SPHV12-01ETG

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SPHV Series SPHV Series 200W Discrete Unidirectional TVS Diode RoHS Pb GREEN Description The unidirectional SPHV series is designed for use in portable applications, LED lighting modules, automotive applications, and low speed I/Os. It will protect sensitive equipment from damage due to electrostatic discharge (ESD) and other overvoltage transients. The SPHV series can safely absorb repetitive ESD strikes above the maximum level of the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation and safely dissipate up to 8A (SPHV12) of induced surge current (IEC 61000-4-5, 2nd Edition tP=8/20μs) with very low clamping voltages. Features Pinout • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air • EFT, IEC 61000-4-4, 40A 1 (5/50ns) • Lightning, IEC 610004-5, 2nd Edition 8A (tP=8/20μs, SPHV12) • Lead-free, Halogen-free, and RoHS Compliant • Low leakage current Applications Functional Block Diagram 1 Life Support Note: • Side exposed leadframe helps to verify solderability (SPHVxx-KTG series) • AEC-Q101 qualified • Low clamping voltage 2 • Small SOD882 packaging helps save board space • LED Lighting Modules • Mobile & Handhelds • Portable Instrumentation • RS232 / RS485 • General Purpose I/O • CAN and LIN Bus 2 Not Intended for Use in Life Support or Life Saving Applications Additional Information The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. Datasheet Resources Samples © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/28/16 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SPHV Series Absolute Maximum Ratings Symbol Parameter Value Units 200 W Operating Temperature -40 to 125 °C Storage Temperature -55 to 150 °C Ppk Peak Pulse Power (tp=8/20μs) TOP TSTOR Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Storage Temperature Range Rating Units -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 20-40s) 260 °C SPHV12 Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions VRWM IR≤1μA Reverse Breakdown Voltage VBR IR=1mA Leakage Current ILEAK Reverse Standoff Voltage Clamp Voltage1 VC Dynamic Resistance 2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1 Max Units 12.0 V VR=12V 1.0 μA IPP=1A, tp=8/20µs, Fwd 19.0 V IPP=8A, tP=8/20μs, Fwd 25.0 V RDYN TLP, tp=100ns, I/O to GND Ipp tp=8/20µs VESD CD-GND Min Typ 13.3 V 0.37 Ω 8.0 IEC61000-4-2 (Contact Discharge) ±30 IEC61000-4-2 (Air Discharge) ±30 A kV kV Reverse Bias=0V, f=1MHz 60 pF Note: 1 2 Parameter is guaranteed by design and/or device characterization. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. SPHV15 Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions VRWM IR≤1μA Reverse Breakdown Voltage VBR IR=1mA Leakage Current ILEAK Reverse Standoff Voltage VC Clamp Voltage1 Dynamic Resistance2 ESD Withstand Voltage1 Diode Capacitance 1 Max Units 15.0 V VR=15V 1.0 μA IPP=1A, tp=8/20µs, Fwd 22.0 V TLP, tp=100ns, I/O to GND Ipp tp=8/20µs VESD CI/O-GND 2 V 28.0 0.40 V Ω 5.0 A ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Reverse Bias=0V, f=1MHz Parameter is guaranteed by design and/or device characterization. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/28/16 16.7 IEC61000-4-2 (Contact Discharge) Note: 1 Typ IPP=5A, tp=8/20µs, Fwd RDYN Peak Pulse Current Min 46 pF TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SPHV Series SPHV24 Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions VRWM IR≤1μA Reverse Breakdown Voltage VBR IR=1mA Leakage Current ILEAK VR=24V Reverse Standoff Voltage VC Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance Max Units 24.0 V 1.0 μA V IPP=1A, tp=8/20µs, Fwd 36.0 V IPP=3A, tp=8/20µs, Fwd 50.0 V TLP, tp=100ns, I/O to GND Ipp tp=8/20µs VESD Typ 26.7 RDYN 0.56 Ω 3.0 A IEC61000-4-2 (Contact Discharge) ±24 kV IEC61000-4-2 (Air Discharge) ±30 kV CI/O-GND 1 Min Reverse Bias=0V, f=1MHz 32 pF Max Units 36.0 V Note: 1 2 Parameter is guaranteed by design and/or device characterization. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. SPHV36 Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions VRWM IR≤1μA Reverse Breakdown Voltage VBR IR=1mA Leakage Current ILEAK Reverse Standoff Voltage VC Clamp Voltage1 Dynamic Resistance 2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1 Min 40.0 V VR=36V 1.0 μA IPP=1A, tp=8/20µs, Fwd 52.0 V IPP=2A, tp=8/20µs, Fwd 60.0 V RDYN TLP, tp=100ns, I/O to GND Ipp tp=8/20µs VESD Typ 1.28 Ω 2.0 A IEC61000-4-2 (Contact Discharge) ±15 kV IEC61000-4-2 (Air Discharge) ±20 kV CI/O-GND Reverse Bias=0V, f=1MHz 25 pF Note: Parameter is guaranteed by design and/or device characterization. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time. Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve 110 10 100 90 % of Rated Power I PP 2 Peak Pulse Power - Ppk (kW) 1 1 0.1 80 70 60 50 40 30 20 10 0 0.01 0.1 1 10 100 Pulse Duration - t p (µs) 1000 0 25 50 75 100 125 150 (o Ambient Temperature - T A C) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/28/16 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SPHV Series 8/20µs Pulse Waveform SPHV12 Transmission Line Pulsing(TLP) Plot 110% 20 100% 18 90% 16 14 70% TLP Current (A) Percent of IPP 80% 60% 50% 40% 12 10 8 30% 6 20% 4 10% 2 0% 0.0 5.0 10.0 15.0 20.0 25.0 0 30.0 0 5 10 Time (μs) 20 20 18 18 16 16 14 14 12 10 8 8 6 4 2 2 0 10 15 20 25 30 SPHV36 Transmission Line Pulsing(TLP) Plot 16 14 12 10 8 6 4 2 0 0 10 20 30 40 50 60 TLP Voltage (V) © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/28/16 0 5 10 15 20 25 30 TLP Voltage (V) TLP Voltage (V) TLP Current (A) 10 4 5 25 12 6 0 20 SPHV24 Transmission Line Pulsing(TLP) Plot TLP Current (A) TLP Current (A) SPHV15 Transmission Line Pulsing(TLP) Plot 0 15 TLP Voltage (V) 70 80 90 100 35 40 45 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SPHV Series Soldering Parameters Pre Heat Pb – Free assembly - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Product Characteristics tP TP Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) tS 25 time to peak temperature Time Ordering Information Part Number Lead Plating Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substrate material Silicon Body Material Molded Epoxy SPHV24-01ETG Flammability UL 94 V-0 SPHV36-01ETG Package Marking SPHV12-01ETG Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. SPHV15-01ETG SPHV12-01KTG Part Marking System U2 U5 SOD882 10000 U4 U6 SPHV15-01KTG SOD882 with side SPHV24-01KTG exposed leadframe SPHV36-01KTG Min. Order Qty. U2 U5 10000 U4 U6 Part Numbering System SPHV** – 01 x T G 1 U* 2 2: SPHV12 5: SPHV15 4: SPHV24 6: SPHV36 G= Green TVS Diode Arrays (SPA® Diodes ) Voltage Number of Channels T= Tape & Reel Package E: SOD882 K: SOD882 with side exposed leadframe © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/28/16 TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SPHV Series Package Dimensions — SOD882(SPHVxx-01ETG) Cathode by marking Symbol 0.325 0.325 0.650 0.650 Package SOD882 JEDEC MO-236 Millimeters Min Typ Max Min Typ Max A 0.90 1.00 1.10 0.037 0.039 0.041 B 0.50 0.60 0.70 0.022 0.024 0.026 C 0.40 0.50 0.60 0.016 0.020 0.024 0.45 D 0.975 Recommended Soldering Pad Layout Inches 0.018 E 0.20 0.25 0.35 0.008 0.010 0.012 F 0.45 0.50 0.55 0.018 0.020 0.022 *Some ETG packaging will look like KTG packaging due to the differing package construction between various suppliers. Package Dimensions — SOD882 with side exposed leadframe(SPHVxx-01KTG) Cathode by marking A 0.14 Symbol Package SOD882 with side exposed leadframe JEDEC MO-236 Millimeters B Typ Max Min Typ Max A 0.90 1.00 1.10 0.037 0.039 0.043 B 0.50 0.60 0.70 0.020 0.024 0.028 C 0.90 1.00 1.10 0.037 0.039 0.043 D 0.55 0.65 0.75 0.022 0.026 0.030 0.075 0.28 Top View Side Exposed Leadframe C D 1.40 0.975 0.30 0.325 a E F 0.650 0.60 G b 0.325 0.55 Bottom View Recommended Soldering Pad Layout d H c I Side View Inches Min E 0.40 0.50 0.60 0.016 0.020 0.024 F 0.50 0.60 0.70 0.020 0.024 0.028 G 0.20 0.25 0.30 0.008 0.010 0.012 H 0.40 0.50 0.60 0.016 0.020 0.024 0.05 max I 0.002 max a - 0.14 - - 0.006 b - 0.04 - - 0.002 - c - 0.075 - - 0.003 - d - 0.10 - - 0.004 - Embossed Carrier Tape & Reel Specification Top mark and pin 1 direction in Tape and Reel Feeding Direction 1 UX 2 © 2016 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/28/16 Symbol Millimeters A 0.70+/-0.045 B 1.10+/-0.045 C 0.65+/-0.045 d 1.55+/-0.10 E 1.75+/-0.05 F 3.50+/-0.05 P 2.00+/-0.10 P0 4.00+/-0.10 P1 2.00+/-0.10 W 8.00 + 0.30 -0.10 -