SP725AATG

TVS Diode Arrays (SPA® Devices) General Purpose ESD Protection - SP725 Series SP725 Series 5pF 8kV Diode Array RoHS Pb GREEN The SP725 is an array of SCR/Diode bipolar structures for ESD and overvoltage protection of sensitive input circuits. The SP725 has 2 protection SCR/Diode device structures per input. There are a total of 4 available inputs that can be used to protect up to 4 external signal or bus lines. Overvoltage protection is from the IN (Pins 1 - 4) to V+ or V-. The SCR structures are designed for fast triggering at a threshold of one +VBE diode threshold above V+ (Pin 5,6) or one –VBE diode threshold below V- (Pin 7,8). From an IN input, a clamp to V+ is activated if a transient pulse causes the input to be increased to a voltage level greater than one VBE above V+. A similar clamp to V- is activated if a negative pulse, one VBE less than V-, is applied to an IN input. Pinout SP725AB(T)G (SOIC) In 1 8 V- In 2 7 V- In 3 6 V+ In Refer to Fig 1 and Table 1 for further details. Refer to Application Note AN9304 and AN9612 for further detail. SP725AATG (MSOP-10L) 4 5 In 1 10 V- In 2 9 V- In 3 4 8 V+ In 7 V+ - IEC 61000-4-2, Direct Discharge........... 8kV (Level 4) NC 5 6 NC - IEC 61000-4-2, Air Discharge................15kV (Level 4) - MIL-STD-3015.7..................................................25kV V+ Features • ESD Interface per HBM Standards • Peak Current Capability - IEC 61000-4-5 8/20 µs Peak Pulse Current........ ± 9 A - Single Transient Pulse, 100 µs Pulse Width....... ± 4 A • Designed to Provide Over-Voltage Protection Functional Block Diagram V+ - Single-Ended Voltage Range to......................... +30V - Differential Voltage Range to............................. ±15V • Fast Switching...............................................2ns Risetime 5, 6 • Low Input Leakages...........................5 nA at 25 ºC Typical • Low Input Capacitance.....................................5 pF Typical • An Array of 4 SCR/Diode Pairs IN 1 IN 2 IN • Operating Temperature Range..................-40 ºC to 105 ºC 3, 4 Applications V7, 8 • Microprocessor/Logic Input Protection • Analog Device Input Protection • Data Bus Protection • Voltage Clamp Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 1 Revision: November 28, 2012 SP725 Lead-Free/Green Series Lead-Free/Green SP725 Description TVS Diode Arrays (SPA® Devices) General Purpose ESD Protection - SP725 Series Thermal Information Absolute Maximum Ratings Parameter Continuous Supply Voltage, (V+) - (V-) Forward Peak Current, IIN to VCC , IIN to GND (Refer to Figure 5) Peak Pulse Current, 8/20µs ESD Ratings and Capability (Figure 1, Table 1) Load Dump and Reverse Battery (Note 2) Rating +35 Units V ± 4, 100 µs A ±9 A Parameter Thermal Resistance (Typical, Note 1) Rating θJA SOIC Package Units o C/W 170 Storage Temperature Range Maximum Junction Temperature Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) C/W o C -65 to 150 o 150 o 260 o C C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics TA = -40oC to 105oC, VIN = 0.5VCC , Unless Otherwise Specified Parameter Symbol Min Typ Max Units - 2 to 30 - V - 2 - V - 2 - V IIN -20 5 +20 nA IQUIESCENT - 50 200 nA Operating Voltage Range, VSUPPLY = [(V+) - (V-)] VSUPPLY Forward Voltage Drop IN to V- VFWDL IN to V+ VFWDH Input Leakage Current Quiescent Supply Current Test Conditions IIN = 2A (Peak Pulse) Equivalent SCR ON Threshold Equivalent SCR ON Resistance Input Capacitance CIN Input Switching Speed tON (Note 3) - 1.1 - V VFWD/IFWD ; (Note 3) - 0.5 - Ω 5 - pF 2 - ns - Notes: 1. θ JA is measured with the component mounted on an evaluation PC board in free air 2. In automotive and battery operated systems, the power supply lines should be externally protected for load dump and reverse battery V+ and V- pins are connected to the same supply voltage source as the device or control line under protection, a current limiting resistor should be connected in series between the external supply and the SP725 supply pins to limit reverse battery current to within the rated maximum limits. Bypass capacitors of typically 0.01µF or larger from the V+ and V- pins to ground are recommended. 3. Refer to the Figure 3 graph for definitions of equivalent “SCR ON Threshold” and “SCR ON Resistance.” These characteristics are given here for thumb-rule information to determine peak current and dissipation under EOS conditions. Typical Application of the SP725 (Application as an Input Clamp for Overvoltage, Greater than 1VBE Above V+ or less than -1VBE below V-) +VCC +VCC INPUT DRIVERS OR SIGNAL SOURCES LINEAR OR DIGITAL IC INTERFACE IN 1 - 4 TO +VCC V+ SP725 V- SP725 INPUT PROTECTION CIRCUIT (1 OF 4 SHOWN) SP725 Lead-Free/Green Series 2 Revision: November 28, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA® Devices) General Purpose ESD Protection - SP725 Series ESD Capability ESD capability is dependent on the application and defined test standard.The evaluation results for various test standards and methods based on Figure 1 are shown in Table 1. R1 The SP725 has a Level 4 HBM capability when tested as a device to the IEC 61000-4-2 standard. Level 4 specifies a required capability greater than 8kV for direct discharge and greater than 15kV for air discharge. CHARGE SWITCH IN DUT Table 1: ESD Test Conditions Standard IEC 61000-4-2 (Level 4) MIL-STD-3015.7 EIAJ IC121 Figure 2: Low Current SCR Forward Voltage Drop Curve Type/Mode RD CD ±VD HBM, Air Discharge 330 Ω 150pF 15kV HBM, Direct Discharge 330 Ω 150pF 8kV Modified HBM 1.5k Ω 100pF 25kV Standard HBM 1.5k Ω 100pF 10kV 0k Ω 200pF 2kV Machine Model Figure 3: High Current SCR Forward Voltage Drop Curve 5 TA = 25ºC SINGLE PULSE 160 FORWARD SCR CURRENT (A) FORWARD SCR CURRENT (mA) CD IEC 61000-4-2: R 1 50 to 100MΩ MIL-STD-3015.7: R 1 1 to 10MΩ For the SP725 EIAJ IC121 Machine Model (MM) standard, the ESD capability is typically greater than 2kV from 200pF with no series resistance. 120 80 40 0 600 DISCHARGE SWITCH H.V. SUPPLY ± VD For the “Modified” MIL-STD-3015.7 condition that is defined as an “incircuit” method of ESD testing, the V+ and V- pins have a return path to ground and the SP725 ESD capability is typically greater than 25kV from 100pF through 1.5kΩ . By strict definition of MIL-STD-3015.7 using “pinto-pin” device testing, the ESD voltage capability is greater than 10kV. 200 RD TA = 25°C SINGLE PULSE 4 3 2 I FWD EQUIV. SAT. ON THRESHOLD ~ 1.1V 1 V FWD 0 800 1000 1200 0 FORWARD SCRVOLTAGE DROP (mV) ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 1 2 3 FORWARD SCRVOLTAGE DROP (V) 3 Revision: November 28, 2012 SP725 Lead-Free/Green Series Lead-Free/Green SP725 Figure 1: Electrostatic Discharge Test TVS Diode Arrays (SPA® Devices) General Purpose ESD Protection - SP725 Series Peak Transient Current Capability for Long Duration Surges The peak transient current capability rises sharply as the width of the current pulse narrows. Destructive testing was done to fully evaluate the SP725 ’s ability to withstand a wide range of peak current pulses vs time. The circuit used to generate current pulses is shown in Figure 4. Figure 4: T  ypical SP725 Peak Current Test Circuit with a Variable Pulse Width Input The test circuit of Figure 4 is shown with a positive pulse input. For a negative pulse input, the (-) current pulse input goes to an SP725 ‘IN’ input pin and the (+) current pulse input goes to the SP725 V- pin. The V+ to V- supply of the SP725 must be allowed to float. (i.e., It is not tied to the ground reference of the current pulse generator.) Figure 5 shows the point of overstress as defined by increased leakage in excess of the data sheet published limits. - VARIABLE TIME DURATION CURRENT PULSE GENERATOR R1 + VX CURRENT SENSE (-) (+) V- 8 1 IN V- 7 2 IN 3 IN SP725 4 IN VOLTAGE PROBE + V+ 6 - V+ 5 C1 R 1 ~ 10Ω TYPICAL VX ADJ. 10V/A TYPICAL The maximum peak input current capability is dependent on the ambient temperature, improving as the temperature is reduced. Peak current curves are shown for ambient temperatures of 25 º C and 105 º C and a 15V power supply condition. The safe operating range of the transient peak current should be limited to no more than 75% of the measured overstress level for any given pulse width as shown in the curves of Figure 5. C1 ~ 100μF Figure 5: S  P725 Typical Nonrepetitive Peak Current Pulse Capability Showing the Measured Point of Overstress in Amperes vs pulse width time in milliseconds 14 Note that adjacent input pins of the SP725 may be paralleled to improve current (and ESD) capability. The sustained peak current capability is increased to nearly twice that of a single pin. PEAK CURRENT (A) 12 TA = 25ºC 10 V+ TO V-SUPPLY = 15V 8 6 CAUTION: SAFE OPERATING CONDITIONS LIMIT THE MAXIMUM PEAK CURRENT FOR A GIVEN PULSE WIDTH TO BE NO GREATER THAN 75% OF THE VALUES SHOWN ON EACH CURVE TA = 105ºC 4 2 0 0.0001 0.01 0.1 1 10 100 1000 PULSE WIDTH TIME (ms) SP725 Lead-Free/Green Series 4 Revision: November 28, 2012 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA® Devices) General Purpose ESD Protection - SP725 Series Soldering Parameters 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 5°C/second max TS(max) to TL - Ramp-up Rate 5°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Temperature Pre Heat - Temperature Min (Ts(min)) tP TP TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Product Characteristics Critical Zone TL to TP Ramp-up time to peak temperature Time Part Numbering System Lead Plating Matte Tin / Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 SP 725 ** * TVS Diode Arrays (SPA® Devices) G=Green TG=Tape and Reel Package Type AA: MSOP-10L AB: 8 Leaded SOIC Series Notes: 1. All dimensions are in millimeters. 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4.Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Ordering Information Part Number Temp. Range (ºC) Package Marking Min. Order Qty. SP725AATG -40 to 105 MSOP-10L LF725A 4000 SP725ABG -40 to 105 8 Ld SOIC SP725AB(T)G 1 1960 SP725ABTG -40 to 105 8 Ld SOIC Tape and Reel SP725AB(T)G 2500 1 Notes: 1. SP725AB(T)G means device marking either SP725ABG or SP725ABTG. ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 5 Revision: November 28, 2012 SP725 Lead-Free/Green Series Lead-Free/Green SP725 Pb – Free assembly Reflow Condition TVS Diode Arrays (SPA® Devices) General Purpose ESD Protection - SP725 Series Package Dimensions — Small Outline Plastic Packages (SOIC) N INDEX AREA 0.25(0.010) M H B M Package SOIC Pins 8 JEDEC E 1 2 3 h x 45o A D -C- µ e B A1 C 0.10(0.004) Min Max 1.35 1.75 0.0532 0.0688 A1 0.10 0.25 0.0040 0.0098 - B 0.33 0.51 0.013 0.020 9 C 0.19 0.25 0.0075 0.0098 - D 4.80 5.00 0.1890 0.1968 3 E 3.80 4.00 0.1497 0.1574 4 1.27 BSC 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. - 0.2284 0.2440 h 0.25 0.50 0.0099 0.0196 5 L 0.40 1.27 0.016 0.050 6 8o 0o µ 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 0.050 BSC 6.20 8 N 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. - 5.80 H Notes: Notes Max e 0.25(0.010) M C A M B S Inches Min A L SEATING PLANE -A- MS-012 Millimeters -B- 0o - 8 7 8o - 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. Embossed Carrier Tape & Reel Specification - SOIC Package Symbol User Feeding Direction Pin 1 Location Millimetres Max Min Max E 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1.95 2.05 0.077 0.081 D 1.5 1.6 0.059 0.063 4.1 0.154 1.50 Min D1 P0 10P0 3.9 0.059 Min 40.0 +/- 0.20 0.161 1.574 +/- 0.008 W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 t SP725 Lead-Free/Green Series Inches Min 6 Revision: November 28, 2012 0.30 +/- 0.05 0.012 +/- 0.002 ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. TVS Diode Arrays (SPA® Devices) General Purpose ESD Protection - SP725 Series Package Dimensions — MSOP-10L Package MSOP-10L JEDEC MO-187 10 Millimeters Min Max Inches Min Max A - 1.10 - 0.043 A1 0.00 0.15 0.000 0.006 B 0.17 0.27 0.007 0.011 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.67 5.10 0.184 0.200 E1 2.90 3.10 0.114 0.122 Recommended Solder Pad Recommanded Solder Pad Layout Layout 0.50 BSC e HE 0.40 0.80 0.020 BSC 0.016 0.031 Embossed Carrier Tape & Reel Specification — MSOP-10L Millimetres Max Min Max E 1.65 1.85 0.065 0.073 F 5.40 5.60 0.213 0.220 D 1.50 1.60 0.059 0.063 1.50 Min D1 P0 10P0 Pin 1 Location Inches Min 3.90 0.059 Min 4.10 40.0+/- 0.20 0.154 0.161 1.574+/-0.008 W 11.90 12.10 0.469 0.476 P 7.90 8.10 0.311 0.319 A0 5.20 5.40 0.205 0.213 B0 3.20 3.40 0.126 0.134 K0 1.20 1.40 0.047 0.055 t 0.30 +/- 0.05 0.012+/- 0.002 User Feeding Direction ©2012 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com for current information. 7 Revision: November 28, 2012 SP725 Lead-Free/Green Series Lead-Free/Green SP725 Pins