(dB) -10 -15 -20 -25 -15 -20 -25 -30 -30 -35 -35 -40 -40 1 10 100 Frequency (MHz) 1 1000 Transmission Line Pulsing (TLP) Plot 10 1000 Part Numbering System SP 5001 22 – 04 T T G TVS Diode Arrays (SPA® Diodes ) 20 18 G= Green T= Tape & Reel Series 16 TLP Current (A) 100 Frequency (MHz) Package Number of Channels 14 TDFN-10 (2.5x2.0mm) 04 = 4 Channel TDFN-10 12 10 Part Marking System 8 32 *** 6 4 Product Series 32 = SP5001 2 0 0 2 4 6 8 10 12 14 16 Date Code (Year / Week) TLP Voltage (V) Soldering Parameters Reflow Condition Pre Heat Ordering Information Pb – Free assembly Part Number Package Size Min. Order Qty. SP5001-04TTG TDFN-10 2.5x2.0mm 3000 - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max Reflow 3°C/second max - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Critical Zone TL to TP Ramp-up Temperature TS(max) to TL - Ramp-up Rate tP TP TL T S(max) tL Ramp-dow Ramp-down Preheat T S(min) tS 25 time to peak temperature Time © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/19/19 Low Capacitance ESD Protection - SP5001 Series Package Dimensions —TDFN-10 D 0.10 TDFN-10 A B L 2X C L L1 PIN 1 MARKING Symbol Millimeters C 0.10 0.05 C TOP VIEW Max Min Max A 0.70 0.80 0.028 0.031 A1 0.00 0.05 0.000 0.002 DETAIL B A3 C C 8X 0.006 0.010 2.50 BSC 0.098 BSC ALTERNATE CONSTRUCTIONS E 2.00 BSC 0.079 BSC e 0.50 BSC PA C K A G E O U T L INE 0.30 0.020 BSC L 0.70 0.90 0.028 0.035 L1 0.05 0.15 0.002 0.006 2.30 8X L 0.10 MIN 0.25 D 8X 1.07 5 0.008 REF DETAIL B SIDE VIEW DETAIL A 0.15 b A1 A1 1 0.2 REF A3 A 0.05 A3 MOLD CMPD EXPOSED Cu Inches Min DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS 2X JEDEC MO-229 E 2 TVS Diode Array (SPA® Diodes) 1 10 e 6 0.45 9X b 0.10 M C 0.05 M C A B BOTTOM VIEW 0.50 P I T C H Recommended Soldering Footprint Tape & Reel Specification –TDFN-10 P0 T P2 Φ 1.50 +0.10 E Top Cover Tape A0 F W 5° Max K0 B0 P Φ 1.50 +0.10 Device Orientation in Tape Φ 1.00 ±0.05 Device Orientation in Tape Symbol Dimensions Millimetres E 1.75+/- 0.10 F 3.5 +/- 0.05 P 4.0 +/- 0.10 P0 4.0 +/- 0.10 P2 2.0 +/- 0.05 W 8.00 +0.30/- 0.10 B0 2.77 +/- 0.05 K0 1.05 +/- 0.05 T 0.25+/- 0.02 Pin1 Location A0 2.19 +/- 0.05 E F Φ 1.00 ±0.05 Pin1 Location Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/19/19