SP5003-04TTG

TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP5003 Series SP5003 Series 4 Channel Common Mode Filter 12/31/2020 RoHS Pb GREEN ESU270-49 N/A Description The SP5003 Series is a highly integrated Common Mode Filter (CMF) providing both ESD protection and EMI common mode noise filtering for systems using high speed differential serial interfaces, such as MIPI D-PHY or HDMI. The SP5003 Series can protect and filter two differential line pairs in a small RoHS-compliant TDFN-10 package, with cost and space savings over discrete solutions. Pinout Features 10 1 • Large differential bandwidth > 4.0 GHz 9 2 • High Common Mode Stop Band Attenuation: 8 3 7 4 6 > 16 dB at 900 MHz • Common Mode Imped ance: Zc: 32Ω at 100 MHz • TDFN-10 2.50mm × 2.00mm × 0.75mm package with 0.50mm lead pitch 5 Note: Bottom-view Functional Block Diagram External • RoHS-compliant, Leadfree packaging • Moisture Sensitivity Level (MSL-1) Applications Pin1 Pin10 Pin2 Pin9 Pin4 Pin7 Pin5 Pin6 (Connector) Pin3 • ±15kV ESD protection per channel (IEC 610004-2 Level 4, contact discharge) • HDMI/DVI Display in Mobile Phones Internal (ASIC) • MIPI D-PHY (CSI-2, DSI, etc) in Mobile Phones and Digital Still Cameras Pin8 © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/27/21 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP5003 Series Absolute Maximum Ratings Symbol Parameter Value Units IDC DC Current Per Line 100 mA PDC DC Package Power Rating 0.5 Watts TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions RCH Total Channel Capacitance CTOTAL Reverse Standoff Voltage VRWM Channel Resistance Breakdown Voltage Typ Max Units Pins 1−10, 2−9, 4−7 and 5−6 3.5 5.0 Ω VI/O = 1.65VDC Reverse Bias; f=1MHz, 30mVAC 0.8 1.3 pF 5.0 V 8.0 10.0 V VBR Forward Voltage at IF Min IT=1mA 6.0 0.4 VF IF=1mA 0.7 1.5 V Reverse Leakage Current ILEAK VLeak=+3.3V 0.01 0.10 µA Positive (tp=8/20µs) 1.36 Dynamic Resistance2 3 RDYN Negative (tp=8/20µs) 0.6 TLP, tp=100ns, I/O to GND Ω 0.42 IEC 61000-4-2 (Contact Discharge) ±15 kV IEC 61000-4-2 (Air Discharge) ±30 kV ESD Withstand Voltage1 2 VESD Differential Mode Cutoff Frequency2 F3dB ZSOURCE=50 Ω, ZLOAD50 Ω 4.0 GHz Common Mode Impedance ZC @100MHz 32 Ω Common Mode Stop Band Attenuation2 Fatten f=900MHz 16 dB Notes: 1. ESD zapping at I/O pins (1,2,4,5) with respect to GND. 2. Guaranteed by design. 3. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Differential Mode Attenuation vs. Frequency Common Mode Attenuation vs. Frequency 0 0 −1 −5 −10 −3 Inseron Loss(dB) Inseron Loss(dB) −2 −4 −5 −6 −7 −15 −20 −25 −30 −8 −35 −9 −40 −10 1 10 100 Frequency (MHz) 1000 10000 1 10 100 1000 10000 Frequency (MHz) © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/27/21 TVS Diode Array (SPA® Diodes) General Purpose ESD Protection - SP5003 Series Transmission Line Pulsing (TLP) Plot 22 20 18 TLP Current (A) 16 14 12 10 8 6 4 2 0 0 2 4 6 8 10 12 14 16 18 20 TLP Voltage (V) Soldering Parameters Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Reflow Critical Zone TL to TP Ramp-up Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max 3°C/second max TS(max) to TL - Ramp-up Rate tP TP - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C +0/-5 °C Ordering Information Temperature Reflow Condition TL T S(max) tL Ramp-dow Ramp-down Preheat T S(min) tS 25 time to peak temperature Time Part Marking System Part Number Package Size Marking SP5003-04TTG TDFN-10 2.5x2.0mm 42*** Min. Order Qty. 3000 Product Series 42 = SP5003 Part Numbering System SP 5003 42 *** – 04 T T G TVS Diode Arrays (SPA® Diodes ) Date Code (Year / Week) G= Green T= Tape & Reel Series Number of Channels 04 = 4 Channel TDFN-10 Package TDFN-10 (2.5x2.0mm) © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/27/21 General Purpose ESD Protection - SP5003 Series Package Dimensions —TDFN-10 D 0.10 TDFN-10 A B L 2X C L L1 PIN 1 MARKING Symbol Millimeters DETAIL A ALTERNATE TERMINAL CONSTRUCTIONS 2X JEDEC MO-229 E C 0.10 0.05 C TOP VIEW DETAIL B A3 C A1 A1 DETAIL A ALTERNATE CONSTRUCTIONS C 8X PA C K A G E O U T L INE 8X 1.07 5 0.30 8X L 0.10 MIN Min Max A 0.70 0.80 0.028 0.031 A1 0.00 0.05 0.000 0.002 0.2 REF 0.15 b DETAIL B SIDE VIEW 1 Max A3 A 0.05 A3 MOLD CMPD EXPOSED Cu Inches Min 0.008 REF 0.25 0.006 0.010 D 2.50 BSC 0.098 BSC E 2.00 BSC 0.079 BSC e 0.50 BSC 0.020 BSC L 0.70 0.90 0.028 0.035 L1 0.05 0.15 0.002 0.006 2.30 2 TVS Diode Array (SPA® Diodes) 1 10 e 6 0.45 9X b 0.10 M C 0.05 M C A B BOTTOM VIEW 0.50 P I T C H Recommended Soldering Footprint Tape & Reel Specification –TDFN-10 P0 T P2 Φ 1.50 +0.10 E Top Cover Tape A0 F W 5° Max K0 B0 Φ 1.00 ±0.05 P Φ 1.50 +0.10 Device Orientation in Tape Symbol Dimensions Millimetres E 1.75+/- 0.10 F 3.5 +/- 0.05 P 4.0 +/- 0.10 P0 4.0 +/- 0.10 P2 2.0 +/- 0.05 W 8.00 +0.30/- 0.10 A0 Pin1 Location 2.19 +/- 0.05 B0 2.77 +/- 0.05 K0 1.05 +/- 0.05 T 0.25+/- 0.02 Device Orientation in Tape E F Φ 1.00 ±0.05 Pin1 Location Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. © 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 08/27/21