SP6001-06UTG-1

TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6001 Series SP6001 Series 12pF 30kV EMI Filter Array Pb GREEN RoHS The Littelfuse SP6001 SPA series integrates 4, 6 and 8 EMI filters (C-R-C) into a small, low-profile μDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting ±30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers. Features t

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portable electronics 7 SP6001-06UTG-1 1 Application Examples 8 GND μDFN-16 PCB Connector for LCD Display 9 16 SP6001-04UTG-1 Baseband D1 D2 SP6001-08UTG-1 IC D3 D4 Functional Block Diagram SP6001-04UTG-1 1 SP6001-06UTG-1 8 Cd 1 Cd Cd Cd Camera Module SP6001-08UTG-1 Baseband D1 12 D2 D3 2 7 Cd Cd Cd Cd 3 6 2 Cd Cd Cd Cd 11 D4 D5 D6 10 3 IC D7 D8 4 5 Cd 9 4 Cd Cd Cd Cd Cd Cd Cd 8 5 6 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 7 169 Revision: March 20, 2012 SP6001 Series SP6001 Description TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6001 Series Thermal Information Absolute Maximum Ratings Symbol Parameter TOP Operating Temperature Storage Temperature TSTOR Parameter Value Units -40 to 85 °C Storage Temperature Range °C Maximum Junction Temperature Maximum Lead Temperature (Soldering 20-40s) -60 to 150 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Rating Units -65 to 150 °C 150 °C 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage VRWM Test Conditions Min Typ Max Units 6.0 V 7.0 (90%TYP) 7.8 8.5 (109%TYP) V 0.1 1.0 μA 100 115 (115% TYP) Ω Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK VRWM=5V Resistance RA IR=10mA Diode Capacitance1,2 CD VR=2.5V,f=1MHz Line Capacitance1,2 CL VR=2.5V,f=1MHz 19 (79.2%TYP) IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV ESD Withstand Voltage1 VESD Cutoff Frequency3 Notes: 1 2 3 85 (85%TYP) 12 Above this frequency, appreciable attenutation occurs F-3dB 24 pF 29 (120.8%TYP) 115 pF MHz Parameter is guaranteed by design and/or device characterization. Total line capacitance is two times the diode capacitance (CD). 50Ω source and 50Ω load termination Insertion Loss (S21) CH1 S 21 log MAG Analog Crosstalk (S41) 5 dB/ REF 0 dB 1 _:-5.8807 dB CH1 S Cor Cor Del Smo Smo 1 x2 Start log MAG 10 dB/ REF 0 dB 1 x2 START Stop 6 000.000.000MHz 3.000 000MHz 3.000 000 MHz Stop 6 000.000 000 MHz Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 SP6001 Series Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. 170 Revision: March 20, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6001 Series Line Capacitance vs. DC Bias Soldering Parameters 40 30 - Time (min to max) (ts) 60 – 180 secs 3°C/second max 10 TS(max) to TL - Ramp-up Rate 3°C/second max - Temperature (TL) (Liquidus) Reflow 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Package Dimensions — μDFN-08 μDFN-08 D JEDEC MO-229 Min Max Min Max 0.450 0.550 0.018 0.022 A1 0.000 0.050 0.000 0.002 0.006 0.010 D 1.600 1.800 0.063 0.071 D2 1.100 1.300 0.043 0.051 E 1.250 1.450 0.049 0.057 E2 0.300 0.500 0.012 0.020 A A1 0.250 e b 0.400 BSC K 0.200 L 0.150 0.350 0.008 0.000 0.006 0.014 0.01 0.02 A1 0.00 0.05 0.00 0.002 TS(min) tS 25 time to peak temperature 0.00 REF 0.00 3.20 3.40 0.12 0.13 D2 2.70 2.90 0.10 0.11 E 1.25 1.45 0.04 0.05 E2 0.30 0.50 0.01 0.01 0.40 BSC D2 0.01 BSC 0.00 0.35 0.00 Max A 0.450 0.550 0.018 0.022 A1 0.000 0.050 0.000 0.002 e 171 Revision: March 20, 2012 b 0.127 REF Min Max 0.005 REF b 0.150 0.250 0.006 0.010 D 2.400 2.600 0.094 0.102 D2 1.900 2.100 0.075 0.083 E 1.250 1.450 0.049 0.057 E2 0.300 0.500 0.012 0.020 e 0.01 Inches Min A3 0.00 D ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Time Millimeters A 0.25 D A3 0.127 REF 0.15 Ramp-do Ramp-down Preheat E 0.55 L tL L L b TL TS(max) Inches 0.45 0.20 Critical Zone TL to TP Ramp-up μDFN-12 A e tP JEDEC MO-229 Max K 260°C K E A1 K E2 D2 8 minutes Max. Do not exceed μDFN-16 Min 0.15 Time 25°C to peak Temperature (TP) JEDEC MO-229 Max b 6°C/second max Package Dimensions — μDFN-12 Min A3 Ramp-down Rate 0.016 BSC Millimeters A 20 – 40 seconds TP Package Dimensions — μDFN-16 D Time within 5°C of actual peak Temperature (tp) 0.005 REF 0.150 L e 0.127 REF b K E2 D2 60 – 150 seconds 260+0/-5 °C Inches A A3 217°C Peak Temperature (TP) Temperature E Millimeters - Temperature (tL) 5.0 E2 0.5 DC Bias (V) A3 200°C 20 0.0 A3 150°C - Temperature Max (Ts(max)) Average ramp up rate (Liquidus) Temp (TL) to peak 0 e - Temperature Min (Ts(min)) A1 Capacitance (pF) Pre Heat Pb – Free assembly 0.400 BSC K 0.200 L 0.150 0.350 0.016 BSC 0.008 0.000 0.006 0.014 SP6001 Series SP6001 Reflow Condition 50 TVS Diode Arrays (SPA™ Family of Products) ESD and EMI Filter Devices - SP6001 Series Embossed Carrier Tape & Reel Specification – μDFN-12 P2 P2 o/ D t E E t AO P F oD / Millimetres E Max Min Max 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 1.00 - 0.040 - 1.50 min P 3.90 10P P Inches Min D K0 BO D1 KO F W W A0 BO D Embossed Carrier Tape & Reel Specification – μDFN-08 Millimetres 0.059 min 4.10 40.0 +/- 0.20 Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.45 3.55 0.136 0.140 D1 0.55 0.65 0.021 0.025 0.161 D 1.575 +/- 0.008 P 0.154 1.50 min 3.90 10P 40.0 +/- 0.20 0.161 1.575 +/- 0.008 7.70 8.30 0.303 0.327 1.95 2.05 0.077 0.081 W 7.90 8.30 0.311 0.327 0.069 P2 1.95 2.05 0.077 0.081 1.33 1.53 0.052 0.060 1.55 1.75 0.061 B0 1.90 2.1 0.075 0.083 A0 K0 0.95 1.15 0.037 0.045 B0 2.63 2.83 0.103 0.111 K0 0.58 0.78 0.023 0.031 0.30 max 0.012 max t Embossed Carrier Tape & Reel Specification – μDFN-16 + + + + + E μDFN-08 (1.7x1.35mm) μDFN-12 (2.5x1.35mm) μDFN-16 (3.3x1.35mm) 04 = 4 Channel μDFN-08 06 = 6 Channel μDFN-12 08 = 8 Channel μDFN-16 + Ø 1.00 ± 0.05 T G= Green T= Tape & Reel Package Silicon Protection Array (SPATM) Family of TVS Diode Arrays Series Number of Channels F + 0.009 max SP 6001 ** U T G -1 P1 + 0.22 max Part Numbering System D0 P0 P2 + 0.154 W t W 0.059 min 4.10 P2 A0 + Inches Part Marking System 12º MAX 12º MAX A0 J * * B0 K0 Millimetres Min SP6001 Series Inches Max Min Max A0 1.55 1.75 0.06 0.06 B0 3.50 3.70 0.13 0.14 D0 1.40 1.60 0.05 0.06 E 1.65 1.85 0.06 0.07 F 5.45 5.55 0.21 0.21 K0 0.85 1.05 0.03 0.04 P0 3.90 4.10 0.15 0.16 P1 1.95 2.05 0.07 0.08 P2 3.90 4.10 0.15 0.16 T 0.26 0.30 0.01 0.01 W 11.90 12.30 0.46 0.48 Product Series J = SP6001 Assembly Site 4 = μDFN-08 6 = μDFN-12 8 = μDFN-16 Ordering Information Part Number Package Size (mm) Marking Min. Order Qty. SP6001-04UTG-1 μDFN-08 1.7x1.35 J*4 3000 SP6001-06UTG-1 μDFN-12 2.5x1.35 J*6 3000 SP6001-08UTG-1 μDFN-16 3.3x1.35 J*8 3000 172 Revision: March 20, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.