TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV-C Series
SPHV-C Series 200W Discrete Bidirectional TVS Diode
RoHS Pb GREEN
Description
The Bidirectional SPHV-C series is designed for use in
portable applications, LED lighting modules, automotive
applications, and low speed I/Os. It will protect sensitive
equipment from damage due to electrostatic discharge
(ESD) and other overvoltage transients.
The SPHV-C series can safely absorb repetitive ESD
strikes above the maximum level of the IEC 610004-2 international standard (Level 4, ±8kV contact
discharge) without performance degradation and safely
dissipate up to 8A (SPHV12-C) of induced surge current
(IEC 61000-4-5, 2nd Edition tP=8/20μs) with very low
clamping voltages.
Pinout
Features
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
1
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Lightning, IEC 610004-5 2nd edition, 8A
(tP=8/20μs, SPHV12-C)
2
• Lead-free and RoHS
compliant
• AEC-Q101
qualified(SOD882 ETG
series)
• Side exposed leadframe
helps to verify
solderability (SPHVxxKTG-C series)
• Low clamping voltage
• Low leakage current
• Small SOD882 packaging
helps save board space
Applications
Functional Block Diagram
1
2
Life Support Note:
• LED Lighting Modules
• Mobile & Handhelds
• Portable Instrumentation
• RS232 / RS485
• General Purpose I/O
• CAN and LIN Bus
Additional Information
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Datasheet
Resources
Samples
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV-C Series
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
Ppk
Peak Pulse Power (tp=8/20μs)
200
W
TOP
Operating Temperature
-40 to 125
°C
TSTOR
Storage Temperature
-55 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other
conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information
Parameter
Storage Temperature Range
Rating
Units
-55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 20-40s)
260
°C
SPHV12-C Electrical Characteristics (TOP=25ºC)
Parameter
Reverse Standoff Voltage
Symbol
Test Conditions
VRWM
IR≤1μA
Reverse Breakdown Voltage
VBR
IR=1mA
Leakage Current
ILEAK
Clamp Voltage1
VC
Dynamic Resistance2
Peak Pulse Current
RDYN
Diode Capacitance1
VESD
CD-GND
Typ
Max
12.0
13.3
Units
V
V
VR=12V
1.0
μA
IPP=1A, tp=8/20µs, Fwd
19.0
V
IPP=8A, tP=8/20μs, Fwd
25.0
TLP, tp=100ns, I/O to GND
Ipp
ESD Withstand Voltage1
Min
0.48
tp=8/20µs
8.0
IEC61000-4-2 (Contact Discharge)
±30
IEC61000-4-2 (Air Discharge)
±30
V
Ω
A
kV
kV
Reverse Bias=0V, f=1MHz
30
pF
Note:
1. Parameter is guaranteed by design and/or device characterization.
2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
SPHV15-C Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
VRWM
IR≤1μA
Reverse Breakdown Voltage
VBR
IR=1mA
Leakage Current
ILEAK
Reverse Standoff Voltage
Clamp Voltage1
VC
Dynamic Resistance
2
Peak Pulse Current
ESD Withstand Voltage1
Diode Capacitance
1
Max
Units
15.0
V
VR=15V
1.0
μA
IPP=1A, tp=8/20µs, Fwd
22.0
V
IPP=5A, tp=8/20µs, Fwd
30.0
V
RDYN
TLP, tp=100ns, I/O to GND
Ipp
tp=8/20µs
VESD
CI/O-GND
Min
Typ
16.7
V
0.43
Ω
5.0
A
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
Reverse Bias=0V, f=1MHz
24
pF
Note:
1. Parameter is guaranteed by design and/or device characterization.
2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV-C Series
SPHV24-C Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
Test Conditions
VRWM
IR≤1μA
Reverse Breakdown Voltage
VBR
IR=1mA
Leakage Current
ILEAK
Clamp Voltage1
VC
Dynamic Resistance2
VESD
Diode Capacitance1
Max
24.0
V
26.7
V
VR=24V
1.0
μA
36.0
V
50.0
TLP, tp=100ns, I/O to GND
V
0.65
Ω
tp=8/20µs
3.0
IEC61000-4-2 (Contact Discharge)
±24
IEC61000-4-2 (Air Discharge)
±30
CI/O-GND
Units
IPP=1A, tp=8/20µs, Fwd
Ipp
ESD Withstand Voltage1
Typ
IPP=3A, tp=8/20µs, Fwd
RDYN
Peak Pulse Current
Min
A
kV
kV
Reverse Bias=0V, f=1MHz
17
pF
Max
Units
Note:
1. Parameter is guaranteed by design and/or device characterization.
2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
SPHV36-C Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
Test Conditions
VRWM
IR≤1μA
Reverse Breakdown Voltage
VBR
IR=1mA
Leakage Current
ILEAK
Clamp Voltage1
VC
Dynamic Resistance2
RDYN
Peak Pulse Current
VESD
Diode Capacitance1
Typ
36.0
V
VR=36V
1.0
μA
52.0
V
IPP=2A, tp=8/20µs, Fwd
65.0
TLP, tp=100ns, I/O to GND
V
1.33
Ω
tp=8/20µs
2.0
IEC61000-4-2 (Contact Discharge)
±15
IEC61000-4-2 (Air Discharge)
±20
CI/O-GND
V
40.0
IPP=1A, tp=8/20µs, Fwd
Ipp
ESD Withstand Voltage1
Min
A
kV
kV
Reverse Bias=0V, f=1MHz
13
pF
Note:
1. Parameter is guaranteed by design and/or device characterization.
2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
100
90
% of Rated Power I PP
Peak Pulse Power - Ppk (kW)
10
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
Pulse Duration - t p (µs)
1000
0
25
50
75
100
125
150
Ambient Temperature - T A (oC)
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV-C Series
8/20µs Pulse Waveform
SPHV12-C Transmission Line Pulsing(TLP) Plot
20
100%
18
90%
16
80%
14
TLP Current (A)
Percent of IPP
110%
70%
60%
50%
12
10
8
40%
6
30%
4
20%
2
10%
0%
0.0
5.0
10.0
15.0
20.0
25.0
0
30.0
0
5
10
Time (μs)
SPHV15-C Transmission Line Pulsing(TLP) Plot
20
25
30
SPHV24-C Transmission Line Pulsing(TLP) Plot
20
20
18
18
16
16
14
14
TLP Current (A)
TLP Current (A)
15
TLP Voltage (V)
12
10
8
12
10
8
6
6
4
4
2
2
0
0
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
40
45
50
55
TLP Voltage (V)
TLP Voltage (V)
SPHV36-C Transmission Line Pulsing(TLP) Plot
16
14
TLP Current (A)
12
10
8
6
4
2
0
0
10
20
30
40
50
60
70
80
90
100
TLP Voltage (V)
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV-C Series
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max
3°C/second max
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Product Characteristics
tP
TP
Critical Zone
TL to TP
Ramp-up
Temperature
Reflow Condition
TL
T S(max)
tL
Ramp-dow
Ramp-down
Preheat
T S(min)
tS
25
time to peak temperature
Time
Ordering Information
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy, rated UL 94 V-0
Part Number
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Part Marking System
Package
Marking
SPHV12-01ETG-C
SPHV15-01ETG-C
SPHV24-01ETG-C
B5
SOD882
SPHV15-01KTG-C
SPHV24-01KTG-C
SPHV36-01KTG-C
10000
B4
SPHV36-01ETG-C
SPHV12-01KTG-C
Min. Order Qty.
B2
B6
SOD882 with
side exposed
leadframe
B2
B5
10000
B4
B6
Part Numbering System
SPHV ** – 01 x T G – C
1
B*
2
2: SPHV12-C
5: SPHV15-C
4: SPHV24-C
6: SPHV36-C
TVS Diode Arrays
(SPA® Diodes )
Voltage
Number of
Channels
Package
Bidirectional
G= Green
T= Tape & Reel
E: SOD882
K: SOD882 with side
exposed leadframe
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV-C Series
Package Dimensions — SOD882(SPHVxx-01ETG-C)
1.20mm
0.30mm
Package
0.45mm
0.70mm
Symbol
Recommended soldering pad layout (unit:mm)
SOD882
JEDEC
MO-236
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.90
1.00
1.10
0.037
0.039
0.041
B
0.50
0.60
0.70
0.022
0.024
0.026
C
0.40
0.50
0.60
0.016
0.020
0.024
0.45
D
0.018
E
0.20
0.25
0.35
0.008
0.010
0.012
F
0.45
0.50
0.55
0.018
0.020
0.022
*Some ETG packaging will look like KTG packaging
due to the differing package construction between
various suppliers.
Package Dimensions — SOD882 with side exposed leadframe(SPHVxx-01KTG-C)
A
Package
0.14
Symbol
B
Top View
Side Exposed Leadframe
C
D
1.20mm
0.30mm
a
G
0.45mm
F
0.70mm
E
b
Bottom View
d
H
c
Recommended soldering pad layout (unit:mm)
MO-236
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.90
1.00
1.10
0.037
0.039
0.043
B
0.50
0.60
0.70
0.020
0.024
0.028
C
0.90
1.00
1.10
0.037
0.039
0.043
D
0.55
0.65
0.75
0.022
0.026
0.030
E
0.40
0.50
0.60
0.016
0.020
0.024
F
0.50
0.60
0.70
0.020
0.024
0.028
G
0.20
0.25
0.30
0.008
0.010
0.012
H
0.40
0.50
0.60
0.016
0.020
0.024
0.075
0.28
SOD882 with side exposed leadframe
JEDEC
0.05 max
I
0.002 max
a
-
0.14
-
-
0.006
-
b
-
0.05
-
-
0.002
-
c
-
0.075
-
-
0.003
-
d
-
0.10
-
-
0.004
-
I
Side View
Embossed Carrier Tape & Reel Specification
Top mark and pin 1 direction
in Tape and Reel
Feeding Direction
Symbol
Millimeters
A
0.70+/-0.045
B
1.10+/-0.045
C
0.65+/-0.045
d
1.55+/-0.10
E
1.75+/-0.05
F
3.50+/-0.05
P
2.00+/-0.10
P0
4.00+/-0.10
P1
2.00+/-0.10
W
8.00 + 0.30 -0.10
1
BX
2
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are
not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
