SP712-02HTG

TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP712 SP712 Series 640W Asymmetrical TVS Diode Array RoHS Pb GREEN Description The SP712 TVS Diode Array is designed to protect RS-485 applications with asymmetrical working voltages (-7V to 12V) from damage due to electrostatic discharge (ESD), electrical fast transients (EFT), and lightning induced surges. The SP712 can absorb repetitive ESD strikes above the maximum level specified in IEC 61000-4-2 international standard without performance degradation and safely dissipate up to 20A of 8/20us induced surge current (IEC 61000-4-5) with very low clamping voltages. Pinout and Functional Block Diagram 2 Features 1 12V 12V 7V 7V • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air • Low clamping voltage • EFT, IEC 61000-4-4, 50A (5/50ns) • Halogen free, Lead free and RoHS compliant • Lightning, IEC 610004-5 2nd edition, 20A (tP=8/20μs) • Moisture Sensitivity Level(MSL -1) • Working Voltages: -7V to 12V • Low leakage current • AEC-Q101 qualified Applications 3 • RS-485 • Security Systems • Fieldbus • Modbus • Automated Teller Machines (ATMs) • Profibus • Lighting Control - DALI • DMX512 • Communication Equipments RS-485 Application Example RS-485 Port Receiver A B IC SM712 SP712 GND Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/13/20 TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP712 Absolute Maximum Ratings Value Units PPk Symbol Peak Pulse Power (tp=8/20μs) Parameter 640 W IPP Peak Pulse Current (tp=8/20μs) 20 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25ºC) Parameter Symbol Reverse Standoff Voltage Test Conditions VRWM Breakdown Voltage VC Dynamic Resistance 12.0 V 9 V IR=1mA, Pin 1 or Pin 2 to Pin 3 13.3 14.5 V VR=7V 20 μA VR=12V 1 μA 17 19 V IPP=1A, tp=8/20µs, Pin 3 to Pin 1 or Pin 2 10 11 V IPP=20A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 28 32 V IPP=20A, tp=8/20µs, Pin 3 to Pin 1 or Pin 2 17 20 V TLP, tP=100ns 0.26 Ω IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz; Pin 1 or Pin 2 to Pin 3 CI/O-GND Diode Capacitance1 V IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 VESD ESD Withstand Voltage1 Units 7.0 7.5 RDYN 2 Max IR=1mA, Pin 3 to Pin 1 or Pin 2 ILEAK Clamp Voltage1 Typ IR=1μA, Pin 1 or Pin 2 to Pin 3 VBR Reverse Leakage Current Min IR=1μA, Pin 3 to Pin 1 or Pin 2 75 pF Notes : 1. Parameter is guaranteed by design and/or component characterization. 2 Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: start t1=70ns to end t2=90ns Clamping Voltage vs. IPP 80 35.0 70 30.0 Clamp Voltage-VC (V) Capacitance (pF) Capacitance vs. Reverse Bias 60 50 40 30 20 15.0 Pin3 to Pin1 or Pin2 10.0 0.0 0 2 4 6 Bias Voltage (V) ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/13/20 20.0 5.0 10 0 Pin 1 or Pin 2 to Pin 3 25.0 8 10 12 0.0 5.0 10.0 15.0 Peak Pulse Current-IPP (A) 20.0 TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP712 Positive Transmission Line Pulsing (TLP) Plot Negative Transmission Line Pulsing (TLP) Plot 0 25 -5 TLP Current (A) TLP Current (A) 20 15 10 0 0 5 10 15 TLP Voltage (V) 20 25 IEC 61000-4-2 +8kV Contact ESD Clamping Voltage 8/20μs Pulse Waveform 110% 100% 90% 80% Percent of IPP -15 -20 5 70% 60% 50% 40% 30% 20% 10% 0% -10 0.0 5.0 10.0 15.0 Time (μs) ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/13/20 20.0 25.0 30.0 -25 -20 -15 -10 TLP Voltage (V) -5 IEC 61000-4-2 -8kV Contact ESD Clamping Voltage 0 TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP712 Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds 260 Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 Peak Temperature (TP) +0/-5 tP TP Temperature Reflow Condition tS time to peak temperature Time °C Part Marking System Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0 AEFD AE : Part code F : Assembly code D : Date code Ordering Information Part Numbering System Part Number Package SP712-02HTG SOT23-3L Min. Order Qty. 3000 SP 712 – 02 H T G TVS Diode Arrays (SPA® Diodes) Series Working Voltage Number of Channels ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/13/20 G= Green T= Tape & Reel Package H: SOT23-3L TVS Diode Arrays (SPA®® Diodes) General Purpose ESD Protection - SP712 Package Dimensions — SOT23-3 Package Pins JEDEC L1 (Guage Plan) Pin1 E E1 D A A1 b c D E E1 e e1 L L1 θ bx3 e θ e1 L Top View Detail A Side View Side View c A1 A Detail A SOT23-3 3 TO-236 Millimeters Min Max 0.90 1.15 0.00 0.10 0.30 0.51 0.08 0.20 2.80 3.04 2.10 2.64 1.20 1.40 0.95 BSC 1.90 BSC 0.30 0.55 0.25 BSC 0° 8° Inches Min Max 0.035 0.045 0.000 0.004 0.012 0.020 0.003 0.008 0.110 0.120 0.083 0.104 0.047 0.055 0.038 BSC 0.075 BSC 0.012 0.022 0.010 BSC 0° 8° Millimeters Inches 2.90 0.80 1.30 0.60 1.30 2.50 Recommended soldering pad layout (unit :mm) Drawing# : H03-B Embossed Carrier Tape & Reel Specification — SOT23-3 Symbol 8mm TAPE AND REEL GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. ACCESS HOLE 14.4mm SOT23-3 (8mm POCKET PITCH) 13mm 180mm 60mm USER DIRECTION OF FEED Min Max Min Max E 1.65 1.85 0.065 0.073 F 3.40 3.60 0.134 0.142 P2 1.90 2.10 0.075 0.083 D 1.40 1.60 0.055 0.063 P0 3.90 4.10 0.154 0.161 W 7.70 8.30 0.303 0.327 P 3.90 4.10 0.154 0.161 A0 3.05 3.25 0.120 0.128 B0 2.67 2.87 0.105 0.113 K0 1.12 1.32 0.044 0.052 t 0.22 0.24 0.009 0.009 PIN 1 8.4mm Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. ©2020 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/13/20 COVER TAPE