TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV Series
SPHV Series 200W Discrete Unidirectional TVS Diode
RoHS Pb GREEN
Description
The unidirectional SPHV series is designed for use in
portable applications, LED lighting modules, automotive
applications, and low speed I/Os. It will protect sensitive
equipment from damage due to electrostatic discharge
(ESD) and other overvoltage transients.
The SPHV series can safely absorb repetitive ESD
strikes above the maximum level of the IEC 61000-4-2
international standard (Level 4, ±8kV contact discharge)
without performance degradation and safely dissipate up to
8A (SPHV12) of induced surge current (IEC 61000-4-5, 2nd
Edition tP=8/20μs) with very low clamping voltages.
Features
Pinout
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
• EFT, IEC 61000-4-4, 40A
1
(5/50ns)
• Lightning, IEC 610004-5, 2nd Edition 8A
(tP=8/20μs, SPHV12)
• Lead-free, Halogen-free,
and RoHS Compliant
• Low leakage current
Applications
Functional Block Diagram
1
Life Support Note:
• Side exposed leadframe
helps to verify
solderability (SPHVxx-KTG
series)
• AEC-Q101 qualified
(SOD882 ETG Series)
• Low clamping voltage
2
• Small SOD882 packaging
helps save board space
• LED Lighting Modules
• Mobile & Handhelds
• Portable Instrumentation
• RS232 / RS485
• General Purpose I/O
• CAN and LIN Bus
2
Not Intended for Use in Life Support or Life Saving Applications
Additional Information
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Datasheet
Resources
Samples
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV Series
Absolute Maximum Ratings
Symbol
Parameter
Value
Units
Ppk
Peak Pulse Power (tp=8/20μs)
200
W
TOP
Operating Temperature
-40 to 125
°C
TSTOR
Storage Temperature
-55 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied.
Thermal Information
Parameter
Rating
Units
Storage Temperature Range
-55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 20-40s)
260
°C
SPHV12 Electrical Characteristics (TOP=25ºC)
Parameter
Reverse Standoff Voltage
Symbol
Test Conditions
VRWM
IR≤1μA
Reverse Breakdown Voltage
VBR
IR=1mA
Leakage Current
ILEAK
Clamp Voltage1
VC
Dynamic Resistance2
Peak Pulse Current
RDYN
Diode Capacitance1
VESD
CD-GND
Typ
Max
12.0
13.3
Units
V
V
VR=12V
1.0
μA
IPP=1A, tp=8/20µs, Fwd
19.0
V
IPP=8A, tP=8/20μs, Fwd
25.0
TLP, tp=100ns, I/O to GND
Ipp
ESD Withstand Voltage1
Min
0.37
tp=8/20µs
8.0
IEC61000-4-2 (Contact Discharge)
±30
IEC61000-4-2 (Air Discharge)
±30
V
Ω
A
kV
kV
Reverse Bias=0V, f=1MHz
60
pF
Note:
1. Parameter is guaranteed by design and/or device characterization.
2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
SPHV15 Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
VRWM
IR≤1μA
Reverse Breakdown Voltage
VBR
IR=1mA
Leakage Current
ILEAK
Reverse Standoff Voltage
Clamp Voltage1
VC
Dynamic Resistance
2
Peak Pulse Current
ESD Withstand Voltage1
Diode Capacitance
1
Max
Units
15.0
V
VR=15V
1.0
μA
IPP=1A, tp=8/20µs, Fwd
22.0
V
IPP=5A, tp=8/20µs, Fwd
28.0
V
RDYN
TLP, tp=100ns, I/O to GND
Ipp
tp=8/20µs
VESD
CI/O-GND
Min
Typ
16.7
V
0.40
Ω
5.0
A
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
Reverse Bias=0V, f=1MHz
46
pF
Note:
1. Parameter is guaranteed by design and/or device characterization.
2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV Series
SPHV24 Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
Test Conditions
Min
Typ
Max
Units
VRWM
IR≤1μA
Reverse Breakdown Voltage
VBR
IR=1mA
Leakage Current
ILEAK
VR=24V
1.0
μA
IPP=1A, tp=8/20µs, Fwd
36.0
V
IPP=3A, tp=8/20µs, Fwd
50.0
Clamp Voltage1
VC
Dynamic Resistance2
Peak Pulse Current
ESD Withstand Voltage1
RDYN
TLP, tp=100ns, I/O to GND
Ipp
tp=8/20µs
VESD
Diode Capacitance1
24.0
26.7
0.56
±24
IEC61000-4-2 (Air Discharge)
±30
CI/O-GND
V
Ω
3.0
IEC61000-4-2 (Contact Discharge)
V
V
A
kV
kV
Reverse Bias=0V, f=1MHz
32
pF
Max
Units
Note:
1. Parameter is guaranteed by design and/or device characterization.
2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
SPHV36 Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Test Conditions
Min
Typ
VRWM
IR≤1μA
Reverse Breakdown Voltage
VBR
IR=1mA
Leakage Current
ILEAK
VR=36V
1.0
μA
IPP=1A, tp=8/20µs, Fwd
52.0
V
IPP=2A, tp=8/20µs, Fwd
60.0
Reverse Standoff Voltage
VC
Clamp Voltage1
Dynamic Resistance2
Peak Pulse Current
RDYN
TLP, tp=100ns, I/O to GND
Ipp
tp=8/20µs
VESD
ESD Withstand Voltage1
±15
±20
V
Ω
2.0
IEC61000-4-2 (Air Discharge)
V
V
1.28
IEC61000-4-2 (Contact Discharge)
CI/O-GND
Diode Capacitance1
36.0
40.0
A
kV
kV
Reverse Bias=0V, f=1MHz
25
pF
Note:
1. Parameter is guaranteed by design and/or device characterization.
2. Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
100
90
% of Rated Power I PP
Peak Pulse Power - Ppk (kW)
10
1
0.1
80
70
60
50
40
30
20
10
0
0.01
0.1
1
10
100
Pulse Duration - t p (µs)
1000
0
25
50
75
100
125
150
Ambient Temperature - T A (oC)
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV Series
8/20µs Pulse Waveform
SPHV12 Transmission Line Pulsing(TLP) Plot
110%
20
100%
18
90%
16
14
70%
TLP Current (A)
Percent of IPP
80%
60%
50%
40%
12
10
8
30%
6
20%
4
10%
2
0%
0.0
5.0
10.0
15.0
20.0
25.0
0
30.0
0
5
10
Time (μs)
20
20
18
18
16
16
14
14
12
10
8
10
8
6
4
4
2
2
0
5
10
15
25
12
6
0
20
SPHV24 Transmission Line Pulsing(TLP) Plot
TLP Current (A)
TLP Current (A)
SPHV15 Transmission Line Pulsing(TLP) Plot
0
15
TLP Voltage (V)
20
25
30
0
5
10
15
20
25
30
35
40
45
TLP Voltage (V)
TLP Voltage (V)
SPHV36 Transmission Line Pulsing(TLP) Plot
16
14
TLP Current (A)
12
10
8
6
4
2
0
0
10
20
30
40
50
60
70
80
90
100
TLP Voltage (V)
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV Series
Soldering Parameters
Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max
3°C/second max
TS(max) to TL - Ramp-up Rate
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
Product Characteristics
tP
TP
Temperature
Reflow Condition
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
25
time to peak temperature
Time
Ordering Information
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substrate material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
Part Number
Part Marking System
Marking
SPHV12-01ETG
SPHV15-01ETG
SPHV24-01ETG
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Package
U2
U5
SOD882
U6
SPHV12-01KTG
U2
SPHV24-01KTG
SPHV36-01KTG
10000
U4
SPHV36-01ETG
SPHV15-01KTG
Min. Order Qty.
SOD882 with
side exposed
leadframe
U5
10000
U4
U6
Part Numbering System
SPHV ** – 01 x T G
1
U*
2
2: SPHV12
5: SPHV15
4: SPHV24
6: SPHV36
G= Green
TVS Diode Arrays
(SPA® Diodes )
Voltage
Number of
Channels
T= Tape & Reel
Package
E: SOD882
K: SOD882 with side
exposed leadframe
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
TVS Diode Array (SPA® Diodes)
General Purpose ESD Protection - SPHV Series
Package Dimensions — SOD882(SPHVxx-01ETG)
Cathode by marking
Package
Symbol
A
0.325
0.325
SOD882
JEDEC
MO-236
Millimeters
Typ
Max
Min
Typ
Max
0.90
1.00
1.10
0.037
0.039
0.041
B
0.50
0.60
0.70
0.022
0.024
0.026
C
0.40
0.50
0.60
0.016
0.020
0.024
0.45
D
0.650
Inches
Min
0.018
0.650
E
0.20
0.25
0.35
0.008
0.010
0.012
0.975
F
0.45
0.50
0.55
0.018
0.020
0.022
Recommended Soldering Pad Layout
*Some ETG packaging will look like KTG packaging
due to the differing package construction between
various suppliers.
Package Dimensions — SOD882 with side exposed leadframe(SPHVxx-01KTG)
Cathode by marking
Package
A
0.14
Symbol
B
0.075
0.28
Top View
Side Exposed Leadframe
C
D
1.40
0.975
0.30
0.325
a
E
F
0.650
0.60
G
0.325
0.55
Bottom View
Recommended Soldering Pad Layout
d
H
c
MO-236
Millimeters
Inches
Min
Typ
Max
Min
Typ
Max
A
0.90
1.00
1.10
0.037
0.039
0.043
B
0.50
0.60
0.70
0.020
0.024
0.028
C
0.90
1.00
1.10
0.037
0.039
0.043
D
0.55
0.65
0.75
0.022
0.026
0.030
E
0.40
0.50
0.60
0.016
0.020
0.024
F
0.50
0.60
0.70
0.020
0.024
0.028
G
0.20
0.25
0.30
0.008
0.010
0.012
H
0.40
0.50
0.60
0.016
0.020
0.024
0.05 max
I
b
SOD882 with side exposed leadframe
JEDEC
0.002 max
a
-
0.14
-
-
0.006
-
b
-
0.04
-
-
0.002
-
c
-
0.075
-
-
0.003
-
d
-
0.10
-
-
0.004
-
I
Side View
Embossed Carrier Tape & Reel Specification
Symbol
Millimeters
A
0.70+/-0.045
B
1.10+/-0.045
C
0.65+/-0.045
d
1.55+/-0.10
E
1.75+/-0.05
F
3.50+/-0.05
P
2.00+/-0.10
P0
4.00+/-0.10
P1
2.00+/-0.10
W
8.00 + 0.30 -0.10
Top mark and pin 1 direction
in Tape and Reel
Feeding Direction
1
UX
2
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are
not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 09/24/19
